公开(公告)号：US20180033552A1

公开(公告)日：2018-02-01

申请号：US15728183

申请日：2017-10-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Hwa LEE ,  Doo Young KIM ,  Hai Joon LEE ,  Jin Man JUNG

IPC: H01G2/06 ,  H01G4/30 ,  H01G4/232 ,  H05K3/00 ,  H05K1/18 ,  H01G4/012

CPC classification number: H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H05K1/185 ,  H05K3/0035 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≦tc≦20 μm may be satisfied.

公开(公告)号：US09877391B2

公开(公告)日：2018-01-23

申请号：US15052813

申请日：2016-02-24

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Masaya Hirashima ,  Takahiro Sakaguchi

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/02 ,  H05K13/00

CPC classification number: H05K1/14 ,  H05K1/028 ,  H05K1/111 ,  H05K3/363 ,  H05K13/00 ,  H05K2201/04 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/167 ,  Y02P70/611

Abstract: According to one embodiment, a electronic module includes a circuit board including an electronic component mounted thereon, a flexible conducting member including a conductor including a portion covered with a covering member and a portion exposed from an edge of the covering member and soldered to the circuit board, and an engagement member engaging with the flexible conducting member to place the engaged flexible conducting member in a predetermined position on the circuit board and is attached to the circuit board by an attachment method the same as a method of mounting the electronic component on the circuit board.

公开(公告)号：US20180020549A1

公开(公告)日：2018-01-18

申请号：US15646086

申请日：2017-07-10

Applicant: ROHM CO., LTD.

Inventor： Motohiro TOYONAGA ,  Yasuhiro FUWA ,  Mamoru YAMAGAMI ,  Isamu NISHIMURA

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/31 ,  H05K1/11 ,  H05K3/00 ,  H01L23/00 ,  H05K1/02 ,  H05K3/28 ,  H01L21/48 ,  H01L23/498

CPC classification number: H05K1/186 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/562 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2924/15156 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09018 ,  H05K2201/10636 ,  H05K2203/1316 ,  H01L2224/81 ,  H01L2924/014

Abstract: An electronic component includes a substrate including a first principal surface, a second principal surface positioned on a side opposite to the first principal surface, a first side surface that connects the first principal surface and the second principal surface and that extends along a first direction, a second side surface that connects the first principal surface and the second principal surface and that extends along a second direction intersecting the first direction, and a corner portion that connects the first side surface and the second side surface and that has a curved surface curved outwardly, and a chip arranged at the first principal surface of the substrate.

公开(公告)号：US20180001426A1

公开(公告)日：2018-01-04

申请号：US15613895

申请日：2017-06-05

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Masayuki SUZUKI ,  Naoko IZUMITA ,  Shunsaku YOSHIKAWA ,  Ken TACHIBANA ,  Rei FUJIMAKI ,  Hikaru NOMURA

IPC: B23K35/02 ,  B23K35/36 ,  C22C13/02 ,  C22C13/00 ,  B23K35/26 ,  H05K3/34

CPC classification number: B23K35/025 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/36 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3463 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T403/479

Abstract: Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.

公开(公告)号：US20170359895A1

公开(公告)日：2017-12-14

申请号：US15617082

申请日：2017-06-08

Applicant: DENSO CORPORATION

Inventor： Kenji OCHI

IPC: H05K1/09 ,  H05K5/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/092 ,  H05K1/111 ,  H05K1/181 ,  H05K5/0069 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10636

Abstract: A printed substrate includes a land that is to be soldered. The land includes a plating film that defines a surface of the land. The plating film includes a metal as a main constituent and a pi-acceptor molecule that is dispersed in the plating film. The pi-acceptor molecule has pi-acceptability and causes ligand field splitting equal to or greater than that of 2,2′-bipyridyl in spectrochemical series. A content of the pi-acceptor molecule in the plating film is equal to or greater than 0.1 weight percent, in terms of carbon atoms, with respect to the metal of the plating film.

公开(公告)号：US09842699B2

公开(公告)日：2017-12-12

申请号：US14818207

申请日：2015-08-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Sang Soo Park

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H05K3/34 ,  H01G2/06 ,  H01G4/012 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic capacitor may include: ceramic body including a plurality of dielectric layers and a plurality of internal electrodes, external electrodes including a connecting portion and band portion, terminal electrodes including upper and lower horizontal portion and vertical portion connecting end portion of the upper and lower horizontal portion and the conductive adhesive layers disposed to the upper surface of the band portion and upper horizontal portion.

