公开(公告)号：US11882659B2

公开(公告)日：2024-01-23

申请号：US17505730

申请日：2021-10-20

Applicant: Raytheon Company

Inventor： Thomas Sprafke ,  Stephen Marinsek

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/18 ,  H05K3/32 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/09036 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10378

Abstract: A chip substrate includes a base substrate having a plurality of base circuit traces mounted thereon for supporting a chip assembly and an intermediate substrate mounted on the base substrate adjacent the plurality of base circuit traces. The intermediate substrate has a plurality of intermediate circuit traces mounted thereon. Each of the plurality of intermediate circuit traces are wirebonded to a respective one of the plurality of base circuit traces and the plurality of intermediate circuit traces are configured to be electrically coupled to an external device. For example, each of the plurality of intermediate circuit traces may be wirebonded to a respective one of a plurality of feedthrough circuit traces mounted on a feedthrough device.

公开(公告)号：US11876323B2

公开(公告)日：2024-01-16

申请号：US17526977

申请日：2021-11-15

Applicant: QUANTA COMPUTER INC.

Inventor： Yaw-Tzorng Tsorng ,  Jen-Jia Liou ,  Chun-Chen Hsu

IPC: H01R13/631 ,  H05K7/14 ,  H01R12/71 ,  H05K1/18 ,  H01R12/70

CPC classification number: H01R13/631 ,  H05K7/1487 ,  H01R12/7088 ,  H01R12/716 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: A power supply assembly includes a power supply unit disposed within a housing and an adjustable plate module movably disposed on a floor thereof. The adjustable plate module includes a plate, a shaft, a stopper panel, and a compressible device. The plate has two planar surfaces positioned at different heights with respect to the floor. The shaft is fixedly coupled to and extends outwardly from the plate. The shaft is configured to move between a first position and a second position to transition a connector between the planar surfaces. The stopper panel is disposed adjacent to a distal end of the shaft and has an opening therein for accommodating the shaft. The compressible device is disposed around the shaft such that a displacement of the plate causes the compressible device to compress against the stopper panel and facilitate movement of the shaft from the first position to the second position.

公开(公告)号：US11855766B2

公开(公告)日：2023-12-26

申请号：US17733086

申请日：2022-04-29

Applicant: Intel Corporation

Inventor： Francesc Guim Bernat ,  Susanne M. Balle ,  Rahul Khanna ,  Sujoy Sen ,  Karthik Kumar

IPC: H04L43/08 ,  G06F16/901 ,  H04B10/25 ,  G02B6/38 ,  G02B6/42 ,  G02B6/44 ,  G06F1/18 ,  G06F1/20 ,  G06F3/06 ,  G06F8/65 ,  G06F9/30 ,  G06F9/4401 ,  G06F9/54 ,  G06F12/109 ,  G06F12/14 ,  G06F13/16 ,  G06F13/40 ,  G08C17/02 ,  G11C5/02 ,  G11C7/10 ,  G11C11/56 ,  G11C14/00 ,  H03M7/30 ,  H03M7/40 ,  H04L41/14 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/356 ,  H04L49/45 ,  H04L67/02 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/00 ,  H05K7/14 ,  G06F15/16 ,  G06F9/38 ,  G06F9/50 ,  H04L41/12 ,  H04L41/5019 ,  H04L43/16 ,  H04L47/24 ,  H04L47/38 ,  H04L67/1004 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H05K5/02 ,  H04W4/80 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  H04L43/065 ,  H04L61/00 ,  H04L67/51 ,  H04J14/00 ,  H04L41/147 ,  H04L67/1008 ,  H04L41/0813 ,  H04L67/1029 ,  H04L41/0896 ,  H04L47/70 ,  H04L47/78 ,  H04L41/082 ,  H04L67/00 ,  H04L67/1012 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L49/55 ,  H04L67/10 ,  H04W4/02 ,  H04L45/02 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L47/80 ,  H05K1/02 ,  H04L45/52 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L47/765 ,  H04L67/1014 ,  G06F12/10 ,  G06Q10/06 ,  G06Q10/0631 ,  G07C5/00 ,  H04L12/28 ,  H04L41/02 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L41/046 ,  H04L49/15

