Abstract:
Provided are methods for producing nanostructures and nanostructures obtained thereby. The methods include heating a certain point of a substrate dipped into a precursor solution of the nanostructures so that the nanostructures are grown in a liquid phase environment without evaporation of the precursor solution. The methods show excellent cost-effectiveness because of the lack of a need for precursor evaporation at high temperature. In addition, unlike the vapor-liquid-solid (VLS) process performed in a vapor phase, the method includes growing nanostructures in a liquid phase environment, and thus provides excellent safety and eco-friendly characteristics as well as cost-effectiveness. Further, the method includes locally heating a substrate dipped into a precursor solution merely at a point where the nanostructures are to be grown, so that the nanostructures are grown directly at a desired point of the substrate. Therefore, it is possible to grow and produce nanostructures directly in a device. As a result, unlike the conventional process, it is not necessary to assemble and integrate the nanostructures produced in a sacrificial substrate into a device.
Abstract:
In a method for producing a sensor element, a silicon nanowire having a diameter less than 50 nm is contacted via at least two points by electrodes. The nanowire and the electrodes are arranged on one plane on a substrate. Catalytically active metal nanoparticles having a diameter in the range of 0.5-50 nm are deposited on the surface of an insulating substrate and the surface and the metal nanoparticles deposited thereon are exposed to a gas flow containing a gaseous silicon component at a temperature in the range of 300-1100° C., whereupon, during a time period in the range of 10-200 minutes, a nanowire of a length in the range of 5-200 μm projecting from the substrate is formed. The nanowire projecting from the surface of the substrate is deposited in one plane with one of the contact surfaces corresponding to the surface of the insulating substrate by applying a secondary substrate, and either the nanowire deposited on the insulating substrate is contacted at two different points by electrodes or the nanowire adhering to the secondary substrate is contacted at two different points by electrodes.
Abstract:
A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.
Abstract:
We describe a method of layer-by-layer deposition of a plurality of layers of material onto the wall or walls of a channel of a microfluidic device, the method comprising: loading a tube with a series of segments of solution, a said segment of solution bearing a material to be deposited; coupling said tube to said microfluidic device; and injecting said segments of solution into said microfluidic device such that said segments of solution pass, in turn, through said channel depositing successive layers of material to perform said layer-by-layer deposition onto said wall or walls of said channel. Embodiments of the methods are particularly useful for automated surface modification of plastic, for example PDMS (Poly(dimethylsiloxane)), microchannels. We also describe methods and apparatus for forming double-emulsions.
Abstract:
Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
Abstract:
A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.
Abstract:
A three-dimensional digital microfluidic system comprises a first plate with a first electrode, a second plate with a second electrode, and a microfluidic drop in between the first and the second electrode. The electrodes are able to be actuated in sequence such that the microfluidic drop is able to be transported. A bridge plate is able to be included.
Abstract:
A device is made by forming sacrificial fibers on a substrate mold. The fibers and mold are covered with a first material. The substrate mold is removed, and the covered fibers are then removed to form channels in the first material.
Abstract:
A method for fabrication of capacitive environment sensors is provided in which the sensor elements are integrated in a CMOS structure with electronics through the use of complementary metal oxide semiconductor (CMOS) fabrication methods. Also provided are environment sensors fabricated, for example, by the method, and a measurement system using the environment sensors fabricated by the method. The described method includes etching away one of the metal layers in a CMOS chip to create a cavity. This cavity is then filled with an environment-sensitive dielectric material to form a sensing capacitor between plates formed by the metal adhesion layers or an array of contacts from other metal layers of the CMOS structure. This approach provides improved sensing capabilities in a system that is easily manufactured.
Abstract:
Microfluidic apparatus including integrated porous substrate/sensors that may be used for detecting targeted biological and chemical molecules and compounds. In one aspect, upper and lower microfluidic channels are defined in respective halves of a substrate, which are sandwiched around a porous membrane upon assembly. In other aspect, the upper and lower channels are formed such that a portion of the lower channel passes beneath a portion of the upper channel to form a cross-channel area, wherein the membrane is disposed between the two channels. In various embodiments, one or more porous membranes are disposed proximate to corresponding cross-channel areas defined by one or more upper and lower channels. The porous membrane may also have sensing characteristics, such that it produces a change in an optical and/or electronic characteristic. Accordingly, the apparatus may further include instrumentation or detection equipment to measure the changes, such as optic-based detectors and electronic instrumentation.