公开(公告)号：US20100163282A1

公开(公告)日：2010-07-01

申请号：US12376862

申请日：2007-10-22

Applicant: Hiroyoshi Tagi ,  Eiji Takahashi ,  Yoshiyuki Saito

Inventor： Hiroyoshi Tagi ,  Eiji Takahashi ,  Yoshiyuki Saito

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/20 ,  H05K1/11

CPC classification number: H05K1/0228 ,  H05K1/0245 ,  H05K1/0393 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/097 ,  Y10T29/49128

Abstract: Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.

Abstract translation: 提供了几乎不产生辐射电磁噪声并且不容易受到外部噪声的影响的印刷线路板和柔性印刷线路板。 在彼此堆叠的至少两个绝缘基板之间设置第一和第二波形布线。 第一和第二波形布线在绝缘基板的平面方向和厚度方向上彼此三维地相交。 第一和第二波形布线通过设置在绝缘基板之间的抗蚀剂层彼此电分离。

公开(公告)号：US20090255723A1

公开(公告)日：2009-10-15

申请号：US12103191

申请日：2008-04-15

Applicant: Hui-Lung LAI

Inventor： Hui-Lung LAI

IPC: H05K1/00

CPC classification number: H05K1/0219 ,  G06F3/044 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09263 ,  H05K2201/09336 ,  H05K2201/097

Abstract: A printed circuit board with ground grid includes a first insulating plate, a plurality of first metal lines formed on the first insulating plate, a sub-circuit board above the plurality of first metal lines, a second insulating plate above the sub-circuit board, a plurality of second metal lines formed on the second insulating plate, and, a plurality of conductive components formed in and through the second insulating plate and the sub-circuit board to electrically connect the plurality of first metal lines and the plurality of second metal lines. As additional electronic elements and circuits can be located on the first insulating plate and/or on the second insulating plate without limitation, difficulties for printed circuit board layout can be dramatically reduced.

Abstract translation: 具有接地栅格的印刷电路板包括第一绝缘板，形成在第一绝缘板上的多个第一金属线，多个第一金属线上方的副电路板，副电路板上方的第二绝缘板， 形成在所述第二绝缘板上的多个第二金属线，以及形成在所述第二绝缘板中的多个导电部件和所述副电路基板，以将所述多个第一金属线和所述多个第二金属线 。 由于附加的电子元件和电路可以无限制地位于第一绝缘板和/或第二绝缘板上，所以印刷电路板布局的困难可以大大降低。

公开(公告)号：US20090115260A1

公开(公告)日：2009-05-07

申请号：US12262413

申请日：2008-10-31

Applicant: Jun Youl LIM

Inventor： Jun Youl LIM

IPC: H02B1/20

CPC classification number: H05K1/0228 ,  H05K1/0245 ,  H05K2201/09263 ,  H05K2201/097

Abstract: A power line arrangement includes a first power line and a second power line which crosses the first power line at least once. The first and second power lines are connected to a same power supply, and current in the first power line flows in a different direction from current in the second power line at an area where the first and second power lines cross.

Abstract translation: 电力线装置包括至少一次穿过第一电力线的第一电力线和第二电力线。 第一和第二电源线连接到相同的电源，并且第一电力线中的电流在第一和第二电力线交叉的区域沿与第二电力线中的电流不同的方向流动。

公开(公告)号：US20090015364A1

公开(公告)日：2009-01-15

申请号：US12233553

申请日：2008-09-18

Applicant: Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

IPC: H01F27/28

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/266 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 磁性构件嵌入在所述支撑面板中的一个或多个空腔中。 由多个电镀通孔导体提供多层电路与磁性构件周围的多个绕组之间的电连接。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层来提供该镀铜的有机层的附着力。

公开(公告)号：US20080258862A1

公开(公告)日：2008-10-23

申请号：US11754840

申请日：2007-05-29

Applicant: Wei-Ting Chen ,  Chang-Sheng Chen ,  Chin-Sun Shyu ,  Chang-Lin Wei

Inventor： Wei-Ting Chen ,  Chang-Sheng Chen ,  Chin-Sun Shyu ,  Chang-Lin Wei

IPC: H01C1/012 ,  H01C17/06

CPC classification number: H01C17/065 ,  H01C17/281 ,  H05K1/167 ,  H05K2201/097 ,  H05K2203/1453 ,  Y10T29/49082

