公开(公告)号：US09049808B2

公开(公告)日：2015-06-02

申请号：US13213199

申请日：2011-08-19

Applicant: Masaru Takada ,  Fusaji Nagaya

Inventor： Masaru Takada ,  Fusaji Nagaya

IPC: H05K1/16 ,  H05K3/46 ,  H01L23/498

CPC classification number: H05K3/4602 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K2201/0209 ,  H05K2201/09136 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: [Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate.[Solution(s)] To lower the thermal expansion coefficient (CTE) to 20˜40 ppm, inorganic particles are added to core substrate 30 formed by impregnating glass-cloth core material with glass-epoxy resin. Furthermore, thickness (a) of core substrate 30 is set at 0.2 mm, thickness (b) of upper-surface-side first interlayer insulation layer (50A) at 0.1 mm, and thickness (c) of lower-surface-side second interlayer insulation layer (50B) at 0.1 mm. In setting so, using thin core substrate 30 and interlayer insulation layers (50A, 50B) without core material, it is thought that warping does not occur in the printed wiring board.

Abstract translation: [主题]提供即使没有芯材的层间绝缘层层叠在芯基板上也不发生翘曲的印刷电路板。 [溶液]为了将热膨胀系数（CTE）降低到20〜40ppm，将无机颗粒加入到通过用玻璃 - 环氧树脂浸渍玻璃布芯材料而形成的芯基板30中。 此外，芯基板30的厚度（a）设定为0.2mm，上表面侧的第一层间绝缘层（50A）的厚度（b）为0.1mm，下表面侧的第二中间层的厚度（c） 绝缘层（50B）为0.1mm。 在这样设置时，使用没有芯材料的薄芯基板30和层间绝缘层（50A，50B），认为在印刷线路板上不发生翘曲。

公开(公告)号：US20150092357A1

公开(公告)日：2015-04-02

申请号：US14504969

申请日：2014-10-02

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H05K3/18 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/113 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/562 ,  H01L25/00 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/144 ,  H05K1/183 ,  H05K3/244 ,  H05K3/282 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/0392 ,  H05K2203/0577 ,  H05K2203/0723 ,  H05K2203/1383

Abstract: A method for manufacturing a printed wiring board includes forming a resin insulation layer on an interlayer resin insulation layer and conductive circuits such that the resin insulation layer has first openings exposing pad portions in central portion of the interlayer layer and second openings exposing pad portions in peripheral portion of the interlayer layer, forming a seed layer on the resin insulation layer, in the first and second openings and on the pad portions, forming on the seed layer a plating resist such that the resist has resist openings exposing the second openings and having diameters greater than the second openings, filling the resist openings with electrolytic plating material via the seed layer such that metal posts are formed in the resist openings, removing the resist from the resin insulation layer, and removing the seed layer exposed on the resin insulation layer by the removing of the resist.

Abstract translation: 一种制造印刷电路板的方法包括在层间树脂绝缘层上形成树脂绝缘层和导电电路，使得树脂绝缘层具有露出层间层中心部分的焊盘部分的第一开口和暴露外围焊盘部分的第二开口 在所述第一和第二开口和所述垫部分上在所述树脂绝缘层上形成种子层，在所述种子层上形成电镀抗蚀剂，使得所述抗蚀剂具有抵抗开口暴露所述第二开口并且具有直径 大于第二开口，通过种子层用电解电镀材料填充抗蚀剂开口，使得在抗蚀剂开口中形成金属柱，从树脂绝缘层除去抗蚀剂，并且通过在树脂绝缘层上暴露的种子层除去 去除抗蚀剂。

公开(公告)号：US20150062851A1

公开(公告)日：2015-03-05

申请号：US14469782

申请日：2014-08-27

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi SHIMIZU ,  Wataru KANEDA ,  Hiromu ARISAKA ,  Akio ROKUGAWA

IPC: H05K1/11 ,  H05K1/09 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K3/421 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/115 ,  H05K1/116 ,  H05K3/38 ,  H05K3/4644 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/09381 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/2072 ,  H05K2203/0789 ,  H01L2924/00

Abstract: A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and exposes a surface of the first wiring layer. A first via arranged in the first through hole includes an end surface exposed to the surface of the first insulating layer. A gap is formed between the first insulating layer and the first via in the first through hole. A second wiring layer is stacked on the surface of the first insulating layer and the end surface of the first via. The second wiring layer includes a pad filling the gap. The pad is greater in planar shape than the first through hole.