CPC classification number: H04L43/08 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G06F1/183 ,  G06F1/20 ,  G06F3/064 ,  G06F3/0613 ,  G06F3/0625 ,  G06F3/0653 ,  G06F3/0655 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/30036 ,  G06F9/4401 ,  G06F9/544 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/1668 ,  G06F13/409 ,  G06F13/4022 ,  G06F13/4068 ,  G06F15/161 ,  G06F16/9014 ,  G08C17/02 ,  G11C5/02 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/3086 ,  H03M7/4056 ,  H03M7/4081 ,  H04B10/25891 ,  H04L41/145 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L67/02 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/0003 ,  H05K7/1442 ,  B25J15/0014 ,  B65G1/0492 ,  G05D23/1921 ,  G05D23/2039 ,  G06F3/061 ,  G06F3/067 ,  G06F3/0611 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/0647 ,  G06F3/0658 ,  G06F3/0659 ,  G06F9/3887 ,  G06F9/505 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/5072 ,  G06F9/5077 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F13/161 ,  G06F13/1694 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C2200/00 ,  G11C5/06 ,  H03M7/30 ,  H03M7/3084 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04J14/00 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L41/024 ,  H04L41/046 ,  H04L41/082 ,  H04L41/0813 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/38 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/15 ,  H04L49/555 ,  H04L61/00 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/34 ,  H04L67/51 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0005 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y02D10/00 ,  Y02P90/30 ,  Y04S10/50 ,  Y04S10/52 ,  Y10S901/01

Abstract: Technologies for dynamically managing resources in disaggregated accelerators include an accelerator. The accelerator includes acceleration circuitry with multiple logic portions, each capable of executing a different workload. Additionally, the accelerator includes communication circuitry to receive a workload to be executed by a logic portion of the accelerator and a dynamic resource allocation logic unit to identify a resource utilization threshold associated with one or more shared resources of the accelerator to be used by a logic portion in the execution of the workload, limit, as a function of the resource utilization threshold, the utilization of the one or more shared resources by the logic portion as the logic portion executes the workload, and subsequently adjust the resource utilization threshold as the workload is executed. Other embodiments are also described and claimed.

公开(公告)号：US20230413423A1

公开(公告)日：2023-12-21

申请号：US17844005

申请日：2022-06-19

Applicant: Shuang Jin

Inventor： Shuang Jin

IPC: H05K1/02 ,  H05K1/11 ,  H01R12/71 ,  H01R12/72

CPC classification number: H05K1/0245 ,  H05K1/111 ,  H05K1/115 ,  H01R12/716 ,  H01R12/724 ,  H05K2201/10189

Abstract: Two OSFP transceivers' connectors' footprints are placed on the opposite sides of a PCB board. The two footprints are aligned in a special way and the connections among the high speed signals' pads of the two footprints are specially defined. Based on that, the high speed signals' pads of the two footprints are connected through PCB traces and vias. Two OSFP electrical connectors are soldered onto the two footprints. So the electrical high-speed signals coming from two OSFP transceivers are directly connected in the shortest way when the two transceivers are respectively plugged into the two OSFP connectors.

公开(公告)号：US20230411882A1

公开(公告)日：2023-12-21

申请号：US18087198

申请日：2022-12-22

Applicant: SMART Modular Technologies, Inc.

Inventor： JINYING SHEN ,  KWANG JIN GOOI

IPC: H01R12/73 ,  H01R25/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01R12/737 ,  H01R25/006 ,  H05K1/0278 ,  H05K1/189 ,  H05K2201/10189 ,  H05K1/117

Abstract: A single-slot peripheral component interconnect express (PCIe) card with expanded memory is provided. Embodiments described herein use two rigid circuit boards which are oriented perpendicular to each other. The two rigid circuit boards are connected by a flexible cable, which can be sandwiched between the laminates of the rigid boards. The flexible cable further provides high-speed signal connection and high-power connection between the two rigid boards. In addition, the two rigid boards can be secured by two mechanical retainers. This approach enables a PCIe card to have three or more (e.g., four) dual in-line memory modules (DIMMs) while meeting the PCIe standard for single slot primary side height by placing the DIMM sockets horizontally, thus lowering the overall height of the PCIe card.

