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公开(公告)号：US20170347444A1
公开(公告)日：2017-11-30
申请号：US15164847
申请日：2016-05-25
Applicant: MOORETEC CO.,LTD.
Inventor： YU-MIN LIN , CHIA-PIN WANG , CHIA-CHING SUNG , NA LU
CPC classification number: H05K1/028 , H05K1/0353 , H05K1/0393 , H05K3/0014 , H05K3/182 , H05K3/185 , H05K3/28 , H05K3/4635 , H05K2201/041 , H05K2201/057 , H05K2203/0709 , H05K2203/085 , H05K2203/1105 , H05K2203/1327
Abstract: The present invention provides a manufacturing method of a curved circuit board which includes the following steps. The first step is to provide a flexible substrate. The next step is to form a patterned catalyst layer on the flexible substrate. The next step is to deposit metal on the patterned catalyst layer by electroless plating to form a wiring substrate, wherein the wiring substrate includes a planar wiring structure. The last step is to place the wiring substrate into a mold having a molding surface with a three-dimensional design, and then execute a heating process to shape the planar wiring structure to a three-dimensional wiring structure, wherein the heated wiring substrate is laminated to the molding surface of the mold. The present invention further provides an electronic product using the curved circuit board.
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公开(公告)号：US20170316721A1
公开(公告)日：2017-11-02
申请号：US15632322
申请日：2017-06-24
Inventor： Fuqiang HUANG
CPC classification number: G09F9/33 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/32 , H05K2201/041 , H05K2201/10106 , H05K2201/10128
Abstract: Disclosed are an LED (Light Emitting Diode) display module and a method of fabricating the LED display module. Lamp beads in the LED display module are fixed to the surface of a linearly arranged lamp bead plate, the lamp bead plate is fixed to a driving PCB (Printed Circuit Board), the surface of the lamp bead plate is perpendicular to the surface of the driving PCB, the surface of the driving PCB is perpendicular to the surface of a glass plate, and a fixed member is fixed on a frame. The transparent glass plate with high transparency is employed as a mounting body and the driving PCB is transversely disposed on the glass plate, so that shielding of light by the driving PCB can be remarkably reduced and the transparency of the LED display module is improved.
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公开(公告)号：US09788426B2
公开(公告)日：2017-10-10
申请号：US15327476
申请日：2015-07-10
Applicant: FUJIKURA LTD. , DDK Ltd.
Inventor： Yuki Ishida , Masayuki Suzuki , Harunori Urai
CPC classification number: H05K1/115 , H01R12/77 , H01R12/78 , H01R12/88 , H05K1/111 , H05K1/113 , H05K1/117 , H05K1/144 , H05K2201/041 , H05K2201/09036 , H05K2201/09063 , H05K2201/09409
Abstract: A printed wiring board including: a first substrate on which a plurality of pads to be connected to a connector is arranged to form a front array and a rear array in two rows; a second substrate that is laminated on the first substrate and formed with first wirings connected to first pads of the front array and second wirings connected through vias to second pads of the rear array; engageable parts that are to be engaged with engagement parts of the connector; and one or more reinforcement layers that are provided at the frontward side in the connecting direction than the engageable parts of the first substrate and/or the second substrate. The wirings each have a part formed to have a constant width along the inserting direction to the connector and an expanded-width part expanded to have a wider width than the constant width in the inserting direction of the connector.
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公开(公告)号：US20170290158A1
公开(公告)日：2017-10-05
申请号：US15085080
申请日：2016-03-30
Applicant: Intel Corporation
Inventor： Jeffrey A. Pihlman , John C. Tomlin
CPC classification number: H05K1/181 , H01L23/49816 , H01L23/49833 , H01L23/50 , H01R12/727 , H05K1/0262 , H05K1/0296 , H05K1/111 , H05K1/113 , H05K1/14 , H05K1/141 , H05K1/144 , H05K3/10 , H05K3/341 , H05K3/4007 , H05K2201/041 , H05K2201/042 , H05K2201/045 , H05K2201/10037 , H05K2201/10734 , H05K2201/2036
Abstract: IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers.
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公开(公告)号：US20170238412A1
公开(公告)日：2017-08-17
申请号：US15418068
申请日：2017-01-27
Applicant: Flexterra, Inc.
Inventor： Hjalmar Edzer Ayco Huitema , Philippe Inagaki
CPC classification number: H05K1/028 , G09F9/301 , G09F21/02 , G09F21/026 , H01R23/7042 , H05K1/0281 , H05K1/14 , H05K1/142 , H05K1/189 , H05K5/0017 , H05K5/0217 , H05K5/0291 , H05K2201/029 , H05K2201/041 , H05K2201/042 , H05K2203/167
Abstract: A dynamically flexible article or device, such as an armband, includes a flexible electronic component, such as a flexible electronic display, and a flexible support structure coupled to the flexible electronic component, wherein the flexible support and the flexible electronic component are flexible along two dimensions to thereby be able to conform to a complex curved surface. The flexible support includes bending limiting structure that constrains bending of the flexible electronic component to prevent undesirable bending.
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Patent Agency Ranking
公开(公告)号：US09735221B2
公开(公告)日：2017-08-15
申请号：US15006481
申请日：2016-01-26
Applicant: Japan Display Inc.
