公开(公告)号：US09113556B2

公开(公告)日：2015-08-18

申请号：US14499501

申请日：2014-09-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui

IPC: H04M1/00 ,  H05K1/02 ,  H04M1/02 ,  H05K1/11 ,  H05K5/00

CPC classification number: H05K1/0237 ,  H04M1/0202 ,  H05K1/02 ,  H05K1/0221 ,  H05K1/0243 ,  H05K1/028 ,  H05K1/115 ,  H05K1/147 ,  H05K5/0026 ,  H05K2201/055 ,  H05K2201/10189

Abstract: A flexible board includes a flexible body and a linear conductor. The flexible body includes a first main surface and a second main surface. The linear conductor is provided at the flexible body so as to be located closer to the first main surface than to the second main surface. The flexible body is valley-folded along a line crossing the linear conductor such that the first main surface is located inside of the fold, and is mountain-folded along a line crossing the linear conductor such that the first main surface is outside of the fold. An average radius of curvature in an area where the flexible body is mountain-folded is greater than an average radius of curvature in an area where the flexible body is valley-folded.

Abstract translation: 柔性板包括柔性主体和线性导体。 柔性体包括第一主表面和第二主表面。 线性导体设置在柔性体上，以便比第二主表面更靠近第一主表面。 柔性体沿着与线状导体交叉的线条折叠，使得第一主表面位于折叠部的内侧，并且沿着与线状导体交叉的线成山形，使得第一主表面位于折叠的外侧 。 在弹性体折叠的区域中的平均曲率半径大于柔性体折叠的区域中的平均曲率半径。

公开(公告)号：US09103513B2

公开(公告)日：2015-08-11

申请号：US14506000

申请日：2014-10-03

Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.

Inventor： Ben Fan

IPC: F21V21/00 ,  F21S4/00 ,  F21V21/14 ,  F21K99/00 ,  F21V7/00 ,  F21V23/00 ,  H05K3/10 ,  F21Y101/02

CPC classification number: F21S4/005 ,  F21K9/90 ,  F21S4/22 ,  F21V7/0066 ,  F21V21/14 ,  F21V23/001 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/028 ,  H05K1/189 ,  H05K3/10 ,  H05K3/202 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10106 ,  Y10T29/49162

Abstract: A flexible circuit board is disclosed, including a first insulation layer, a second insulation layer and a circuit layer, wherein the first insulation layer is attached to one side of the circuit layer and the second insulation layer is attached to the other side of the circuit layer, each of the first insulation layer and the second insulation layer is provided with a foldable portion along their length, the foldable portion of the first insulation layer is corresponding in position with the foldable portion of the second insulation layer, and the circuit layer includes a set of power wires and at least one lighting wire. And a method for manufacturing the flexible circuit board, and a LED flexible strip light are also disclosed.

Abstract translation: 公开了一种柔性电路板，包括第一绝缘层，第二绝缘层和电路层，其中第一绝缘层附着到电路层的一侧，第二绝缘层附接到电路的另一侧 层，所述第一绝缘层和所述第二绝缘层中的每一个沿其长度设置有可折叠部分，所述第一绝缘层的可折叠部分与所述第二绝缘层的可折叠部分对应，并且所述电路层包括 一组电源线和至少一个照明线。 还公开了一种用于制造柔性电路板的方法和一种LED柔性条带灯。

公开(公告)号：US09095064B2

公开(公告)日：2015-07-28

申请号：US13688413

申请日：2012-11-29

Applicant: Tetsuya Oosawa ,  Naoyuki Tanaka ,  Mitsuru Honjo

Inventor： Tetsuya Oosawa ,  Naoyuki Tanaka ,  Mitsuru Honjo

IPC: H05K3/02 ,  H05K3/10 ,  G11B5/48 ,  H05K1/02 ,  H05K1/05 ,  H05K3/28

CPC classification number: H05K3/10 ,  G11B5/484 ,  G11B5/486 ,  H05K1/025 ,  H05K1/028 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/055 ,  Y10T156/1002 ,  Y10T156/1034

Abstract: A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.

Abstract translation: 在绝缘层上形成基极绝缘层，在基底绝缘层上形成写入布线迹线和读取布线迹线。 写入布线迹线和读取布线迹线形成在基底绝缘层的主体区域上，并且写入布线迹线形成在基底绝缘层的辅助区域上。 基底绝缘层沿弯曲部弯曲。 这将使写入布线轨迹位于写入布线轨迹的上方。

