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公开(公告)号：US20180065538A1
公开(公告)日：2018-03-08
申请号：US15808542
申请日：2017-11-09
Applicant: UUSI, LLC
Inventor： David W. Shank
CPC classification number: B60Q1/0088 , H01R12/62 , H05B33/0803 , H05B33/0845 , H05B33/0854 , H05B33/086 , H05B37/0227 , H05K1/02 , H05K1/117 , H05K1/14 , H05K1/142 , H05K1/16 , H05K2201/04 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10151 , H05K2201/10356
Abstract: A vehicle accessory control component includes a first circuit board substrate and a second circuit board substrate. The first circuit board substrate has a plurality of circuit elements and an overall perimeter shape including an outer edge profile and a plurality of first deviations along the outer edge profile. The second circuit board substrate has a plurality of circuit elements an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations. The first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate. The outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile.
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公开(公告)号：US09840185B2
公开(公告)日：2017-12-12
申请号：US15362703
申请日：2016-11-28
Applicant: UUSI, LLC
Inventor： David W. Shank
CPC classification number: B60Q1/0088 , H01R12/62 , H05B33/0803 , H05B33/0845 , H05B33/0854 , H05B33/086 , H05B37/0227 , H05K1/02 , H05K1/117 , H05K1/14 , H05K1/142 , H05K1/16 , H05K2201/04 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10151 , H05K2201/10356
Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.
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公开(公告)号：US09774229B1
公开(公告)日：2017-09-26
申请号：US15601002
申请日：2017-05-22
Applicant: Milwaukee Electric Tool Corporation
Inventor： Matthew J. Mergener , Michael Kolden , William E. Check , Matthew P. Wycklendt , Andrew T. Beyerl
IPC: H02K7/14 , B25F5/00 , H02K5/04 , B25B21/02 , H02K11/215 , H02K11/33 , H05K1/11 , H05K1/02 , H02K29/08 , H02K21/04 , H02K9/06 , H02K11/38 , H05K7/20 , H05K1/18
CPC classification number: H02K7/145 , B25B21/02 , B25F5/00 , B25F5/008 , H02K5/04 , H02K9/06 , H02K11/215 , H02K11/33 , H02K11/38 , H02K21/046 , H02K29/08 , H02K2211/03 , H05K1/0203 , H05K1/113 , H05K1/18 , H05K7/20136 , H05K7/20436 , H05K2201/10053 , H05K2201/10151
Abstract: A power tool with a combined printed circuit board (PCB) that reduces internal wiring of the power tool and provides a large amount of air flow to internal components. In some instances, the combined PCB has a surfboard shape and includes a motor control unit and power switching elements (Field Effect Transistors or FETs). The combined surfboard PCB is located above the trigger, but below the motor and drive mechanism. In other instances, the combined PCB has a doughnut shape and is located coaxially with a motor shaft. The combined PCB may be positioned between a doughnut-shaped control PCB and the motor.
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34.发明申请公开(公告)号：US20170263391A1
公开(公告)日：2017-09-14
申请号：US15457002
申请日：2017-03-13
Applicant: CITIZEN ELECTRONICS CO., LTD. , CITIZEN WATCH CO., LTD.
Inventor： Ryo WAKUDA
CPC classification number: H01H13/83 , H01H13/023 , H01H15/005 , H01H2219/062 , H01H2227/032 , H05K1/181 , H05K2201/10053 , H05K2201/10106 , Y02P70/611
Abstract: In a first aspect of the present disclosure, a push switch includes a substrate including a first electrode and a second electrode that are arranged on an upper surface of the substrate; a resilient member arranged on the first electrode over the second electrode of the substrate; and a light-transmitting member including a crosslinked product of a chain olefin-cyclic olefin copolymer. The light-transmitting member covers the resilient member from above and includes an upper surface, a lower surface, a peripheral side surface between edges of the upper surface and edges of the lower surface of the light-transmitting member, and a periphery of the lower surface of the light-transmitting member. The periphery may be fixed on the substrate.
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公开(公告)号：US09706657B2
公开(公告)日：2017-07-11
申请号：US14969585
申请日：2015-12-15
Applicant: KYOCERA Corporation
Inventor： Kengo Suzuki , Kouji Morimoto
CPC classification number: H05K1/118 , H05K1/028 , H05K1/189 , H05K3/281 , H05K2201/053 , H05K2201/056 , H05K2201/10053 , H05K2201/10189
Abstract: A flexible board includes: a base film, on which a wiring pattern is formed; a first cover film, which is located on one surface of the base film; and a second cover film, which is located on the other surface of the base film. The bending portion, which is bent when mounting the flexible board on an electronic apparatus, includes both edges on which the first cover film is formed and a central portion from which the base film is exposed.