Abstract translation: 布线板包括涂覆第一布线层的第一绝缘层。 第一通孔在第一绝缘层的表面上开放，并露出第一布线层的表面。 布置在第一通孔中的第一通孔包括暴露于第一绝缘层的表面的端表面。 在第一通孔中的第一绝缘层和第一通孔之间形成间隙。 在第一绝缘层的表面和第一通孔的端面上堆叠第二布线层。 第二布线层包括填充间隙的垫。 该垫的平面形状大于第一通孔。

公开(公告)号：US20140353021A1

公开(公告)日：2014-12-04

申请号：US14285733

申请日：2014-05-23

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Hidetoshi YUGAWA

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/10 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2201/09854 ,  H05K2201/2054 ,  H05K2201/2072 ,  H05K2203/1476

Abstract: A wiring board 10 includes a lower wiring conductor 1, an upper insulating layer 2 laminated on the lower wiring conductor 1 and having a via hole 5 where a bottom surface is the lower wiring conductor 1, and a via conductor 3 connected to the lower wiring conductor 1 and filling the via hole 5; and the upper insulating layer 2 includes a first resin layer 2a and a second resin layer 2b sequentially laminated on the lower wiring conductor 1, the via hole 5 has an annular groove 5a over a whole circumference of the inner wall in a boundary between both resin layers 2a and 2b, and the via conductor 3 fills the groove 5.

Abstract translation: 布线基板10具有：下布线导体1，层叠在下布线导体1上的上绝缘层2，底面是下布线导体1的通路孔5;以及与下布线 导体1并填充通孔5; 并且上绝缘层2包括顺序地层叠在下布线导体1上的第一树脂层2a和第二树脂层2b，通孔5在两个树脂之间的边界内的内壁的整个圆周上具有环形槽5a 层2a和2b，通孔导体3填充槽5。

公开(公告)号：US20140321075A1

公开(公告)日：2014-10-30

申请号：US13869881

申请日：2013-04-24

Applicant: APPLE INC.

Inventor： Kuo-Hua SUNG ,  Silvio GRESPAN

IPC: H05K13/04 ,  H05K1/11

CPC classification number: H05K1/118 ,  H01R12/62 ,  H01R43/0249 ,  H05K1/117 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/0969 ,  H05K2201/0979 ,  H05K2201/09854 ,  H05K2203/0126

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.

Abstract translation: 所描述的实施例通常涉及电子设备，更具体地涉及用于在电子设备内的组件之间形成机械和电连接的方法。 在一个实施例中，诸如柔性电缆的互连部件附接到诸如印刷电路板的基板。 可以在互连部件中产生穿过位于互连部件的一端上的接合焊盘的多个孔。 然后可以将互连部件与衬底上的接合焊盘对准，并使互连部件上的接合焊盘背离衬底。 可以通过互连部件将导电化合物注入孔中，在接合焊盘之间形成机械和电连接。 在一些实施例中，可以使用粘合剂层来进一步加强互连部件和基底之间的结合。

公开(公告)号：US08871641B2

公开(公告)日：2014-10-28

申请号：US13692303

申请日：2012-12-03

Applicant: ÅAC Microtec AB

Inventor： Peter Nilsson

IPC: H01L21/44 ,  H01L23/498 ,  H01L23/48 ,  H05K3/40 ,  B81C1/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/768 ,  H05K1/03 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K3/4076 ,  B81B2207/07 ,  B81C1/00095 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K3/002 ,  H05K3/0041 ,  H05K3/42 ,  H05K2201/09827 ,  H05K2201/09854 ,  H01L2924/00

Abstract: The present invention provides a wafer (3) comprising a through-wafer via (7) through the wafer (3) formed by a through-wafer via hole (9) and at least a first conductive coating (25). A substantially vertical sidewall (11) of the through-wafer via hole (9) except for a constriction (23) provides a reliable through-wafer via (7) occupying a small area on the wafer. The wafer (3) is preferably made of a semiconductor material, such as silicon, or a glass ceramic. A method for manufacturing such a wafer (3) is described.

Abstract translation: 本发明提供了一种晶片（3），其包括通过晶片通孔（9）和至少第一导电涂层（25）形成的晶片通孔（7）。 除了收缩部分（23）之外的贯通晶片通孔（9）的基本上垂直的侧壁（11）提供了占据晶片上的小面积的可靠的晶片通孔（7）。 晶片（3）优选由诸如硅的半导体材料或玻璃陶瓷制成。 描述制造这种晶片（3）的方法。

公开(公告)号：US20140216794A1

公开(公告)日：2014-08-07

申请号：US14169314

申请日：2014-01-31

Applicant: IBIDEN CO., LTD.

Inventor： Toshiaki HIBINO

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K3/429 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/0055 ,  H05K3/108 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072 ,  H05K2203/108 ,  H05K2203/1476

Abstract: A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor formed in the penetrating hole in the substrate such that the conductor is connecting the first conductive pattern on the first surface of the substrate and the second conductive pattern on the second surface of the substrate. The penetrating hole has a first opening portion opening on the first surface of the substrate, a second opening portion opening on the second surface of the substrate and a third opening portion connecting the first and second opening portions, and the third opening portion has the maximum diameter which is greater than the minimum diameters of the first and second opening portions.