Abstract: A resistor layout structure and a manufacture method thereof are provided. The resistor layout structure includes a substrate, a plurality of metals, and a plurality of resistor lumps. The plurality of metals is disposed on the substrate. The plurality of first resistor lumps is disposed on the substrate. The metals are used as a supporting structure during the disposing process. Besides, the metals are interlaced and connected in series connected with the resistor lumps to form the resistor. Therefore, the present invention decreases the resistance variability of the resistor.

Abstract translation: 提供电阻器布局结构及其制造方法。 电阻器布局结构包括衬底，多个金属和多个电阻器块。 多个金属设置在基板上。 多个第一电阻器块设置在基板上。 金属在配置过程中用作支撑结构。 此外，金属是交错的并且与电阻器块串联连接以形成电阻器。 因此，本发明降低了电阻器的电阻变化。

公开(公告)号：US07436282B2

公开(公告)日：2008-10-14

申请号：US11774180

申请日：2007-07-06

Applicant: Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

IPC: H01F5/00

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/266 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 磁性构件嵌入在所述支撑面板中的一个或多个空腔中。 由多个电镀通孔导体提供多层电路与磁性构件周围的多个绕组之间的电连接。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层来提供该镀铜的有机层的附着力。

公开(公告)号：US07399192B2

公开(公告)日：2008-07-15

申请号：US11700777

申请日：2007-02-01

Applicant: Eiji Yamamoto

Inventor： Eiji Yamamoto

IPC: H01R13/15

CPC classification number: H01R12/79 ,  H05K1/117 ,  H05K1/118 ,  H05K1/141 ,  H05K2201/097 ,  H05K2203/1572

Abstract: A high density flexible wiring connection device comprises a flexible flat cable (FFC) having narrow-pitch conductors and a flat cable connector (FC connector) having a double-sided contact designed for narrow-pitch wiring and having upper and lower contact terminals. A supplementary wiring board having upper and lower wiring terminals is introduced to connect alternate ones and the other alternate ones of the narrow-pitch conductors of the FFC to alternate ones of the upper contact terminals and alternate ones of the lower contact terminals of the FC connector, respectively, thereby making the pitch of each of the upper and lower wiring terminals twice the narrow pitch of the FFC and the FC connector. The use of the supplementary wiring board to thus convert the wiring pitch makes it possible to prevent whiskers, even if formed on the contact terminals, from causing short-circuits between adjacent contact terminals and between adjacent wiring terminals.

Abstract translation: 高密度柔性布线连接装置包括具有窄间距导体的柔性扁平电缆（FFC）和具有设计用于窄间距布线并具有上和下接触端子的双面接触的扁平电缆连接器（FC连接器）。 引入具有上接线端子和下接线端子的辅助配线板，以将交替的FFC的另一个交替的FFC的窄节距导体连接到FC连接器的交替的上接触端子和下接触端子中的另一个 ，从而使上下布线端子的间距成为FFC和FC连接器的窄间距的两倍。 因此，通过使用辅助配线基板来进行配线间距的转换，即使形成在接触端子上也能够防止晶须在相邻的接线端子之间和相邻配线端子之间产生短路。

公开(公告)号：US07342750B2

公开(公告)日：2008-03-11

申请号：US10870082

申请日：2004-06-16

Applicant: Chao-Hui Yang ,  Yen Fu ,  Li-Yan Zhu ,  Manny Hernandez ,  Ellis T. Cha ,  Yong Luo

Inventor： Chao-Hui Yang ,  Yen Fu ,  Li-Yan Zhu ,  Manny Hernandez ,  Ellis T. Cha ,  Yong Luo

IPC: G11B5/48

CPC classification number: G11B5/486 ,  G11B5/484 ,  H05K1/0228 ,  H05K1/056 ,  H05K3/4685 ,  H05K2201/09554 ,  H05K2201/0969 ,  H05K2201/097

Abstract: An externally wireless laminated suspension for a hard disk drive are disclosed. In one embodiment, the externally wireless laminated suspension has an insulating layer to electrically isolate a first and second electrical trace from a conductive support layer. The second electrical trace crosses over the first electrical trace. The first electrical trace may be made of a first part on one side of the second electrical trace and a second part on the opposite side of the electrical trace. A conductive island area may be patterned into the support layer. The conductive island area may electrically couple the first part of the first electrical trace to the second part. The number of crossover points that the first electrical trace has may equal the number of crossover points that the second electrical trace has.

