公开(公告)号：US20180271488A1

公开(公告)日：2018-09-27

申请号：US15922107

申请日：2018-03-15

Applicant: Seiko Epson Corporation

Inventor： Kazuki YOSHIDA

IPC: A61B8/00 ,  H05K1/18 ,  A61B8/06

CPC classification number: A61B8/4455 ,  A61B8/06 ,  A61B8/4427 ,  A61B8/4494 ,  A61B8/461 ,  A61B8/54 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09063

Abstract: An ultrasonic device unit includes an ultrasonic device having a device-side terminal, a reinforcing plate having a support adapted to support the ultrasonic device, and a flexible printed wiring board to be connected to the ultrasonic device, the flexible printed wiring board is provided with a connection to be connected to the device-side terminal, and a bend continuous with the connection, extending away from the ultrasonic device, and having an end edge parallel to an extending direction, and the reinforcing plate is provided with a bending guide provided to a first side parallel to a first direction crossing the extending direction, having a circular arc curved surface convex away from the support, and opposed to the bend, and a guide surface disposed at an end in the first direction of the bending guide, and adapted to guide the end edge of the bend.

公开(公告)号：US20180271486A1

公开(公告)日：2018-09-27

申请号：US15921992

申请日：2018-03-15

Applicant: Seiko Epson Corporation

Inventor： Kazuki YOSHIDA

IPC: A61B8/00 ,  H05K1/18

CPC classification number: A61B8/4455 ,  A61B8/06 ,  A61B8/4427 ,  A61B8/4494 ,  A61B8/461 ,  A61B8/54 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09063

Abstract: An ultrasonic device unit includes an ultrasonic device, and a flexible printed wiring board to be connected to the ultrasonic device, the flexible printed wiring board is provided with a device connection to which the ultrasonic device is connected, a first connector including external connection terminals to be connected to the ultrasonic device, a second connector including external connection terminals to be connected to the ultrasonic device, a first inflective part adapted to link the device connection and the first connector to each other, and a second inflective part adapted to link the device connection and the second connector to each other, and a distance between the device connection and the first connector in the first inflective part and a distance between the device connection and the first connector in the second inflective part are different from each other.

公开(公告)号：US10085338B2

公开(公告)日：2018-09-25

申请号：US14863591

申请日：2015-09-24

Applicant: Seagate Technology LLC

Inventor： Kwang Hoon Park

IPC: H05K1/02 ,  H05K3/34 ,  H05K1/11 ,  H05K1/18 ,  B23K35/36 ,  B23K35/362 ,  B23K35/26 ,  B23K35/28 ,  B23K35/30 ,  B23K35/24

CPC classification number: H05K1/0272 ,  B23K35/0238 ,  B23K35/24 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/282 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K1/111 ,  H05K1/181 ,  H05K1/189 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2201/09063

Abstract: Method and apparatus for establishing an electrical interconnection between an electrical lead and a printed circuit board (PCB), such as a PCB used in a data storage device. In some embodiments, the PCB includes a multi-layer substrate having at least one conductive layer and at least one electrically insulative layer. An electrically conductive pad is provided on a facing surface of the substrate in electrical communication with the at least one conductive layer. A flux reservoir is placed adjacent the pad which extends from the facing surface into the substrate. A solder mask layer is provided on the facing surface of the base structure which surrounds the pad and extends into the reservoir. The solder mask layer and reservoir collect liquid flux from a soldering operation used to form a solder joint between the pad and a conductive lead of an electronic component.

公开(公告)号：US20180270946A1

公开(公告)日：2018-09-20

申请号：US15914052

申请日：2018-03-07

Applicant: SEIKO EPSON CORPORATION

Inventor： Masaaki ITO

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H05K1/0245 ,  H05K1/111 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/10409 ,  H05K2201/10734

Abstract: A printed circuit board includes a plurality of metal layers, a plurality of insulating layers provided between the respective metal layers of the plurality of metal layers, and an electronic device provided on one metal layer of the plurality of metal layers. The plurality of metal layers include a first outer metal layer and a second outer metal layer located on the outermost side of the plurality of metal layers and a plurality of intermediate metal layers located between the first outer metal layer and the second outer metal layer. At least one of the plurality of intermediate metal layers is a thick metal layer thicker than the first outer metal layer and the second outer metal layer. The thick metal layer is connected to one of a ground terminal of the electronic device and a power supply terminal of the electronic device.

公开(公告)号：US20180266667A1

公开(公告)日：2018-09-20

申请号：US15913080

申请日：2018-03-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shun KUSUDA

IPC: F21V23/02 ,  H05K1/18 ,  H05K1/11 ,  F21V15/01 ,  H05B33/08 ,  F21V17/08

CPC classification number: F21V23/02 ,  F21V3/00 ,  F21V7/041 ,  F21V7/28 ,  F21V15/01 ,  F21V17/08 ,  F21W2131/10 ,  F21Y2115/10 ,  H05B33/0815 ,  H05B37/02 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10522

Abstract: A circuit board includes: an inductor and a control IC which are included in a switching power supply circuit; and a substrate having a first face, a second face on a reverse side of the first face, and an opening in a center portion of the substrate. The inductor is disposed on the first face, the control IC is disposed on the second face, and at least part of the inductor overlaps with at least part of the control IC when viewed from a direction perpendicular to the first face.

