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    Earphone antenna connecting device and portable wireless device
    32.
    发明申请
    Earphone antenna connecting device and portable wireless device 审中-公开
    耳机天线连接装置和便携式无线装置

    公开(公告)号：US20070032130A1

    公开(公告)日：2007-02-08

    申请号：US10570829

    申请日：2005-06-30

    Applicant: Yoshitaka Yoshino

    Inventor： Yoshitaka Yoshino

    IPC: H01R9/05

    CPC classification number: H05K1/0218 ,  H01Q1/273 ,  H01Q1/46 ,  H01Q9/16 ,  H04R1/1033 ,  H04R2420/07 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/09318

    Abstract: In a liquid crystal TV receiver, when the pins (11 to 20) of the 10-pin connector plug (115) are soldered to the pins of the pin-plug connector (110) used for connection of the coaxial cable (60) used to transmit low-frequency and RF signals to a body (120) of the TV receiver, the conversion board is provided between the pins of the 10-pin connector plug (115) and pins of the pin-plug connector (110) and the rear-side pattern of the conversion board except for the pin insertion hole (10) in which the pin (20) to which the antenna signal line (9) is to be connected is to be inserted is formed as the grounding pattern to surround at least three sides of the pin insertion holes (134A, 135A and 132A) in which the audio signal pins (14 and 15) through which low-frequency signals such as audio signals are passed and the microphone pin (12) are to be inserted, respectively. Thus, the RF characteristic and suppression of audio noises are considerably improved.

    Abstract translation: 在液晶电视接收机中，当10针连接器插头（115）的引脚（11至20）焊接到用于连接所使用的同轴电缆（60）的插头连接器（110）的引脚时 为了将低频和RF信号传输到电视接收机的主体（120），转换板设置在10针连接器插头（115）的引脚和插头连接器（110）的引脚之间，并且 要插入天线信号线（9）所连接的引脚（20）的插针孔（10）之外的转换板的后侧图形被形成为接地图案以包围在 插入孔（134A，135A和132A）的至少三个侧面，其中诸如音频信号的低频信号通过的音频信号引脚（14和15）和麦克风引脚（12）到 分别插入。 因此，RF特性和音频噪声的抑制得到显着改善。

    Circuit element with laser trimmed component
    33.
    发明申请
    Circuit element with laser trimmed component 有权
    电路元件配有激光调整元件

    公开(公告)号：US20060290463A1

    公开(公告)日：2006-12-28

    申请号：US11135762

    申请日：2005-05-23

    Applicant: Devin Bingham ,  Daniel Ayres ,  Alvin Chow

    Inventor： Devin Bingham ,  Daniel Ayres ,  Alvin Chow

    IPC: H01C10/00

    CPC classification number: H05K1/162 ,  H05K1/0293 ,  H05K1/0298 ,  H05K3/027 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2203/107 ,  H05K2203/171 ,  H05K2203/175

    Abstract: A circuit element has a substrate layer with first and second faces. A conductive first layer overlays the first surface, and a conductive second layer overlays the second surface. The first layer defines a pattern with a trimmable portion. The second layer defines a pattern having a first conductive element registered with at least a portion of the trimmable portion, and a second conductive element electrically isolated from first element and encompassing the first element. The second element may be a ground plane that has an aperture surrounding the first component, which serves as a shield to prevent damage to any elements beyond the second layer.

    Abstract translation: 电路元件具有带有第一和第二面的衬底层。 导电第一层覆盖第一表面，并且导电的第二层覆盖第二表面。 第一层定义具有可调节部分的图案。 第二层限定了具有与可调节部分的至少一部分配准的第一导电元件的图案，以及与第一元件电隔离并且包围第一元件的第二导电元件。 第二元件可以是具有围绕第一部件的孔的接地平面，其用作屏蔽件以防止损坏超出第二层的任何元件。

    Techniques for distributing current in a backplane assembly and methods for making the same
    34.
    发明授权
    Techniques for distributing current in a backplane assembly and methods for making the same 有权
    在背板组件中分配电流的技术及其制造方法

    公开(公告)号：US07154761B1

    公开(公告)日：2006-12-26

    申请号：US10778418

    申请日：2004-02-13

    Applicant: Sergio Camerlo ,  Irfan Elahi

    Inventor： Sergio Camerlo ,  Irfan Elahi

    IPC: H01R12/16

    CPC classification number: H05K1/141 ,  H01R12/523 ,  H05K1/0263 ,  H05K3/222 ,  H05K3/3447 ,  H05K2201/044 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/10303

    Abstract: A backplane assembly includes a main backplane having a first power conductor, a backplane strip having a second power conductor, and connecting members disposed between the main backplane and the backplane strip. The connecting members hold the backplane strip in a fixed position relative to the main backplane and electrically connect the first power conductor and the second power conductor. In one arrangement, the connecting members include source standoffs which extend from a source area of the main backplane to the backplane strip, and target standoffs which extend from a target area of the main backplane to the backplane strip. The source and target standoffs and the second power conductor provide a current path which increases current carrying capacity from the source area to the target area above that provided by the first power conductor alone. Thus, the backplane assembly is well-provisioned for distributing high currents to circuit boards.

