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公开(公告)号:US20230217593A1
公开(公告)日:2023-07-06
申请号:US17927797
申请日:2021-05-26
Applicant: LG INNOTEK CO., LTD.
Inventor: Il Sik NAM , Dong Keun LEE , Hye Jin JO
IPC: H05K1/11 , H01L21/48 , H01L23/00 , H01L23/498 , H05K1/18 , H05K1/02 , H05K3/34 , H05K3/40 , H05K3/46
CPC classification number: H05K1/115 , H01L21/486 , H01L24/11 , H01L24/16 , H01L24/81 , H01L23/49827 , H05K1/186 , H05K1/0271 , H05K3/3415 , H05K3/4007 , H05K3/4697 , H01L2224/16227 , H01L2224/81192 , H01L2224/81815 , H01L2224/11462 , H01L2224/11912 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10166 , H05K2201/10545 , H05K2203/0723
Abstract: A package substrate according to an embodiment includes an insulating layer; a first outer circuit pattern disposed on an upper surface of the insulating layer; a second outer circuit pattern disposed under a lower surface of the insulating layer; a first connection portion disposed on an upper surface of a first-first circuit pattern of the first outer circuit pattern; a first contact portion disposed on the first connection portion; a first device disposed on the first connection portion through the first contact portion; a second contact portion disposed under a lower surface of a second-first circuit pattern of the second outer circuit pattern; a second device attached to the second-first circuit pattern through the second contact portion; and a second connection portion disposed under a lower surface of a second-second circuit pattern of the second outer circuit pattern; wherein the first connection portion is disposed with a first width and a first interval, and wherein the second connection portion is disposed with a second width greater than the first width and a second interval greater than the first interval.
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公开(公告)号:US11690165B2
公开(公告)日:2023-06-27
申请号:US17720171
申请日:2022-04-13
Applicant: Intel Corporation
Inventor: Michael J. Hill , Huong T. Do , Anne Augustine
IPC: H05K1/00 , H05K1/02 , H05K1/16 , H01L23/367 , H01L23/498 , H01F27/28 , H01F41/04 , H01L21/48 , H05K1/18
CPC classification number: H05K1/0204 , H01F27/2804 , H01F41/041 , H01L21/486 , H01L21/4857 , H01L23/367 , H01L23/49827 , H01L23/49838 , H05K1/165 , H05K1/181 , H01F2027/2809 , H05K2201/09672 , H05K2201/1003 , H05K2201/10166 , H05K2201/10515 , H05K2201/10734
Abstract: Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a surface of the substrate. One or more thermal interconnect structures are on the surface of the inductor. A conductive feature is embedded within a board, where a surface of the conductive feature is substantially coplanar with a surface of the board. One or more thermal interconnect structures are on the surface of the conductive feature of the board, where the thermal interconnect structures provide a thermal pathway for cooling for the inductor.
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公开(公告)号:US11689082B2
公开(公告)日:2023-06-27
申请号:US17885333
申请日:2022-08-10
Applicant: Black & Decker Inc.