公开(公告)号：US20150192961A1

公开(公告)日：2015-07-09

申请号：US14348481

申请日：2013-07-15

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Weifeng Zhou

IPC: G06F1/16 ,  B32B38/00 ,  B32B38/10 ,  B32B37/18

CPC classification number: G06F1/1652 ,  B32B37/18 ,  B32B38/0012 ,  B32B38/10 ,  B32B2457/00 ,  B32B2457/20 ,  G06F1/1637 ,  H04M1/0268 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/10128 ,  Y10T156/10 ,  Y10T156/1026 ,  Y10T156/1043 ,  Y10T156/1051 ,  Y10T156/108 ,  Y10T428/24174 ,  Y10T428/24182 ,  Y10T428/24215 ,  Y10T428/24264 ,  Y10T428/24273 ,  Y10T428/24479

Abstract: A flexible substrate, a display device and a method for bonding an electronic device onto a flexible substrate are disclosed. The flexible substrate includes a base substrate, the base substrate includes a bonding portion for bonding an electronic device and an auxiliary bonding portion integrally formed with the bonding portion, the auxiliary bonding portion and the bonding portion are disposed back to back, and the bonding portion completely falls into a region where the auxiliary bonding portion is provided in an orthographic projection direction. With an auxiliary bonding portion being disposed beside the bonding portion for bonding the electronic devices such as ICs and FPCs, when bonding the electronic device onto the bonding portion, the auxiliary bonding portion can enhance the strength of the bonding portion and improve the bonding alignment precision and contact property of the electronic device, which further improves the non-defect ratio of the flexible display device and has a lower cost.

Abstract translation: 公开了柔性基板，显示装置以及将电子装置接合到柔性基板上的方法。 所述柔性基板包括基底基板，所述基底基板包括用于接合电子器件的接合部分和与所述接合部分一体形成的辅助接合部分，所述辅助接合部分和接合部分背靠背设置，并且所述接合部分 完全落入辅助接合部分沿正投影方向设置的区域。 通过在用于接合诸如IC和FPC之类的电子器件的接合部分的旁边设置辅助接合部分，当将电子器件接合到接合部分上时，辅助接合部分可以增强接合部分的强度并提高接合对准精度 和电子设备的接触特性，这进一步提高了柔性显示装置的非缺陷率并且具有较低的成本。

公开(公告)号：US20150159816A1

公开(公告)日：2015-06-11

申请号：US14413419

申请日：2013-06-28

Applicant: OSRAM GmbH

Inventor： Thomas Preuschl ,  Guenter Hoetzl ,  Peter Sachsenweger

IPC: F21K99/00 ,  F21V19/00

CPC classification number: F21K9/20 ,  F21K9/90 ,  F21V19/003 ,  F21V23/006 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/363 ,  H05K2201/042 ,  H05K2201/055 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10106 ,  Y10T29/49126

Abstract: Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and a second printed circuit board, on which at least one electronic component is arranged, wherein the second printed circuit board is fastened to the covering element and is electrically connected to the first printed circuit board.

Abstract translation: 各种实施例可以涉及包括第一印刷电路板的照明模块，其上布置有至少一个光源，至少部分地覆盖第一印刷电路板的覆盖元件和第二印刷电路板， 布置至少一个电子部件，其中第二印刷电路板被紧固到覆盖元件并与第一印刷电路板电连接。

公开(公告)号：US20150082874A1

公开(公告)日：2015-03-26

申请号：US14396099

申请日：2013-04-23

Applicant: SIEMENS HEALTHCARE DIAGNOSTICS INC.

Inventor： Jennifer A. Samproni ,  Jeffrey R. Jasperse

IPC: G01N27/02

CPC classification number: G01N27/02 ,  A61M2205/3303 ,  G01N33/4915 ,  H05K1/189 ,  H05K2201/051 ,  H05K2201/055 ,  H05K2201/10151

Abstract: A sensor assembly has a substrate with a first surface and a second surface opposite the first surface, at least one analyte sensor positioned on at least one of the first surface and the second surface of the substrate, and at least one electrical contact positioned on the substrate in electrical communication with a corresponding one of the at least one analyte sensor. The substrate is configured to define a tube having an interior surface, and an exterior surface. At least a portion of the first surface of the substrate defines the interior surface of the tube, and the at least one analyte sensor is disposed on at least one of the interior surface and the exterior surface of the tube.

Abstract translation: 传感器组件具有衬底，其具有第一表面和与第一表面相对的第二表面，至少一个分析物传感器位于衬底的第一表面和第二表面中的至少一个上，并且至少一个电触点位于 基板与所述至少一个分析物传感器中的对应的一个电通信。 衬底被配置为限定具有内表面和外表面的管。 衬底的第一表面的至少一部分限定管的内表面，并且至少一个分析物传感器设置在管的内表面和外表面中的至少一个上。

公开(公告)号：US20150029685A1

公开(公告)日：2015-01-29

申请号：US14138364

申请日：2013-12-23

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： GWUN-JIN LIN ,  CHIH-HENG CHUO ,  KUO-FU SU

