Abstract:
This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.
Abstract:
A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.
Abstract:
A flexible device for electrically connecting an electric component and a printed circuit board together includes a main extension direction, and the flexible electric-connection device includes a first contact region formed at one end of the flexible electric-connection device in the main extension direction, as well as a second contact region formed at the other end of the flexible electric-connection device in the main extension direction. The flexible electric-connection device includes a stiffener, or the flexible electric connection device is combined with a supporting element. The electric component is provided so as to be in direct electric contact with the flexible electric-connection device via the first contact region.
Abstract:
According to embodiments of the disclosure, a flexible device and a fabrication method thereof are provided. The flexible device has a first area and a second area, and the stiffness of a portion of the first area is greater than the stiffness of the second area. The flexible device may include a flexible substrate and a rigid element. The flexible substrate includes a first surface and a second surface opposite to each other. The second surface has a coarse structure. The surface roughness of the second surface is greater in the first area than in the second area. The rigid element is disposed on the first surface of the flexible substrate and located in the first area. The stiffness of the rigid element is greater than the stiffness of the flexible substrate. A projection area of the coarse structure on the flexible substrate overlaps an area of the rigid element.
Abstract:
An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.
Abstract:
Packaging techniques are described for fabricating a flex sensor package that includes a flex printed circuit with a flex window, an adhesive layer with an adhesive layer window, and a stiffener assembly with a stiffener window on a first side of the flex printed circuit and a semiconductor die on a second side of the flex printed circuit. In implementations, fabricating the flex sensor package includes receiving a flex printed circuit including at least one flex window, placing an adhesive layer on at least a portion of a first side of the flex printed circuit, placing a stiffener assembly on the adhesive layer, and placing at least one semiconductor die on a second side of the flex printed circuit, where an active portion of the at least one semiconductor die is aligned with the at least one flex window and the adhesive layer window.
Abstract:
According to one embodiment, a printed wiring board includes a circuit board, a ground pattern provided on the circuit board, a wiring pattern provided on the circuit board, a conductive reinforcing plate covering the ground pattern and the wiring pattern and electrically connected with the ground pattern, and an insulating portion provided between the conductive reinforcing plate and the wiring pattern.
Abstract:
A display apparatus includes a flexible display panel configured to display an image, and a bending control portion including a plurality of blocks on a rear side of the display panel, the plurality of blocks being connected to each other and rotated toward the display panel at a predetermined angle, wherein first side surfaces of the blocks are spaced part from each other at a first distance, first side surfaces of the blocks being adjacent to front surfaces of the blocks facing the display panel, wherein second side surfaces of the blocks are adjacent to each other and substantially parallel to each other, the second side surfaces of the blocks being adjacent to rear surfaces of the blocks opposite the front surfaces of the blocks, and wherein the blocks are rotatable toward the display panel with respect to a border therebetween, such that the first distance decreases.
Abstract:
Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.
Abstract:
A flexible display comprises a display panel that includes a flexible substrate and subpixels formed in a display area defined on a surface of the flexible substrate. A data driver is mounted to a data driver area defined on the surface of the flexible substrate. The flexible display can have a connector mounted to a connector area defined on the surface of the substrate. A bent portion of the flexible substrate is between the display area and the connector area and causes the connector area to be bent back towards an other surface of the flexible substrate. A system board can further be electrically connected to the connector mounted on the connector area through a cable.