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    Wiring board comprising wirings arranged with crest and trough
    31.
    发明授权
    Wiring board comprising wirings arranged with crest and trough 有权
    接线板包括布置有波峰和波谷的布线

    公开(公告)号：US08653381B2

    公开(公告)日：2014-02-18

    申请号：US13328351

    申请日：2011-12-16

    Applicant: Tetsuya Hiraoka

    Inventor： Tetsuya Hiraoka

    IPC: H05K1/16

    CPC classification number: H05K1/0271 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K1/0224 ,  H05K2201/09263 ,  H05K2201/09663 ,  H01L2924/00 ,  H01L2224/05599

    Abstract: A wiring board includes: a first wiring; a second wiring being disposed adjacently to the first wiring; a third wiring being disposed adjacently to the first wiring; a fourth wiring being disposed adjacently to the third wiring; and an insulating layer, wherein the second wiring and the fourth wiring are disposed adjacently to each other, the first wiring and the fourth wiring are not overlapped, the second wiring and the third wiring are not overlapped, a crest and a trough are provided on a side face of the first wiring, the crest and the trough are provided on a side face of the second wiring, the trough provided on the side face of the first wiring and the third wiring are overlapped, and the trough provided on the side face of the second wiring and the fourth wiring are overlapped.

    Abstract translation: 布线板包括：第一布线; 与所述第一布线相邻设置的第二布线; 与第一布线相邻设置的第三布线; 与第三布线相邻设置的第四布线; 以及绝缘层，其中所述第二布线和所述第四布线彼此相邻地布置，所述第一布线和所述第四布线不重叠，所述第二布线和所述第三布线不重叠，波峰和波谷设置在 第一布线的侧面，波峰和谷设置在第二布线的侧面上，设置在第一布线和第三布线的侧面上的槽重叠，并且设置在侧面上的槽 的第二布线和第四布线重叠。

    Printed wiring board
    33.
    发明授权
    Printed wiring board 失效
    印刷电路板

    公开(公告)号：US08605448B2

    公开(公告)日：2013-12-10

    申请号：US13064174

    申请日：2011-03-09

    Applicant: Kenji Motohashi ,  Hideji Miyanishi ,  Kazumasa Aoki

    Inventor： Kenji Motohashi ,  Hideji Miyanishi ,  Kazumasa Aoki

    IPC: H05K1/00

    CPC classification number: H05K1/0233 ,  H05K1/0227 ,  H05K1/0243 ,  H05K1/025 ,  H05K2201/086 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/09972

    Abstract: A printed wiring board includes a bridge located in a surface layer, a noise absorber located on the bridge, a plurality of grounds directly connected or high-frequency-connected to the bridge, a first device using one of the plurality of grounds as a reference potential, a second device using one of the plurality of grounds other than the ground for the first device as a reference potential, and a high-speed signal line that connects the first device and the second device. The high-speed signal line is routed through a layer adjacent to the bridge in a layer direction of the printed wiring board to form a transmission line structure.

    Abstract translation: 印刷电路板包括位于表面层中的桥，位于桥上的噪声吸收器，与桥接器直接连接或高频连接的多个接地，使用多个接地中的一个作为参考的第一设备 电位，使用除了第一器件的接地之外的多个接地之一作为参考电位的第二器件以及连接第一器件和第二器件的高速信号线。 高速信号线沿印刷电路板的层方向穿过与桥接件相邻的层，以形成传输线结构。

    Grooved plate for improved solder bonding
    35.
    发明授权
    Grooved plate for improved solder bonding 有权
    沟槽板用于改善焊接

    公开(公告)号：US08587019B2

    公开(公告)日：2013-11-19

    申请号：US13270646

    申请日：2011-10-11

    Applicant: Xiantao Yan ,  Debo A. Adebiyi ,  Zequn Mei

    Inventor： Xiantao Yan ,  Debo A. Adebiyi ,  Zequn Mei

    IPC: H01L33/00

    CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10106 ,  H05K2203/1178 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A metal plate on a multi-die LED emitter substrate or a metal plate on a metal-core printed circuit board (MCPCB) that attaches to the emitter substrate (or both plates) can be fabricated with a number of generally radial grooves, at least some of which extend to the peripheral edge of the plate. These grooves can provide channels that allow air to escape during solder-bonding processes, reducing the size and/or total area of solder voids and thereby improving thermal transfer between the emitter and the MCPCB.