Inventor: Madhur M. Purohit , Joshua M. Lewis , Marcell E. Coates , Michael D. Grove , Victor A. Dorado
IPC: H02K11/215 , B25F5/00 , H02K9/22 , H02K11/33 , B25F5/02 , H02K5/08 , H02K5/22 , H02K7/14 , H05K1/02 , H05K1/11 , H05K1/18 , H05K5/00 , H05K7/20 , H05K3/28 , H05K5/02 , H05K5/06 , H05K7/14 , H02K29/08
CPC classification number: H02K11/215 , B25F5/008 , B25F5/02 , H02K5/08 , H02K5/22 , H02K5/225 , H02K7/145 , H02K9/22 , H02K9/227 , H02K11/33 , H05K1/0203 , H05K1/115 , H05K1/181 , H05K3/284 , H05K5/0073 , H05K5/0247 , H05K5/061 , H05K7/1427 , H05K7/209 , H05K7/2039 , H02K9/223 , H02K29/08 , H02K2203/03 , H02K2211/03 , H05K5/0086 , H05K2201/066 , H05K2201/09018 , H05K2201/09036 , H05K2201/10053 , H05K2201/10151 , H05K2201/10166 , H05K2201/10522
Abstract: A power tool including an electric motor is provided. The tool includes a substantially disc-shaped printed circuit board (PCB), power switches mounted on the PCB; magnetic sensors mounted on the PCB facing the motor; a heat sink in thermal communication with the power switches disposed between the PCB and the electric motor; and a molded casing structurally securing the heat sink relative to the PCB. The molded casing includes a center opening, at least one first opening provided at a first radial distance from the center opening arranged to receive the magnetic sensors therein, and at least one second opening provided at a second radial distance from the center opening arranged to securely receive the heat sink therein.
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24.
公开(公告)号:US20230164911A1
公开(公告)日:2023-05-25
申请号:US17989228
申请日:2022-11-17
Applicant: Infineon Technologies AG
Inventor: Mahadi-Ul HASSAN , Petteri PALM , Thomas GEBHARD
CPC classification number: H05K1/0259 , H05K3/4655 , H05K1/185 , H05K2201/10166
Abstract: A printed circuit board and method of manufacturing a printed circuit board are disclosed. In one example, the method comprises embedding an electronic component in a laminate, and protecting the electronic component against electrostatic discharge during at least part of the manufacturing process by an electrically conductive electrostatic discharge protection structure integrated in the laminate and connected to the electronic component.
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公开(公告)号:US20230145004A1
公开(公告)日:2023-05-11
申请号:US18050636
申请日:2022-10-28
Applicant: IBIDEN CO., LTD.
Inventor: Toshiki FURUTANI
CPC classification number: H05K1/113 , H05K1/024 , H05K2201/10166 , H05K2201/09563
Abstract: A wiring substrate includes a first insulating layer, a conductor layer including first and second pads, a second insulating layer having first openings exposing the first pads and a second opening exposing the second pads, metal posts formed on the first pads and filling the first openings, and a wiring structure positioned in the second opening and having first and second connection pads such that the second connection pads are connected to the second pads. The upper surfaces of the first connection pads and the upper surfaces of the metal posts form a component mounting surface having first, second and third regions, the first connection pads are formed in the first, second and third regions and include a group of first connection pads formed in the first and second regions and electrically connected and a group of first connection pads formed in the first and third regions and electrically connected.
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26.
公开(公告)号:US20230142725A1
公开(公告)日:2023-05-11
申请号:US18054946
申请日:2022-11-14
Applicant: IDENERGIE INC
Inventor: Handy FORTIN-BLANCHETTE , Pierre BLANCHET
CPC classification number: H05K1/181 , H05K1/11 , H05K1/0204 , H05K2201/10409 , H05K2201/10166 , H05K2201/066
Abstract: A printed circuit board comprises N power switching cells operating in parallel and respectively comprising a transistor leg, at least one decoupling capacitor and a gate driver circuit. Each transistor leg comprises respective first and second transistors in series, a drain of the first transistor being connected to a positive DC line, a source of the second transistor being connected to a negative DC line, a source of the first transistor being connected to a drain of the second through a connection middle-point connected to an output terminal. Each gate driver circuit controls respective switching ON and OFF of the corresponding first and second transistors. The N transistor legs of the corresponding N power switching cells are positioned to substantially form a convex polygon having N edges of substantially the same length, each one of the N transistor legs being positioned along one of the edges of the convex polygon.