Abstract translation: 公开了一种用于硬盘驱动器的外部无线层叠悬架。 在一个实施例中，外部无线层叠悬架具有绝缘层，以将第一和第二电迹线与导电支撑层电隔离。 第二电迹线穿过第一电迹线。 第一电迹线可以由第二电迹线的一侧上的第一部分和在电迹线的相对侧上的第二部分制成。 导电岛区域可以被图案化成支撑层。 导电岛区域可以将第一电迹线的第一部分电耦合到第二部分。 第一电迹线具有的交叉点的数量可以等于第二电迹线具有的交叉点的数量。

公开(公告)号：US07271985B1

公开(公告)日：2007-09-18

申请号：US10949654

申请日：2004-09-24

Applicant: Otto Richard Buhler ,  Jeffrey Glenn Villiard ,  Kevin Dale McKinstry ,  Ricky Lee Ewasko

Inventor： Otto Richard Buhler ,  Jeffrey Glenn Villiard ,  Kevin Dale McKinstry ,  Ricky Lee Ewasko

IPC: G11B5/48

CPC classification number: H05K1/0228 ,  G11B5/48 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0245 ,  H05K1/0393 ,  H05K2201/097

Abstract: A system for reducing signal crosstalk in a flexible trace interconnect array includes a flexible dielectric material base, and a plurality of conductors longitudinally arranged as pairs in a signal layer array on the base. At least one of the pairs of conductors comprises a twisted pair.

Abstract translation: 用于减少柔性迹线互连阵列中的信号串扰的系统包括柔性电介质材料基底和在基底上纵向排列成信号层阵列中的多个导体。 导体对中的至少一个包括双绞线。

公开(公告)号：US07231707B2

公开(公告)日：2007-06-19

申请号：US10784324

申请日：2004-02-23

Applicant: Peter R. Nuytkens ,  Ilya E. Popeko ,  Joseph M. Kulinets

Inventor： Peter R. Nuytkens ,  Ilya E. Popeko ,  Joseph M. Kulinets

IPC: H01F7/06

CPC classification number: H05K1/165 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/365 ,  H01F41/02 ,  H01F41/046 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/15153 ,  H05K3/184 ,  H05K3/381 ,  H05K3/4614 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2203/072 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: Method of forming a ferromagnetic layer on at least one surface of a dielectric material that may be serve as an inductive core on a printed circuit board or a multichip module. Conductive leads can form two separate coils around the core to form a transformer, and a planar conducing sheet can be placed on or between one or more of the dielectric layers as magnetic shielding. The core can be formed at least in part by electroless plating, and electroplating can be used to add a thicker layer of less conductive ferromagnetic material. Ferromagnetic layers are formed by dipping the dielectric surface in a solution containing catalytic metal particles having a slight dipole, and placing the surface in a metal salt to cause a layer containing metal to be electrolessly plated upon the dielectric. Surface roughening techniques can be used before the dipping to help attract the catalytic particles.

Abstract translation: 在介电材料的至少一个表面上形成铁磁层的方法，其可以用作印刷电路板或多芯片模块上的感应芯。 导电引线可以在芯周围形成两个分离的线圈，以形成变压器，并且可以将平面导电片放置在一个或多个介电层之间或其上，作为磁屏蔽。 芯可以至少部分地通过无电镀形成，并且可以使用电镀来添加更薄的较不导电的铁磁材料层。 通过将电介质表面浸渍在含有具有轻微偶极子的催化金属颗粒的溶液中并将表面放置在金属盐中以使含有金属的层无电镀在电介质上而形成铁磁层。 在浸渍之前可以使用表面粗糙化技术来帮助吸引催化剂颗粒。