公开(公告)号：US11838113B2

公开(公告)日：2023-12-05

申请号：US16656009

申请日：2019-10-17

Applicant: INTEL CORPORATION

Inventor： Alberto J. Munoz ,  Murugasamy K. Nachimuthu ,  Mohan J. Kumar ,  Wojciech Powiertowski ,  Sergiu D. Ghetie ,  Neeraj S. Upasani ,  Sagar V. Dalvi ,  Chukwunenye S. Nnebe ,  Jeanne Guillory

IPC: H04L29/06 ,  H04L43/08 ,  G06F16/901 ,  H04B10/25 ,  G02B6/38 ,  G02B6/42 ,  G02B6/44 ,  G06F1/18 ,  G06F1/20 ,  G06F3/06 ,  G06F8/65 ,  G06F9/30 ,  G06F9/4401 ,  G06F9/54 ,  G06F12/109 ,  G06F12/14 ,  G06F13/16 ,  G06F13/40 ,  G08C17/02 ,  G11C5/02 ,  G11C7/10 ,  G11C11/56 ,  G11C14/00 ,  H03M7/30 ,  H03M7/40 ,  H04L41/14 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/356 ,  H04L49/45 ,  H04L67/02 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/00 ,  H05K7/14 ,  G06F15/16 ,  G06F9/38 ,  G06F9/50 ,  H04L41/12 ,  H04L41/5019 ,  H04L43/16 ,  H04L47/24 ,  H04L47/38 ,  H04L67/1004 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H05K5/02 ,  H04W4/80 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  H04L43/065 ,  H04L61/00 ,  H04L67/51 ,  H04J14/00 ,  H04L41/147 ,  H04L67/1008 ,  H04L41/0813 ,  H04L67/1029 ,  H04L41/0896 ,  H04L47/70 ,  H04L47/78 ,  H04L41/082 ,  H04L67/00 ,  H04L67/1012 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L49/55 ,  H04L67/10 ,  H04W4/02 ,  H04L45/02 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L47/80 ,  H05K1/02 ,  H04L45/52 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L47/765 ,  H04L67/1014 ,  G06F12/10 ,  G06Q10/06 ,  G06Q10/0631 ,  G07C5/00 ,  H04L12/28 ,  H04L41/02 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L41/046 ,  H04L49/15

CPC classification number: H04L43/08 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G06F1/183 ,  G06F1/20 ,  G06F3/064 ,  G06F3/0613 ,  G06F3/0625 ,  G06F3/0653 ,  G06F3/0655 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/30036 ,  G06F9/4401 ,  G06F9/544 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/1668 ,  G06F13/409 ,  G06F13/4022 ,  G06F13/4068 ,  G06F15/161 ,  G06F16/9014 ,  G08C17/02 ,  G11C5/02 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/3086 ,  H03M7/4056 ,  H03M7/4081 ,  H04B10/25891 ,  H04L41/145 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L67/02 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/0003 ,  H05K7/1442 ,  B25J15/0014 ,  B65G1/0492 ,  G05D23/1921 ,  G05D23/2039 ,  G06F3/061 ,  G06F3/067 ,  G06F3/0611 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/0647 ,  G06F3/0658 ,  G06F3/0659 ,  G06F9/3887 ,  G06F9/505 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/5072 ,  G06F9/5077 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F13/161 ,  G06F13/1694 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C2200/00 ,  G11C5/06 ,  H03M7/30 ,  H03M7/3084 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04J14/00 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L41/024 ,  H04L41/046 ,  H04L41/082 ,  H04L41/0813 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/38 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/15 ,  H04L49/555 ,  H04L61/00 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/34 ,  H04L67/51 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0005 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y02D10/00 ,  Y02P90/30 ,  Y04S10/50 ,  Y04S10/52 ,  Y10S901/01

Abstract: Embodiments are generally directed apparatuses, methods, techniques and so forth to receive a sled manifest comprising identifiers for physical resources of a sled, receive results of an authentication and validation operations performed to authenticate and validate the physical resources of the sled, determine whether the results of the authentication and validation operations indicate the physical resources are authenticate or not authenticate. Further and in response to the determination that the results indicate the physical resources are authenticated, permit the physical resources to process a workload, and in response to the determination that the results indicate the physical resources are not authenticated, prevent the physical resources from processing the workload.