Inventor： Toshihiko Fukuma , Norio Oku
CPC classification number: H01L27/3276 , H01L25/167 , H01L27/323 , H01L2251/5338 , H01L2924/0002 , H05K1/147 , H05K2201/041 , H05K2201/09063 , H05K2201/10128 , H01L2924/00
Abstract: The display module includes first and second FPC substrates disposed on top of each other. The first substrate has an IC mounted on it. The second FPC substrate has a cutout inside which the IC is disposed.
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公开(公告)号：US20170133152A1
公开(公告)日：2017-05-11
申请号：US15318472
申请日：2015-07-01
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Masahiko KOUCHI , Tetsuya SHIMOMURA
CPC classification number: H01F38/14 , H01F27/2804 , H01F27/365 , H01F2027/2809 , H02J7/025 , H02J50/12 , H05K1/115 , H05K1/144 , H05K1/148 , H05K1/165 , H05K3/4635 , H05K2201/041 , H05K2201/09227 , H05K2201/09536 , H05K2201/0959 , H05K2201/10098
Abstract: A printed circuit board according to an embodiment of the present invention includes, alternately, at least one insulating layer containing a synthetic resin as a main component; and a plurality of conductive layers including circuit patterns, wherein the plurality of circuit patterns of the plurality of conductive layers form a spiral pattern in plan view, and the plurality of circuit patterns are connected together via a plurality of through-holes so as to form a single closed loop in which a current flows counterclockwise or clockwise in an entirety of the spiral pattern. The conductive layers are preferably formed on both surfaces of the at least one insulating layer so as to form a pair. The spiral pattern includes a plurality of multi-row circuits arranged to form multi-rows, and a bridging circuit that connects an end portion of one multi-row circuit of one of the conductive layers to an end portion of another multi-row circuit of the other conductive layer, the other multi-row circuit being adjacent to the one multi-row circuit.
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公开(公告)号：US09635764B2
公开(公告)日：2017-04-25
申请号：US14866648
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Shipeng Qiu , Shawna Liff , Kayleen L Helms , Joshua D Heppner , Adel Elsherbini , Johanna Swan , Gary M. Barnes
CPC classification number: H05K1/189 , H05K1/0278 , H05K1/028 , H05K1/036 , H05K1/144 , H05K3/0014 , H05K3/22 , H05K3/303 , H05K3/326 , H05K3/361 , H05K2201/0133 , H05K2201/0308 , H05K2201/041 , H05K2201/047 , H05K2201/057 , H05K2201/10007 , H05K2201/10128 , H05K2203/10 , H05K2203/104 , H05K2203/105 , H05K2203/1105 , H05K2203/1194
Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.
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公开(公告)号：US20170094799A1
公开(公告)日：2017-03-30
申请号：US14866648
申请日：2015-09-25
Applicant: Shipeng Qiu , Shawna Liff , Kayleen L. Helms , Joshua D. Heppner , Adel Elsherbini , Johanna Swan , Gary M. Barnes
Inventor： Shipeng Qiu , Shawna Liff , Kayleen L. Helms , Joshua D. Heppner , Adel Elsherbini , Johanna Swan , Gary M. Barnes
CPC classification number: H05K1/189 , H05K1/0278 , H05K1/028 , H05K1/036 , H05K1/144 , H05K3/0014 , H05K3/22 , H05K3/303 , H05K3/326 , H05K3/361 , H05K2201/0133 , H05K2201/0308 , H05K2201/041 , H05K2201/047 , H05K2201/057 , H05K2201/10007 , H05K2201/10128 , H05K2203/10 , H05K2203/104 , H05K2203/105 , H05K2203/1105 , H05K2203/1194
Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.
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公开(公告)号：US09583855B2
公开(公告)日：2017-02-28
申请号：US15134839
申请日：2016-04-21
Inventor： Rubo Ying , Shounian Chen , Jinmoo Park
CPC classification number: H01R12/716 , H01R4/04 , H01R4/48 , H05K1/147 , H05K3/365 , H05K2201/041 , H05K2201/09063 , H05K2201/10106 , H05K2201/10128 , H05K2203/167
Abstract: A circuit board device is provided, including: a first circuit board having a first predetermined connection section; a second circuit board arranged opposite to the first circuit board and having a second predetermined connection section directly facing the first predetermined connection section; and a connector including a first portion and a second portion. The connecter has: a first state where the first portion is arranged at a side of the first circuit board away from the second circuit board, the second portion is arranged at a side of the second circuit board away from the first circuit board, and the first portion and the second portion cooperate with each other to press the first circuit board against the second circuit board; and a second state where the first circuit board is separated from the second circuit board.
Abstract translation: 提供一种电路板装置，包括：具有第一预定连接部分的第一电路板; 第二电路板，布置成与第一电路板相对并具有直接面对第一预定连接部分的第二预定连接部分; 以及包括第一部分和第二部分的连接器。 连接器具有第一状态，其中第一部分布置在远离第二电路板的第一电路板的一侧，第二部分布置在第二电路板的远离第一电路板的一侧，并且 第一部分和第二部分彼此配合以将第一电路板压靠第二电路板; 以及第二状态，其中第一电路板与第二电路板分离。
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