    Abstract translation: 多芯片LED发射极基板上的金属板或附着于发射极基板（或两个板）的金属芯印刷电路板（MCPCB）上的金属板可以制造成具有多个大致径向的凹槽，至少 其中一些延伸到板的周边边缘。 这些槽可以提供在焊接过程中允许空气逸出的通道，减小焊料空隙的尺寸和/或总面积，从而改善发射极和MCPCB之间的热传递。

    STRUCTURAL BODY AND INTERCONNECT SUBSTRATE
    37.
    发明申请
    STRUCTURAL BODY AND INTERCONNECT SUBSTRATE 有权
    结构体和互连基底

    公开(公告)号：US20130140071A1

    公开(公告)日：2013-06-06

    申请号：US13816690

    申请日：2011-07-20

    Applicant: Hiroshi Toyao ,  Toru Taura

    Inventor： Hiroshi Toyao ,  Toru Taura

    IPC: H05K1/18 ,  H05K1/11

    CPC classification number: H05K1/18 ,  H01P1/047 ,  H05K1/0236 ,  H05K1/115 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09972

    Abstract: A structural body includes a first conductor having a first opening; a second conductor, having a second opening, which is opposite to at least a portion of the first conductor; a conductor via, passing through the first opening and the second opening, which is insulated from the first conductor and the second conductor; a first interconnect, provided in the inside of the first opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end and which is opposite to the second conductor; and a second interconnect, provided in the inside of the second opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end, and which is opposite to the first conductor.

    Abstract translation: 结构体包括具有第一开口的第一导体; 第二导体，具有与所述第一导体的至少一部分相对的第二开口; 导体通孔，穿过与第一导体和第二导体绝缘的第一开口和第二开口; 第一互连件，设置在第一开口的内部，其一端连接到导体通孔，另一端形成为开口端，并与第二导体相对; 以及第二互连件，设置在第二开口的内部，其一端连接到导体通孔，并且其另一端形成为开口端，并且与第一导体相对。

    STRUCTURAL BODY AND INTERCONNECT SUBSTRATE
    38.
    发明申请
    STRUCTURAL BODY AND INTERCONNECT SUBSTRATE 有权
    结构体和互连基底

    公开(公告)号：US20130126225A1

    公开(公告)日：2013-05-23

    申请号：US13813632

    申请日：2011-08-26

    Applicant: Hiroshi Toyao

    Inventor： Hiroshi Toyao

    IPC: H05K1/02

    CPC classification number: H05K1/0296 ,  H01P1/2005 ,  H01P3/085 ,  H01Q15/006 ,  H01Q15/0086 ,  H05K1/0236 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09972

    Abstract: A structural body includes: a first conductor and a second conductor of which at least portions are opposite to each other; a third conductor, interposed between the first conductor and the second conductor, of which at least a portion is opposite to the first conductor and the second conductor, and has a first opening; an interconnect provided in the inside of the first opening; and a conductor via which is electrically connected to the first conductor and the second conductor and is electrically insulated from the third conductor, wherein the interconnect is opposite to the first conductor and the second conductor, one end thereof being electrically connected to the third conductor at an edge of the first opening and an other end thereof being formed as an open end.

    Abstract translation: 结构体包括：至少部分彼此相对的第一导体和第二导体; 第三导体，插入在第一导体和第二导体之间，其中至少一部分与第一导体和第二导体相对，并具有第一开口; 设置在所述第一开口的内部的互连; 以及导体，其经由其电连接到第一导体和第二导体并与第三导体电绝缘，其中互连与第一导体和第二导体相对，其一端与第三导体电连接 第一开口的边缘和其另一端形成为开口端。

    System, apparatus, and method for PCB-based automation traceability
    39.
    发明授权
    System, apparatus, and method for PCB-based automation traceability 有权
    基于PCB的自动化跟踪的系统，设备和方法

