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    Printed circuit board layering configuration for very high bandwidth interconnect
    33.
    发明授权
    Printed circuit board layering configuration for very high bandwidth interconnect 失效
    印刷电路板分层配置，用于非常高带宽的互连

    公开(公告)号：US5808529A

    公开(公告)日：1998-09-15

    申请号：US678982

    申请日：1996-07-12

    Applicant: John D. Hamre

    Inventor： John D. Hamre

    IPC: H05K1/11 ,  H01P1/04 ,  H01P3/08 ,  H01P11/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H01P5/00

    CPC classification number: H01P1/047 ,  H05K1/0219 ,  H05K3/361 ,  H05K2201/0715 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/0979

    Abstract: A ground plane interconnection is provided on first and second substrates, the first and second substrates having respective first and second ground layers disposed on a first surface of each of the first and second substrates. A ground conductor strip is disposed on a second surface of the second substrate, wherein the ground conductor strip includes a plurality of electrically conductive members which pass through the second substrate to electrically couple the ground conductor strip and the second ground layer. The first substrate is positioned with respect to the second substrate such that when the first substrate is placed proximate the second substrate, the ground conductor strip electrically couples the first and second ground layers to form a continuous ground plane. A method of forming a reduced-inductance continuous ground plane is also provided.

    Abstract translation: 在第一和第二基板上提供接地平面互连，第一和第二基板具有设置在第一和第二基板中的每一个的第一表面上的相应的第一和第二接地层。 接地导体条设置在第二基板的第二表面上，其中接地导体条包括多个导电构件，其穿过第二基板以电耦合接地导体条和第二接地层。 第一衬底相对于第二衬底定位，使得当第一衬底被放置在第二衬底附近时，接地导体带电耦合第一和第二接地层以形成连续的接地平面。 还提供了形成减小电感的连续接地平面的方法。

    Display with improved frame surrounding display element
    34.
    发明授权
    Display with improved frame surrounding display element 失效
    显示与改进的框架周边显示元素

    公开(公告)号：US5247291A

    公开(公告)日：1993-09-21

    申请号：US434135

    申请日：1989-11-13

    Applicant: Shoji Kazusaka ,  Kouji Ohmori ,  Sawako Ehara

    Inventor： Shoji Kazusaka ,  Kouji Ohmori ,  Sawako Ehara

    IPC: G09F9/302 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  G08G5/00

    CPC classification number: G09F9/302 ,  H05K1/141 ,  H05K1/0259 ,  H05K2201/049 ,  H05K2201/09354 ,  H05K2201/10128 ,  H05K2201/10446 ,  H05K3/366

    Abstract: Disclosed herein is a display to be applied to a digital switch. This display includes a casing (1) formed of a box-type casing (2) and a cover (3), a display element (8) facing a display window (2b) accommodated in the casing (1), a printed wiring board (9) for supporting the display element (8), and a printed wiring board (14) which is connected to the printed wiring board (9) and on which a control circuit (16) for displaying an external input signal on the display element (8), and the like are mounted. At the front portion of the casing (1) is formed frames 11a and 11b extending over a display face (8) of the display element (8), and thus a portion of the printed wiring board (9) which is located at the outer periphery of the display element (8) cannot be seen from the outside. A conductive pattern (18) for discharging a static electricity is provided on the printed wiring board (9), corresponding to a region in which the frames (11a, 11b) engaged with each other. The frames (11a, 11b) have adhesive tapered faces, and thus a static electricity is hard to enter the display from the outside. Thus, it flows out of the display through the conductive pattern (18) even if it enters the display.