    Abstract translation: 背板组件包括具有第一电源导体的主背板，具有第二电源导体的底板条和设置在主背板和背板条之间的连接构件。 连接构件将背板条相对于主底板固定在固定位置，并电连接第一电力导体和第二电力导体。 在一种布置中，连接构件包括从主背板的源区域延伸到背板条的源支座以及从主底板的目标区域延伸到底板条的目标支架。 源和目标支座和第二电力导体提供电流路径，其增加从源区域到目标区域的电流承载能力，高于由第一电力导体单独提供的电流路径。 因此，背板组件设计良好，用于将高电流分​​配给电路板。

    Methods and apparatuses for thermal dissipation
    35.
    发明申请
    Methods and apparatuses for thermal dissipation 有权

    公开(公告)号：US20060256529A1

    公开(公告)日：2006-11-16

    申请号：US11403562

    申请日：2006-04-12

    Applicant: Ping Liu ,  Min Li

    Inventor： Ping Liu ,  Min Li

    IPC: H05K7/20

    CPC classification number: H05K1/0209 ,  G06F1/203 ,  H05K2201/066 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/10446

    Abstract: A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot allowing thermal dissipation from the card due to air flow over the heat sink. For one embodiment of the invention, heat producing components of the PC card are identified and a thermally conductive path is provided from the components to the extension portion of the PC card.

    CIRCUIT STRUCTURE
    36.
    发明申请
    CIRCUIT STRUCTURE 有权
    电路结构

    公开(公告)号：US20060081990A1

    公开(公告)日：2006-04-20

    申请号：US10905803

    申请日：2005-01-21

    Applicant: Chi-Hsing Hsu

    Inventor： Chi-Hsing Hsu

    IPC: H01L29/73

    CPC classification number: H05K1/0265 ,  H01L23/49822 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/19032 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K3/107 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09736 ,  H01L2924/00

    Abstract: A circuit structure for a package substrate or a circuit board is provided. The circuit structure has a dielectric layer with an upper surface and a lower surface, at least a first line and at least a second line. The first line is disposed on the dielectric layer on which a base of the first line is aligned with the upper surface. In addition, the second line is disposed on the dielectric layer on which a base of the second line is embedded below the upper surface. Since the second line is embedded into the dielectric layer, the distance with a reference plane is reduced and the crosstalk between the signals is further effectively reduced.

    Abstract translation: 提供了一种用于封装基板或电路板的电路结构。 电路结构具有具有上表面和下表面的电介质层，至少第一线和至少第二线。 第一线设置在第一线的基底与上表面对准的电介质层上。 此外，第二线设置在第二线的基底嵌入其上表面的电介质层上。 由于第二行被嵌入到介电层中，所以与参考平面的距离减小，并且信号之间的串扰被进一步有效地降低。

    Magnetic disk drive
    37.
    发明申请
    Magnetic disk drive 失效
    磁盘驱动器

    公开(公告)号：US20040252413A1

    公开(公告)日：2004-12-16

    申请号：US10870573

    申请日：2004-06-16

    Applicant: Hitachi Global Storage Technologies Japan, Ltd.

    Inventor： Nobumasa Nishiyama

    IPC: G11B005/48

    CPC classification number: H05K1/0253 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/486 ,  G11B33/08 ,  H05K1/0245 ,  H05K1/056 ,  H05K2201/09236 ,  H05K2201/09318

    Abstract: Embodiments of the invention provide a magnetic disk drive which has improved electrical properties owing to a reduction in the loss of transmission line, improved vibration properties owing to a reduction in the stiffness of wiring around the head, and a flat impedance in the transmission line. In one embodiment, a magnetic disk drive comprises a suspension; a magnetic head coupled with the suspension and configured to write and read information to and from a magnetic recording medium; and a transmission line disposed on the suspension to transmit writing and reading information to and from the magnetic head. The transmission line includes a writing line and a reading line, a lower conductor disposed underneath the writing line and the reading line, and an insulating layer interposed between the lower conductor and the writing and reading lines. The lower conductor comprises copper or copper-based alloy and has a thickness of substantially less than 25 nullm, desirably about 2-12 nullm, and more desirably about 5 nullm.