    公开(公告)号：US08441341B2

    公开(公告)日：2013-05-14

    申请号：US12513913

    申请日：2007-11-07

    Applicant: Chuck Pagano ,  Richard Keenan

    Inventor： Chuck Pagano ,  Richard Keenan

    IPC: H04Q5/22

    CPC classification number: G06K19/07749 ,  H01Q1/2225 ,  H01Q13/10 ,  H05K1/0266 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10098

    Abstract: A system, apparatus, and method are provided for using a PCB component as an antenna to allow for RFID communication in the UHF band. The present invention enables supply chain management of a PCB and products containing the PCB by enabling tracking of a PCB at the assembly level such that at each production stage of the board production it is known exactly where the product is and what is its present state of test. One embodiment uses an existing ground plane of a PCB, splitting the ground plane of all the layers of the PCB, allowing for a dipole structure that provides an adequate received energy level to power the circuit to the “on” state thereby allowing RFID/Electronic Product Code transactions. In alternative embodiments, existing or added traces are used in place of the split ground plane as an antenna for the RFID IC. The supply chain management can employ a dedicated RFID interrogator that is connected to an IT network and allows for bill of materials to be fulfilled in an automated fashion throughout the assembly of the PCB. The manufacturer of the end product can also use the RFID IC in an own end product item level supply management system that includes inventory, shipments, and returns.

    Abstract translation: 提供了一种使用PCB部件作为天线以允许UHF频带中的RFID通信的系统，装置和方法。 本发明通过使得能够在组装级别跟踪PCB来实现PCB和包含PCB的产品的供应链管理，使得在电路板生产的每个生产阶段，已知产品在何处以及其当前状态 测试。 一个实施例使用PCB的现有接地平面，分割PCB的所有层的接地平面，允许提供足够的接收能级以将电路供电到“接通”状态的偶极结构，从而允许RFID /电子 产品代码交易。 在替代实施例中，使用现有的或附加的迹线来代替用于RFID IC的天线的分离接地平面。 供应链管理可以使用专门的RFID询问器，该询问器连接到IT网络，并允许在PCB的整个组装过程中以自动化方式实现物料清单。 最终产品的制造商也可以在自己的最终产品级供应管理系统中使用RFID IC，包括库存，出货和退货。

    Wiring board connection method
    40.
    发明授权
    Wiring board connection method 有权
    接线板连接方式

    公开(公告)号：US08353102B2

    公开(公告)日：2013-01-15

    申请号：US12120864

    申请日：2008-05-15

    Applicant: Masayoshi Koyama ,  Tsukasa Shiraishi

    Inventor： Masayoshi Koyama ,  Tsukasa Shiraishi

    IPC: H05K3/34 ,  H05K3/30 ,  H05K1/00

    CPC classification number: H05K3/361 ,  H01L24/11 ,  H01L2924/00014 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2203/087 ,  H05K2203/166 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2224/05599

    Abstract: A wiring board connection method comprising: arranging a continuous conductive joint body on adjacent connection terminals of one of the wiring boards in a space between the adjacent connection terminals on one of the wiring boards; aligning the wiring boards so that the connection terminals face each other with the conductive joint body interposed therebetween; and bonding the connection terminals with each other by heating and then cooling the conductive joint body, wherein: the conductive joint body is a material that generates air bubbles upon being heated; and a recessed portion is formed on a surface of at least one of the connection terminals, the surface being opposite to the connection terminal of another wiring board. When the connection terminals are bonded with each other, the conductive joint body is allowed to move so as to gather on the surfaces of the connection terminals where no recessed portions are formed.

    Abstract translation: 一种布线板连接方法，包括：在一个所述布线板之间的相邻连接端子之间的空间中，在所述布线板之一的相邻连接端子上布置连续的导电接头体; 对准布线板，使得连接端子彼此面对，并且导电接头体插入其间; 并且通过加热将所述连接端子彼此接合，然后冷却所述导电接头体，其中：所述导电接头体是在加热时产生气泡的材料; 并且在至少一个连接端子的表面上形成凹部，该表面与另一布线板的连接端子相对。 当连接端子彼此接合时，导电接头体被允许移动，以便聚集在不形成凹部的连接端子的表面上。

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