公开(公告)号：US09839132B2

公开(公告)日：2017-12-05

申请号：US13585920

申请日：2012-08-15

Applicant: Masanori Fujidai ,  Isamu Fujimoto

Inventor： Masanori Fujidai ,  Isamu Fujimoto

IPC: H05K1/18 ,  H01L23/00 ,  H05K3/40

CPC classification number: H05K1/185 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/186 ,  H05K3/4046 ,  H05K2201/09509 ,  H05K2201/10242 ,  H05K2201/10416 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: In a component-embedded substrate, a component and wiring block units are embedded in a component-embedded layer; conductive layers are located on all surfaces of the wiring block units; the component and the wiring block units are arranged such that lower surface side conductive layers of the wiring block units and electrodes of the component contact lower surface side wiring layers; via-hole conductors are located in respective upper positions relative to upper surface side conductive layers of the wiring block units and the electrodes of the component; and upper surface side wiring layers of the component-embedded layer are thus electrically connected to upper surface side conductive layers of the wiring block units, and the electrodes of the component by the via-hole conductors.

公开(公告)号：US09826645B2

公开(公告)日：2017-11-21

申请号：US14969390

申请日：2015-12-15

Applicant: Motorola Mobility LLC

Inventor： Robert Zurek ,  Robert M Netz

IPC: H05K7/00 ,  H05K3/32 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/32 ,  H04M1/0277 ,  H05K1/181 ,  H05K3/303 ,  H05K3/3415 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: The present application provides a circuit substrate and a method of managing the placement of one or more groupings of a plurality of capacitors coupled to a circuit substrate. Each capacitor has a pair of terminals, as well as a component shape which changes as a voltage difference is selectively applied across the pair of terminals. When a voltage difference is applied across the pair of terminals, the component shape of the capacitor will contract in a first direction and expand in a second direction, where the second direction is substantially orthogonal to the first direction. When the voltage difference is removed from the pair of terminals, the component shape of the capacitor will return to an uncontracted state in the first direction and an unexpanded state in the second direction. Each of the plurality of capacitors in a particular grouping is driven by a complementary signal. The method includes arranging each of the plurality of capacitors in the particular grouping, which are positioned within a relative distance of one another that is less than or equal to a quarter wavelength of a predetermined frequency, where at least some of the plurality of capacitors in the particular grouping are positioned to exert opposite influences on the circuit substrate relative to other capacitors in the particular group, in response to the plurality of capacitors in the particular grouping being driven by the complementary signal.

公开(公告)号：US09818543B2

公开(公告)日：2017-11-14

申请号：US15252906

申请日：2016-08-31

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Mikio Tahara ,  Tomoaki Nakamura ,  Kayoko Hirayama ,  Reiko Shimoda

IPC: H01G4/00 ,  H01G4/224 ,  H01G4/30 ,  H01G4/232 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G4/232 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component includes: a chip having first and second end surfaces oriented in a direction of a first axis, first and second main surfaces oriented in a direction of a second axis orthogonal to the first axis, first and second side surfaces oriented in a direction of a third axis orthogonal to the first and second axes, and first and second external electrodes respectively covering the first and second end surfaces and each extending to the first and second main surfaces and side surfaces; a covering portion covering the chip from the first main surface toward the second main surface; and exposed portions provided to the second main surface, including regions where the first and second external electrodes are exposed without being covered with the covering portion, and being pushed out toward the first main surface along ridges connecting the first and second end surfaces and side surfaces.

公开(公告)号：US09818541B2

公开(公告)日：2017-11-14

申请号：US14630448

申请日：2015-02-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Kyoung Jin Jun ,  Dae Hyung Yun ,  Soon Ju Lee

IPC: H05K1/18 ,  H01G4/30 ,  H01G2/06 ,  H01G4/232 ,  H05K3/34 ,  H01G4/012

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic electronic component and a board having the same are provided. The multilayer ceramic electronic component includes a multilayer ceramic capacitor including external electrodes including front portions and band portions extended from the front portions, terminal electrodes respectively surrounding the front portions and portions of lower surfaces of the band portions of the external electrodes and respectively having a ‘’ shaped groove portion formed in lower portions thereof, and conductive adhesive layers connecting the external electrodes and the terminal electrodes to each other.