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公开(公告)号:US20190219859A1
公开(公告)日:2019-07-18
申请号:US16227360
申请日:2018-12-20
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Hajime Kimura , Shunpei YAMAZAKI
IPC: G02F1/1345 , H01L27/12 , G09G3/20 , G02F1/1368 , H05K1/11 , H05K3/36 , G02F1/1341 , H05K1/14 , G02F1/1339 , G02F1/1335 , G02F1/1333 , G02F1/133
CPC classification number: G02F1/13452 , G02F1/13306 , G02F1/133345 , G02F1/133512 , G02F1/133514 , G02F1/1339 , G02F1/13394 , G02F1/1341 , G02F1/1368 , G09G3/20 , G09G3/2092 , G09G3/3614 , G09G2300/0408 , G09G2300/0426 , G09G2300/0439 , G09G2300/08 , G09G2310/0264 , G09G2320/043 , G09G2330/021 , G09G2330/08 , H01L27/1222 , H01L2924/0002 , H05K1/0263 , H05K1/0265 , H05K1/117 , H05K1/148 , H05K3/361 , H05K2201/094 , H05K2201/09727 , H05K2201/10136 , H05K2201/10166 , H01L2924/00
Abstract: An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.
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公开(公告)号:US20190192037A1
公开(公告)日:2019-06-27
申请号:US16292609
申请日:2019-03-05
Applicant: North Inc.
Inventor: Cezar Morun , Stephen Lake
IPC: A61B5/0492 , H05K1/16
CPC classification number: A61B5/0492 , H05K1/162 , H05K1/167 , H05K2201/10151 , H05K2201/10166 , Y10T29/4913
Abstract: Systems, articles, and methods for surface electromyography (“EMG”) sensors that combine elements from traditional capacitive and resistive EMG sensors are described. For example, capacitive EMG sensors that are adapted to resistively couple to a user's skin are described. Resistive coupling between a sensor electrode and the user's skin is galvanically isolated from the sensor circuitry by a discrete component capacitor included downstream from the sensor electrode. The combination of a resistively coupled electrode and a discrete component capacitor provides the respective benefits of traditional resistive and capacitive (respectively) EMG sensor designs while mitigating respective drawbacks of each approach. A wearable EMG device that provides a component of a human-electronics interface and incorporates such capacitive EMG sensors is also described.
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公开(公告)号:US20190190351A1
公开(公告)日:2019-06-20
申请号:US15846723
申请日:2017-12-19
Applicant: TTI (MACAO COMMERCIAL OFFSHORE) LIMITED
Inventor: Brent N. Gregorich , Michael Romano , Justin Clack , Ronald C. McCurry , Julia H. Moylan
CPC classification number: H02K9/22 , H02K5/18 , H02K5/20 , H02K5/225 , H02K7/14 , H02K9/04 , H02K9/06 , H02K11/0094 , H02K11/33 , H02K2211/03 , H05K1/0203 , H05K1/181 , H05K2201/10166
Abstract: A power tool includes a housing and an electric motor assembly supported in the housing. The electric motor assembly includes a stator core and a circuit board proximate an end of the stator core. The circuit board includes a heat-generating component facing away from the stator core. The electric motor assembly also includes an end cap coupled to the stator core and in thermal contact with the heat-generating component as a heat sink to remove thermal energy from the heat-generating component.
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公开(公告)号:US20190045635A1
公开(公告)日:2019-02-07
申请号:US15759604
申请日:2016-08-30
Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMOT WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor: Tou Chin , Arinobu NAKAMURA
CPC classification number: H05K1/186 , H02G3/03 , H02G3/16 , H05K1/0203 , H05K3/3452 , H05K3/3494 , H05K7/1432 , H05K2201/066 , H05K2201/10166 , H05K2201/10272 , H05K2201/10409
Abstract: A circuit assembly includes a circuit board provided with a connection opening, a plurality of busbars provided on a back surface of the circuit board, an electronic component provided with connection terminals that are soldered to the corresponding busbar exposed through the connection opening, and a solder restricting layer that is provided between the circuit board and the plurality of busbars and includes a pattern surrounding a soldering region of the busbar to which the connection terminals are soldered.
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