IPC: H01R35/02 ,  H01R12/61

CPC classification number: H01R35/02 ,  H05K1/028 ,  H05K1/118 ,  H05K5/0226 ,  H05K2201/055 ,  H05K2201/2009 ,  Y10T29/49002

Abstract: Disclosed is a penetration and assembly structure for a flexible circuit board with a hinge assembly. With a pre-folding line formed on a pre-prepared flexible circuit board serving as a center line, a connection section of the flexible circuit board is folded to a terminal distribution section, and then, the connection section and an extended sheet are wound up in a direction towards the terminal distribution section to form the connection section into a rolled body with the extended sheet wrapped around the rolled body to provide an effect of protection. The rolled body is then inserted through a bore of a hinge assembly so that after the rolled body completely passes through the bore of the hinge assembly, the extension section of the flexible circuit board is located in the bore of the hinge assembly and the first end and the second end are respectively set at opposite ends of the bore of the hinge assembly. In other applications, a reinforcement plate is included to reinforce the terminal distribution section of the flexible circuit board.

Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组装结构。 利用形成在作为中心线的预先准备好的柔性电路板上的预折线，将柔性电路板的连接部折叠到端子分配部，然后将连接部和延伸片卷起 在朝向终端分配部分的方向上，将连接部分形成为卷绕体，其中延伸的片材缠绕在卷绕体上以提供保护效果。 然后将卷绕的主体插入通过铰链组件的孔，使得在卷绕体完全通过铰链组件的孔之后，柔性电路板的延伸部分位于铰链组件的孔中，并且第一端 并且第二端分别设置在铰链组件的孔的相对端。 在其他应用中，包括加强板以加强柔性电路板的端子分配部分。

公开(公告)号：US08913399B2

公开(公告)日：2014-12-16

申请号：US13533698

申请日：2012-06-26

Applicant: Gil Ju Jin ,  Jung Lim Park ,  Jae Yk Kim

Inventor： Gil Ju Jin ,  Jung Lim Park ,  Jae Yk Kim

IPC: H05K7/00 ,  B06B1/06 ,  H05K3/30 ,  H05K1/18 ,  A61B8/00

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: Disclosed herein are a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract translation: 这里公开了印刷电路板（PCB）和包括该电路板的探针。 探头包括换能器，具有经由面对面接触与换能器接触的图案部分的PCB以及将换能器接合到PCB的图案部分的接合构件。 PCB的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善接合 传感器和PCB之间的力。 结果，换能器可以可靠地结合到PCB，使得可以防止换能器的性能由于PCB和换能器之间的不良连接而劣化。

公开(公告)号：US20140334164A1

公开(公告)日：2014-11-13

申请号：US14271557

申请日：2014-05-07

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA

IPC: H05K1/02 ,  F21V23/00

CPC classification number: H05K1/0256 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/09727 ,  H05K2201/10106

Abstract: A wiring board includes an insulated substrate, a wiring pattern and a folded part. The insulated substrate has an elongated shape with shorter sides extending along a width direction. The wiring pattern is provided on the substrate. The wiring pattern extends between both ends in the width direction of the substrate, and has an exposed part exposed at at least one of the ends of the substrate. In the folded part, the exposed part of the wiring pattern and the substrate are integrally folded up inwardly toward an upper face side of the substrate at each of the ends of the substrate.

Abstract translation: 布线板包括绝缘基板，布线图案和折叠部分。 绝缘基板具有细长形状，其较短边沿宽度方向延伸。 布线图案设置在基板上。 布线图案在基板的宽度方向上的两端之间延伸，并且在基板的至少一个端部具有暴露部分。 在折叠部分中，布线图案和基板的暴露部分在基板的每个端部向内朝向基板的上表面侧一体地折叠。

公开(公告)号：US08859909B2

公开(公告)日：2014-10-14

申请号：US13410857

申请日：2012-03-02

Applicant: Gary Dimmock

Inventor： Gary Dimmock

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/028 ,  H01M2/1016 ,  H01M2/1061 ,  H01M2/1077 ,  H01M2/202 ,  H01M2/22 ,  H01M2/266 ,  H01M10/486 ,  H05K1/118 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10151

Abstract: A flexible cable with a substrate divided into at least two sections is disclosed. The first section includes a first electrically conductive track and a first attach pad, while the section includes a second and third electrically conductive tracks, as well as a second attach pad. The first section is disposed on the second section to align the attach pads and connect the first electrically conductive track to the third electrically conductive track. The resulting flexible cable can be used with a low profile electrical device.

Abstract translation: 公开了一种具有分为至少两个部分的基板的柔性电缆。 第一部分包括第一导电轨道和第一附接垫，而该部分包括第二和第三导电轨道以及第二附接垫。 第一部分设置在第二部分上以对准附接垫并将第一导电轨道连接到第三导电轨道。 所得到的柔性电缆可以与低调的电气设备一起使用。