Abstract translation: 印刷布线板包括：绝缘基板，具有穿过该基板形成的贯通孔，形成在基板的第一面上的第一导体图案，形成在基板的与第一面相反一侧的第二面上的第二导电图案;以及 形成在所述基板的所述贯通孔中的通孔导体，使得所述导体将所述基板的第一表面上的所述第一导电图案与所述基板的所述第二表面上的所述第二导电图案连接。 所述贯通孔具有在所述基板的第一面上开口的第一开口部，在所述基板的第二面上开口的第二开口部，以及连接所述第一开口部和所述第二开口部的第三开口部， 其直径大于第一和第二开口部分的最小直径。

公开(公告)号：US20140177223A1

公开(公告)日：2014-06-26

申请号：US13798903

申请日：2013-03-13

Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION

Inventor： Soichi Shibusawa ,  Yumiko Hayashida

IPC: F21V19/00

CPC classification number: F21V19/00 ,  F21K9/27 ,  F21K9/90 ,  F21S4/20 ,  H05K1/0286 ,  H05K1/142 ,  H05K3/368 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09127 ,  H05K2201/09854 ,  H05K2201/10106 ,  Y10T29/49002

Abstract: A light emitting module is a light emitting module including a substrate, a first area in which LED chips are mainly arranged and mounted in a longitudinal direction of the substrate in an area on one side of the longitudinal direction, a second area in which non-light emitting components are mainly mounted in an area on another side of the longitudinal direction of the substrate and a notch portion which is between the first area and the second area and formed on the substrate. The non-light emitting components are mountable across the notch portion between the first area and the second area. Further, the substrate is separable into the first area and the second area by the notch portion. Furthermore, the first area after separation is formed to be connectable consecutively with another light emitting module in the longitudinal direction.

Abstract translation: 发光模块是包括基板的发光模块，其中LED芯片主要在纵向方向的一侧的区域中沿基板的纵向方向主要布置并安装的第一区域， 发光部件主要安装在基板的纵向另一侧的区域和位于第一区域和第二区域之间并形成在基板上的切口部分。 非发光部件可安装在第一区域和第二区域之间的切口部分上。 此外，基板通过切口部分可分离成第一区域和第二区域。 此外，分离后的第一区域形成为在纵向方向上与另一个发光模块连续连接。

公开(公告)号：US20140151107A1

公开(公告)日：2014-06-05

申请号：US13845325

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： CHENG-MING WENG ,  WEI-MING CHENG ,  HAN-PEI HUANG

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K3/0032 ,  H05K3/42 ,  H05K3/426 ,  H05K2201/09563 ,  H05K2201/09709 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49165

Abstract: A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.

Abstract translation: 布线基板包括基板，第一导体层，第二导体层和通孔导体。 衬底具有第一表面，第二表面和至少一个通孔。 第一导体层形成在第一表面上，第二导体层形成在第二表面上。 通孔导体形成在用于电连接到第一导体层和第二导体层的通孔中。 通孔具有暴露在第一表面中的第一凹陷部分，暴露在第二表面中的第二凹部，以及在第一凹陷部分和第二凹陷部分之间的用于连接第一凹陷部分和第二凹陷部分的隧道部分 。 第一凹陷部分和第二凹陷部分是非同轴的。

公开(公告)号：US08729407B2

公开(公告)日：2014-05-20

申请号：US13480985

申请日：2012-05-25

Applicant: Kenichi Mori

Inventor： Kenichi Mori

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K3/425 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/002 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0152 ,  H05K2203/1572 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A wiring substrate includes a body including first and second surfaces, a trench having an opening on the first surface and including, a bottom surface, a side surface, and a slope surface that connects a peripheral part of the bottom surface to a one end part of the side surface and widens from the peripheral part to the one end part, the one end part being an end part opposite from the first surface, a hole including an end communicating with the bottom surface and another end being open on the second surface, a first layer filling at least a portion of the hole and including a top surface toward the trench, a second layer covering the top surface and formed on at least a portion of the trench except for a part of the side surface, and a third layer covering the second layer and filling the trench.

Abstract translation: 布线基板包括：主体，其包括第一表面和第二表面;沟槽，其在第一表面上具有开口，并且包括底表面，侧表面以及将底表面的周边部分连接到一个端部的倾斜表面 并且从所述周边部向所述一个端部变宽，所述一端部为与所述第一面相反的端部，所述端部与所述底面相连通，所述另一端在所述第二面上开口， 填充所述孔的至少一部分并且包括朝向所述沟槽的顶表面的第一层，覆盖所述顶表面并形成在除了所述侧表面的一部分之外的所述沟槽的至少一部分上的第二层，以及第三层 覆盖第二层并填充沟槽。