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Patent Agency Ranking
公开(公告)号：US09693473B2
公开(公告)日：2017-06-27
申请号：US14624427
申请日：2015-02-17
Applicant: KYOCERA Corporation
Inventor： Kouta Hibino , Hiroyoshi Kawanishi
CPC classification number: H05K5/03 , G06F1/1626 , G06F1/1656 , G06F1/1679 , H01H13/14 , H01H2223/036 , H01H2223/04 , H05K1/0306 , H05K1/115 , H05K5/0217 , H05K7/1427 , H05K2201/10053
Abstract: A cover panel made of sapphire is provided on a surface of an electronic apparatus. The cover panel includes a first surface and a second surface opposite to the first surface. An operation button is positioned in a hole provided in the cover panel. A case supports the second surface of the cover panel. The case supports and covers an edge of the hole of the second surface.
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公开(公告)号：US20170111992A1
公开(公告)日：2017-04-20
申请号：US14934781
申请日：2015-11-06
Applicant: MR Label Company
Inventor： Patrick H. Meehan, JR.
CPC classification number: C22C9/06 , H05K1/16 , H05K3/202 , H05K2201/0367 , H05K2201/10053 , H05K2201/2036
Abstract: Control panels with antimicrobial copper sheet overlays are disclosed. In some embodiments, the antimicrobial copper used in the copper sheet overlays can be selected from copper or copper alloys containing from about 60 to about 100 wt % copper. In other embodiments, the copper sheet overlays have one or more deflection spots to permit an operator to use the control panel to operate an electronic device. Some embodiments include methods to manufacture the control panels comprising antimicrobial copper sheet overlays. Further embodiments include methods for operating an electronic device using the control panels comprising antimicrobial copper sheet overlays.
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公开(公告)号：US20170055352A1
公开(公告)日：2017-02-23
申请号：US15086101
申请日：2016-03-31
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Jun Young LEE
CPC classification number: H05K1/181 , H05K1/0215 , H05K7/142 , H05K2201/10053 , H05K2201/10166 , H05K2201/10181 , H05K2201/10189 , H05K2201/10196
Abstract: A device includes a circuit board, a plastic case accommodating the circuit board therein, the plastic case protecting the circuit board, and a plurality of conductive support members supporting the circuit board such that the circuit board is fixed to the plastic case. In the device, the conductive support members are fixed to the circuit board inside the plastic case, and extend to the outside of the plastic case to be fixed to the plastic case.
Abstract translation: 一种装置包括电路板，容纳电路板的塑料壳，保护电路板的塑料壳和支撑电路板的多个导电支撑构件，使得电路板固定到塑料外壳。 在该装置中，导电支撑构件固定在塑料外壳内的电路板上，并延伸到塑料外壳的外侧以固定在塑料外壳上。
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公开(公告)号：US20170033773A1
公开(公告)日：2017-02-02
申请号：US15218574
申请日：2016-07-25
Applicant: Nuvotronics, Inc.
Inventor： J. Robert Reid
IPC: H03H19/00
CPC classification number: H03H19/004 , H01P1/202 , H05K1/144 , H05K2201/10053
Abstract: Switched filter banks realized in a stacked arrangement.
Abstract translation: 开关滤波器组以堆叠方式实现。
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40.发明授权公开(公告)号：US09560749B2
公开(公告)日：2017-01-31
申请号：US14216916
申请日：2014-03-17
Applicant: Apple Inc.
Inventor： Craig M. Stanley , Phillip Qian , Erik L. Wang
CPC classification number: H05K1/028 , H05K1/0278 , H05K1/11 , H05K1/118 , H05K1/14 , H05K1/147 , H05K1/148 , H05K3/284 , H05K3/4691 , H05K2201/10053 , H05K2203/1316
Abstract: An electronic device may have circuitry mounted on a printed circuit board. The circuitry may include electronic components such as integrated circuits, sensors, and switches that are sensitive to bending-induced stress in the printed circuit board. An overmolded plastic stress concentrator may be overmolded over the printed circuit board and the circuitry on the printed circuit board. A flexible plastic body may be used to enclose the stress concentrator and printed circuit board. The plastic body, stress concentrator, and printed circuit board may be elongated along a longitudinal axis. The stress concentrator may have unbent regions in which the printed circuit board is prevented from flexing and enhanced flexibility regions. Sensitive circuitry may be located in the unbent regions to prevent the sensitive circuitry from being exposed to bending stress.
Abstract translation: 电子设备可以具有安装在印刷电路板上的电路。 该电路可以包括对印刷电路板中的弯曲引起的应力敏感的电子部件，例如集成电路，传感器和开关。 包覆成型的塑料应力集中器可以在印刷电路板和印刷电路板上的电路上包覆成型。 柔性塑料体可用于封闭应力集中器和印刷电路板。 塑料体，应力集中器和印刷电路板可以沿着纵向轴线伸长。 应力集中器可以具有其中防止印刷电路板弯曲和增强柔性区域的未吸附区域。 敏感电路可以位于未吸附区域中，以防止敏感电路暴露于弯曲应力。
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