    Abstract translation: 本发明的实施例提供了一种磁盘驱动器，其由于传输线损耗的减少，由于头部周围的布线刚度的降低以及传输线中的平坦阻抗而导致的改善的振动特性而具有改善的电性能。 在一个实施例中，磁盘驱动器包括悬架; 磁头与所述悬架耦合并被配置为向磁记录介质写入和读取信息; 以及设置在所述悬架上的传输线，用于向所述磁头发送写入信息和从所述磁头读取信息。 传输线包括写入线和读取线，设置在写入线和读取线下方的下部导体以及插入在下部导体和写入和读取线之间的绝缘层。 下导体包括铜或铜基合金，其厚度基本上小于25μm，理想的是约2-12μm，更理想的是约5μm。

    Multi-layer microwave circuits and methods of manufacture
    38.
    发明授权
    Multi-layer microwave circuits and methods of manufacture 有权
    多层微波电路及制造方法

    公开(公告)号：US06525623B2

    公开(公告)日：2003-02-25

    申请号：US09878031

    申请日：2001-06-08

    Applicant: Mahadevan Sridharan ,  Vasanth Munikoti

    Inventor： Mahadevan Sridharan ,  Vasanth Munikoti

    IPC: H01P512

    CPC classification number: H01P3/085 ,  H01P3/081 ,  H01P11/003 ,  H05K1/0237 ,  H05K3/403 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/0379 ,  H05K2201/0715 ,  H05K2201/09181 ,  H05K2201/09318 ,  H05K2201/096 ,  H05K2201/09718

    Abstract: A multi-layer circuit comprises first and second transmission lines. The first transmission line includes vertically stacked bottom and middle dielectric layers. A conductive pattern is disposed between the bottom and middle dielectric layers. A bottom ground layer is in contact with a bottom surface of the bottom dielectric layer. The second transmission line is vertically stacked above the first transmission line and includes a top dielectric layer and a conductive pattern in contact with a top surface of the top dielectric layer and at least one ground layer separating a bottom surface of the top dielectric layer from the middle dielectric layer. At least one plated through hole electrically connects the first and second transmission lines. All of the dielectric layers comprise a ceramic-filled substrate with woven glass reinforcement.

    Abstract translation: 多层电路包括第一和第二传输线。 第一传输线包括垂直堆叠的底部和中间电介质层。 导电图案设置在底部和中间电介质层之间。 底部底层与底部介电层的底表面接触。 第二传输线垂直堆叠在第一传输线上方，并且包括顶电介质层和与顶电介质层的顶表面接触的导电图案，以及至少一个接地层，其将顶电介质层的底表面与 中间介电层。 至少一个电镀通孔电连接第一和第二传输线。 所有电介质层包括具有编织玻璃增强材料的陶瓷填充衬底。

    Multilayer printed wiring board and electronic equipment
    39.
    发明授权
    Multilayer printed wiring board and electronic equipment 有权
    多层印刷线路板和电子设备

    公开(公告)号：US06492008B1

    公开(公告)日：2002-12-10

    申请号：US09686931

    申请日：2000-10-12

    Applicant: Shigeo Amagi ,  Satoshi Murakawa

    Inventor： Shigeo Amagi ,  Satoshi Murakawa

    IPC: B32B300

    CPC classification number: H05K3/4688 ,  B32B7/02 ,  B32B15/08 ,  H05K1/0271 ,  H05K2201/029 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09318 ,  Y10S428/901 ,  Y10T428/24917

    Abstract: The thermal expansion coefficient of a composite insulator layer is adjusted in order to suppress warping deformation in a multilayer printed wiring board caused by temperature change. The thicknesses and the covering ratios on the both sides of the electric conductor layer composing the multilayer printed wiring board are asymmetric with respect to the central plane. A multilayer printed wiring board is formed by laminating composite insulation layers and laminated bodies, the composite insulation layer being made of a cloth a resin impregnated into the cloth, the laminated body being composed of electric conductor layers formed by coating on a surface of the composite insulation layer. The thermal expansion coefficient of the composite insulation layer having a conductor layer with a higher covering ratio is set to be smaller than the thermal expansion coefficient of the composite insulation layer having a conductor layer with a lower covering ratio.

    Abstract translation: 调整复合绝缘体层的热膨胀系数，以抑制由温度变化引起的多层印刷电路板中的翘曲变形。 构成多层印刷电路板的导电体层的两面的厚度和覆盖率相对于中心面不对称。 多层印刷线路板是通过层压复合绝缘层和层叠体形成的，复合绝缘层由浸渍在布中的树脂制成，层叠体由通过在复合材料的表面上涂覆而形成的导电体层构成 绝缘层。 将具有较高覆盖率的导体层的复合绝缘层的热膨胀系数设定为小于具有较低覆盖率的导体层的复合绝缘层的热膨胀系数。

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