公开(公告)号：US20230389182A1

公开(公告)日：2023-11-30

申请号：US17752634

申请日：2022-05-24

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Warren A. Kartadinata ,  Neil Jefferson Asmussen ,  Vance B. Murakami

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K2201/10265 ,  H05K2201/10537 ,  H05K2201/10515 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/10393

Abstract: One aspect provides an apparatus for locking circuit boards in position between a pair of guide rails. The apparatus can include a slider attached to a sidewall of one guide rail. The slider is allowed to slide along the guide rail within a predetermined range and one or more plunger-and-spring assemblies. A respective plunger-and-spring assembly comprises a plunger and a spring surrounding the plunger, and the plunger is inserted into a through-hole on the sidewall of the guide rail such that a first end of the plunger can be aligned with a notch on a corresponding circuit board and a second end of the plunger is in contact with the slider. Sliding of the slider causes the spring to compress and decompress and the first end of the plunger to move in and out of the notch on the circuit board, thereby facilitating locking and unlocking of the circuit board.

公开(公告)号：US20230371179A1

公开(公告)日：2023-11-16

申请号：US17743393

申请日：2022-05-12

Applicant: Western Digital Technologies, Inc.

Inventor： Uthayarajan A/L RASALINGAM ,  Muhammad Afif Bin Abu HUSSEIN

IPC: H05K1/11 ,  H01R12/72

CPC classification number: H05K1/117 ,  H01R12/724 ,  H01R12/721 ,  H05K2201/10189

Abstract: A lead finger has a v-shaped contact point and a u-shaped profile. The u-shaped profile includes a portion that is disposed below a top surface of a PCB. The v-shaped contact point aids in guiding a host connector clip to an ideal location of the lead finger, where the ideal location may allow for more contact surface area and better contact to the host connector clip. The u-shaped profile may reduce impact force of the host connector clip to the lead finger.

公开(公告)号：US11812563B2

公开(公告)日：2023-11-07

申请号：US17658667

申请日：2022-04-11

Applicant: MAGNA ELECTRONICS INC.

Inventor： Jens Steigerwald

IPC: H05K3/34 ,  H05K3/00 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  H05K3/30 ,  B60R1/04 ,  B60R1/12 ,  B60R16/023 ,  H01R9/05 ,  H01R43/02 ,  H04N7/10 ,  H04N7/18 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/341 ,  B60R1/04 ,  B60R1/12 ,  B60R16/023 ,  H01R9/0515 ,  H01R43/0256 ,  H04N7/10 ,  H04N7/181 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0008 ,  H05K3/303 ,  B60R2001/1253 ,  B60R2300/105 ,  B60Y2410/10 ,  B60Y2410/115 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2203/166 ,  Y02P70/50 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/53174

Abstract: A method for assembling a camera suitable for use for a vision system of a vehicle includes providing a circuit board having first and second sides separated by a thickness dimension of the circuit board. An imager is disposed at the first side of the circuit board and solder pads are disposed at the second side of the circuit board. The solder pads are in electrical connection with circuitry of the circuit board. A coaxial connector is aligned at the solder pads at the second side of the circuit board. The coaxial connector is soldered at the second side of the circuit board via melting the solder paste at the solder pads.

公开(公告)号：US20230307996A1

公开(公告)日：2023-09-28

申请号：US18327000

申请日：2023-05-31

Applicant: Nidec Motor Corporation

Inventor： Chetan O. Modi ,  Steven R. Palmer ,  Daniel E. Bailey ,  Jared Joseph Lesicko

IPC: H02K11/33 ,  H05K5/00 ,  H05K1/14 ,  H05K1/18 ,  H02K5/22 ,  H02K11/28

CPC classification number: H02K11/33 ,  H05K5/0069 ,  H05K1/144 ,  H05K1/18 ,  H02K5/225 ,  H02K11/28 ,  H02K2213/12 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10053 ,  H02K2211/03

Abstract: A motor assembly includes a motor, a controller controlling at least one aspect of operation of the motor, and a control housing defining a control chamber. The controller is in part received within the control chamber. The controller includes a main electronics board and a modular connector assembly. The modular connector assembly includes a secondary electronics board and a connector at least in part supporting the secondary electronics board. The connector includes an inner connector portion and an outer connector portion. The connector extends through the control housing such that the inner connector portion is disposed inside the control chamber and the outer connector portion is disposed outside the control chamber. The outer connector portion defines a first access portal facilitating access to a first component of the secondary electronics board.