    Molded circuit board for ribbon cable connector
    35.
    发明授权
    Molded circuit board for ribbon cable connector 失效
    带状电缆连接器的模制电路板

    公开(公告)号：US4871319A

    公开(公告)日：1989-10-03

    申请号：US288047

    申请日：1988-12-21

    Applicant: David A. Babow

    Inventor： David A. Babow

    IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

    CPC classification number: H01R12/62 ,  H05K1/117 ,  H05K3/3405 ,  H05K3/3421 ,  H05K1/0219 ,  H05K1/0284 ,  H05K1/18 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09354 ,  H05K2201/10356 ,  H05K2203/0195 ,  H05K2203/0405 ,  H05K2203/0594 ,  H05K2203/166 ,  H05K2203/167 ,  H05K3/301 ,  H05K3/303 ,  Y02P70/613

    Abstract: A paddle board for a connector for one or two ribbon cables having closely spaced signal and ground wires, includes on one or both major surfaces a plurality of wire-terminating pads comprising conductive material along bottoms of wire-receiving grooves proximate the cable-proximate edge of the board, the grooves defined by serrate ridges. Circuit paths extend from the signal ones of the wire-terminating pads to terminal-connecting pads along one or both major surfaces at a connector-proximate edge of the board to be connected to signal terminals of the connector. Other circuit paths extend from ground ones of the wire-terminating pads to a ground bus which includes at least one ground circuit path extending to a ground terminal-connecting pad along the connector-proximate edge. The wires of each ribbon cable are soldered to the wire-terminating pads after being wiped into the grooves, and the ridges serve as integral wire alignment means. The paddle board is molded of plastic and then plated to define the pads and circuit paths, and can include molded through-holes which become plated, and can also easily have a shape molded to include other structural features such as cable-receiving recesses as desired. A solder strip can be placed transversely across the row of wire ends and melted by a transverse hot bar, with interruptions in the ridges defining a strip- and bar-receiving region.

    Abstract translation: 用于具有紧密间隔的信号和接地线的一个或两个带状电缆的连接器的桨板包括在一个或两个主表面上的多个线端接垫，其包括沿电缆接近边缘的电线接收槽的底部的导电材料 的板，由锯齿形脊脊定义的凹槽。 电路路径从接线端接垫的信号线延伸到沿着板的连接器 - 接近边缘处的一个或两个主表面的端子连接焊盘，以连接到连接器的信号端子。 其他电路路径从接线端接焊盘的接地端延伸到接地总线，该接地总线包括至少一个接地电路路径，沿着连接器邻近边缘延伸到接地端子连接焊盘。 每个带状电缆的电线在擦拭到槽中之后焊接到导线端接垫，并且脊用作整体线对准装置。 桨板由塑料模制，然后电镀以限定焊盘和电路路径，并且可以包括成型的通孔，其被镀覆，并且还可以容易地具有模制成型以形成其它结构特征，例如根据需要的电缆接收凹部 。 焊料条可以横向放置在电线末端的一排上，并被横向热棒熔化，脊中的中断限定了带状和条形接收区域。

    PRINTED CIRCUIT BOARD GROUNDING
    37.
    发明公开
    PRINTED CIRCUIT BOARD GROUNDING 审中-公开

    公开(公告)号：US20240196516A1

    公开(公告)日：2024-06-13

    申请号：US18554815

    申请日：2021-04-15

    Applicant: AES Global Holdings PTE Ltd.

    Inventor： Yihong Zhang ,  Yuk Man Shing ,  Wai Chiu Or ,  Wai Man Lo

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H05K1/0215 ,  H05K1/115 ,  H05K3/3405 ,  H05K2201/09354 ,  H05K2201/1034 ,  H05K2201/10984 ,  H05K2203/0285

    Abstract: Various configurations of a grounding element or conductive element for a printed circuit board (PCB), as well as a process for manufacturing, are disclosed. For example, a PCB can include a solder grounding element connecting a copper track to a metal substrate, where the solder grounding element is applied via ultrasonic soldering during a manufacturing process. In another example, a PCB can include a spring pin grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include an auto splice grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include a press fit pin grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include a clip pin grounding element connecting a copper track to a metal substrate.

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