公开(公告)号：US10078944B1

公开(公告)日：2018-09-18

申请号：US15610364

申请日：2017-05-31

Applicant: Pablo Oscar Olivera Brizzio

Inventor： Pablo Oscar Olivera Brizzio

IPC: H05K7/00 ,  G01R19/00 ,  G08B5/36 ,  H01H1/58 ,  H05B33/08 ,  H05B37/02 ,  G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2812 ,  G01R31/025 ,  G01R31/2829 ,  H01H9/0066 ,  H01R9/28 ,  H05K1/0289 ,  H05K3/222 ,  H05K2201/09063 ,  H05K2201/10363 ,  H05K2201/10409 ,  Y02B20/343

Abstract: Disclosed is an apparatus for optimally facilitating interconnections between electrical endpoints. The apparatus comprises a number of terminals equal to a number of combinations of the plurality of endpoints. For example, to enable combinations of two endpoints to be made between N endpoints, the apparatus comprises N(N−1)/2 terminals. Each terminal at least comprises a first contact coupled to a first endpoint and a second contact coupled to a second endpoint. The first contact and second contact of any terminal can be shorted to connect their corresponding endpoints. The apparatus may further comprise a circuit identification process executed by a microcontroller. In this case, each terminal additionally comprises a first circuit identification contact and a second circuit identification contact. The process involves outputting a voltage to the first circuit identification contact and detecting the voltage of the second circuit identification contact to determine whether the corresponding terminal is activated.

公开(公告)号：US20180249261A1

公开(公告)日：2018-08-30

申请号：US15904615

申请日：2018-02-26

Applicant: Oticon A/S

Inventor： Søren WICHMANN ,  Oliver SUNDBERG ,  Rasmus ANDERSSON ,  Peter SPRAGGE ,  Martin LARSEN ,  Peter H. WEIS ,  Anders Hedelund NIELSEN

IPC: H04R25/00 ,  H04R31/00

CPC classification number: H04R25/604 ,  H04R1/342 ,  H04R25/402 ,  H04R25/654 ,  H04R31/006 ,  H04R2201/003 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10083 ,  Y02P70/611

Abstract: A hearing aid device comprising a microphone, a processing unit and a receiver for compensating for a hearing loss in the auditory system of a human is disclosed. The hearing aid device is configured with a microphone inlet assembly which is optimized with regards to maintenance of the hearing aid and improved sound performance. That is, the microphone inlet assembly comprises an inlet element attached to a PCB and further configured to connect with a sound inlet structure.

公开(公告)号：US10054300B2

公开(公告)日：2018-08-21

申请号：US15097946

申请日：2016-04-13

Applicant: Hubbell Incorporated

Inventor： Derek B. Baker ,  Cory A. Passerello ,  Thomas Clawson

IPC: F21V23/00 ,  F21V23/06 ,  F21S8/04 ,  H05K1/02 ,  F21Y103/10 ,  F21Y115/10

CPC classification number: F21V23/003 ,  F21S8/04 ,  F21V23/009 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0286 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/10106

Abstract: A light board for a light fixture includes a first portion and a second portion. The first portion includes at least one light emitting element, and the second portion includes at least one light emitting element. A first state is defined by the second portion being coupled to the first portion and a second state is defined by the second portion being detached from the first portion. In the first state, the light emitting elements of the first portion and the second portion are configured to provide an evenly distributed light output along at least the combined length of the first portion and the second portion. In the second state, the at least one light emitting element of the first portion is configured to provide an evenly distributed light output along at least the length of the first portion.

公开(公告)号：US20180233840A1

公开(公告)日：2018-08-16

申请号：US15892798

申请日：2018-02-09

Applicant: LOTES CO., LTD

Inventor： Chin Chi Lin ,  Cheng Wei Lo

IPC: H01R12/71 ,  H01R13/6581 ,  H01R13/405

CPC classification number: H01R13/6591 ,  H01L23/3675 ,  H01L23/552 ,  H01R12/53 ,  H01R12/57 ,  H01R12/716 ,  H01R12/725 ,  H01R12/732 ,  H01R13/405 ,  H01R13/506 ,  H01R13/516 ,  H01R13/5213 ,  H01R13/5216 ,  H01R13/6581 ,  H01R13/6594 ,  H01R13/665 ,  H05K1/0203 ,  H05K1/0209 ,  H05K7/20154 ,  H05K7/2039 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10446

Abstract: An electrical connector used to be electrically connected to a circuit board includes: an insulating body; a plurality of terminals, accommodated in the insulating body; a shielding shell, accommodating the insulating body and mounted to the circuit board; and at least one heat dissipation member, located on at least one side of the shielding shell and simultaneously abuts the circuit board and the shielding shell. The heat dissipation members are provided on one or more sides of the shielding shell, and simultaneously abut the shielding shell and the circuit board, so that the heat generated in the operation of the electrical connector is transferred to the heat dissipation members via the shielding shell, and the heat is further transferred to the outside and the circuit board by the heat dissipation members, thus improving the heat dissipation efficiency of the electrical connector, and ensuring the stable operation of the electrical connector.

公开(公告)号：US20180206324A1

公开(公告)日：2018-07-19

申请号：US15743323

申请日：2016-06-14

Applicant: NEC CORPORATION

Inventor： Makoto HAYAKAWA

IPC: H05K1/02 ,  H01L23/12 ,  H01L23/373 ,  H04B1/38 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01L23/12 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H04B1/38 ,  H05K1/021 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/368 ,  H05K7/20 ,  H05K7/2049 ,  H05K2201/049 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10416

Abstract: Provided is a mounting structure that can bond a first heat dissipation element to a second substrate through a hole in a first substrate without using a binder such as solder, an adhesive, or the like. A mounting structure of the present disclosure includes a first substrate (10) in which a penetrating hole (11) is formed, a second substrate (20) and a first heat dissipation element (30) overlapped with both surfaces of the first substrate (10), respectively, so as to cover the penetrating hole (11), and a second heat dissipation element (40) sandwiched and attached between the second substrate (20) and the first heat dissipation element (30) inside the penetrating hole (11).