公开(公告)号：US20180310396A1

公开(公告)日：2018-10-25

申请号：US15962207

申请日：2018-04-25

Applicant: Ryo Kobayashi ,  Tomoyoshi Kobayashi

Inventor： Ryo Kobayashi ,  Tomoyoshi Kobayashi

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K1/181 ,  H05K1/184 ,  H05K7/20154 ,  H05K7/20409 ,  H05K7/20445 ,  H05K7/20918 ,  H05K2201/066 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2201/10628

Abstract: A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.

公开(公告)号：US09936589B2

公开(公告)日：2018-04-03

申请号：US15055859

申请日：2016-02-29

Applicant: Presidio Components. Inc.

Inventor： Hung Van Trinh

IPC: B23K31/02 ,  H05K3/34 ,  H01G2/06 ,  B23K1/00 ,  B23K35/26 ,  C22C13/00

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K35/262 ,  C22C13/00 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/498 ,  H01L23/562 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10787 ,  H05K2203/047 ,  H05K2203/1173 ,  H05K2203/1377 ,  Y02P70/613

Abstract: An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

公开(公告)号：US20180042111A1

公开(公告)日：2018-02-08

申请号：US15231438

申请日：2016-08-08

Applicant: BAKER HUGHES INCORPORATED

Inventor： Rocco DIFOGGIO ,  Otto N. FANINI ,  Paul G. CAIRNS ,  Brian D. BREAUX ,  Benjamin TODD

IPC: H05K1/18 ,  G01V3/18 ,  E21B49/00 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  B23K1/0056 ,  B23K26/18 ,  B33Y10/00 ,  E21B47/011 ,  E21B49/00 ,  G01V3/18 ,  H05K1/113 ,  H05K3/325 ,  H05K3/341 ,  H05K2201/10151 ,  H05K2201/10257 ,  H05K2201/10295 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10628 ,  H05K2203/107

Abstract: Methods, systems, devices, and products for manufacturing an electrical assembly, such as a completed downhole circuit board, for use in well logging. Methods include attaching an electrical component to a printed circuit board by mechanically fastening the electrical component to the printed circuit board. Methods may include using a laser to attach a plurality of legs to contact surfaces. Methods may include applying light from the laser to a material of the printed circuit board to produce heat, including mitigating reflection of the light from the material. Methods include forming a connection between a first electrical component of the electrical assembly and a second electrical component of the electrical assembly by causing heating of an additive manufacturing material by applying light from a laser. The connection may be at least one of: i) an electrical connection; ii) a structural connection; iii) an electrical insulation.

公开(公告)号：US20170374731A1

公开(公告)日：2017-12-28

申请号：US15526861

申请日：2016-06-16

Applicant: Reginald SIMPSON ,  Ronald NEHRING ,  Mokhtar ROUABHI

Inventor： Reginald SIMPSON ,  Ronald NEHRING ,  Mokhtar ROUABHI

IPC: H05K1/02 ,  H03F1/30 ,  H03F3/213 ,  H03F3/195

CPC classification number: H05K1/0203 ,  H01L23/66 ,  H01L2223/6644 ,  H03F1/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H05K1/0243 ,  H05K3/325 ,  H05K3/3405 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/10969

Abstract: Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14) with a gate contact surface, a drain lead (13) with a drain contact surface and a source contact surface (15) having a length and width. An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.

公开(公告)号：US09851763B1

公开(公告)日：2017-12-26

申请号：US14040924

申请日：2013-09-30

Applicant: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration

Inventor： David J. Petrick ,  Alessandro Geist ,  Michael R. Lin ,  Gary R. Crum

IPC: H05K1/18 ,  G06F1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: G06F1/185 ,  G06F1/189 ,  H02H3/087 ,  H02J1/00 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10628 ,  Y02P70/611

Abstract: A single board computer system radiation hardened for space flight includes a printed circuit board having a top side and bottom side; a reconfigurable field programmable gate array (FPGA) processor device disposed on the top side; a connector disposed on the top side; a plurality of peripheral components mounted on the bottom side; and wherein a size of the single board computer system is not greater than approximately 7 cm×7 cm.

公开(公告)号：US20170359895A1

公开(公告)日：2017-12-14

申请号：US15617082

申请日：2017-06-08

Applicant: DENSO CORPORATION

Inventor： Kenji OCHI

IPC: H05K1/09 ,  H05K5/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/092 ,  H05K1/111 ,  H05K1/181 ,  H05K5/0069 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10636

Abstract: A printed substrate includes a land that is to be soldered. The land includes a plating film that defines a surface of the land. The plating film includes a metal as a main constituent and a pi-acceptor molecule that is dispersed in the plating film. The pi-acceptor molecule has pi-acceptability and causes ligand field splitting equal to or greater than that of 2,2′-bipyridyl in spectrochemical series. A content of the pi-acceptor molecule in the plating film is equal to or greater than 0.1 weight percent, in terms of carbon atoms, with respect to the metal of the plating film.

公开(公告)号：US20170202088A1

公开(公告)日：2017-07-13

申请号：US15326870

申请日：2015-07-01

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd ,  Sumitomo Electric Industries, Ltd.

Inventor： Arinobu Nakamura

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

公开(公告)号：US09578744B2

公开(公告)日：2017-02-21

申请号：US14579902

申请日：2014-12-22

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

Abstract translation: 本公开的实施例涉及具有形成在引线的外表面中的凹部的引线框封装。 这些凹部填充有诸如焊料的填充材料。 凹槽中的填充材料提供用于填充材料（例如焊料）的可润湿表面，以在将包装安装到诸如印刷电路板（PCB）的另一装置时粘附。 这使得封装引线与PCB之间能够实现强焊点。 它还可以在安装包装后改善焊点的目视检查。

公开(公告)号：US20150305191A1

公开(公告)日：2015-10-22

申请号：US14256108

申请日：2014-04-18

Applicant: Raytheon Company

Inventor： Cary C. Kyhl ,  Scott M. Heston ,  James M. Elliott

IPC: H05K7/20 ,  H05K3/32

CPC classification number: H05K7/2039 ,  H01L2224/73253 ,  H01L2924/16195 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/1056 ,  H05K2201/10628 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装器件可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。

公开(公告)号：US08482934B2

公开(公告)日：2013-07-09

申请号：US13011140

申请日：2011-01-21

Applicant: Don A. Gilliland ,  David B. Johnson ,  Dennis J. Wurth

Inventor： Don A. Gilliland ,  David B. Johnson ,  Dennis J. Wurth

IPC: H05K7/02

CPC classification number: H05K3/222 ,  H01G2/065 ,  H05K1/0231 ,  H05K1/025 ,  H05K2201/10628 ,  Y10T29/49002

Abstract: A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure.

Abstract translation: 提供了一种实现具有对称参考平衡的表面贴装元件的方法和结构。 在表面安装器件（SMD）封装中接收第一参考和输入信号，并且第二参考信号被接收并且输出信号从SMD封装输出。 电容器结构在SMD封装内定义在第一个参考和第二个参考之间。 电容器结构包括在第一参考和第二参考之间的平衡阻抗结构。 连接在接收的输入信号和输出信号之间的分量通常位于电容器结构内。