公开(公告)号：US20140004760A1

公开(公告)日：2014-01-02

申请号：US13919083

申请日：2013-06-17

Applicant: FUJITSU COMPONENT LIMITED

Inventor： Koichi Kiryu ,  Manabu Shimizu

IPC: H01R13/05

CPC classification number: H01R13/05 ,  H01R12/57 ,  H01R12/718 ,  H01R13/2464 ,  H01R13/6474 ,  H01R2101/00 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A contact member that electrically connects a first board and a second board includes a first joining part including a first surface to be joined to the first board, a contact point part to come into contact with the second board, a first contact part that faces and comes into contact with a second surface of the first joining part opposite to the first surface, a first bent portion formed by bending a portion of the contact member between the first joining part and the first contact part, a second bent portion formed by bending a portion of the contact member between the first contact part and the contact point part in a direction opposite to a direction in which the first bent portion is bent, and an attracted part that extends from the contact point part in a direction away from the second bent portion.

Abstract translation: 电连接第一板和第二板的接触构件包括：第一接合部，其包括要接合到第一板的第一表面，与第二板接触的接触点部分， 与第一接合部的与第一表面相对的第二表面接触;第一弯曲部，其通过在第一接合部和第一接触部之间弯曲接触部件的一部分而形成;第二弯曲部， 所述接触构件在所述第一接触部与所述接触点部之间的与所述第一弯曲部弯曲的方向相反的方向上的部分，以及从所述接触点向远离所述第二弯曲部的方向延伸的吸引部 一部分。

公开(公告)号：US20130277818A1

公开(公告)日：2013-10-24

申请号：US13977911

申请日：2011-01-20

Applicant: Chi Hock Goh ,  Soon Peng Jason Sim ,  Poh Boon Teo

Inventor： Chi Hock Goh ,  Soon Peng Jason Sim ,  Poh Boon Teo

IPC: H01L23/00

CPC classification number: H01L23/562 ,  H01L21/67333 ,  H01L24/83 ,  H01L2224/83 ,  H01L2924/14 ,  H05K1/0271 ,  H05K3/3436 ,  H05K2201/1031 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: In one embodiment, a chip carrier support system includes a chip carrier support structure and a chip carrier. The chip carder forms a complementary fit with the chip carder support structure and includes an integrated circuit and a plurality of leads in communication with the integrated circuit.

Abstract translation: 在一个实施例中，芯片载体支撑系统包括芯片载体支撑结构和芯片载体。 芯片卡片器与芯片卡片支持结构形成互补配合，并且包括集成电路和与集成电路通信的多个引线。

公开(公告)号：US20130149897A1

公开(公告)日：2013-06-13

申请号：US13614634

申请日：2012-09-13

Applicant: Tomohito TAKANO ,  Akio FUNAHASHI

Inventor： Tomohito TAKANO ,  Akio FUNAHASHI

IPC: H01R9/05

CPC classification number: H01R12/718 ,  H01R12/585 ,  H01R13/052 ,  H01R24/50 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/1031 ,  H05K2201/10356 ,  H05K2201/1059 ,  Y02P70/611

Abstract: An electrical coaxial connector comprising a signal contact member having a connecting terminal portion and a resilient engaging portion, a grounding contact member having an annular engaging portion for engaging with a mating connector fixed on a circuit board and a shell portion extending from the annular engaging portion, and a housing for supporting the signal contact member and the grounding contact member, wherein the resilient engaging portion is positioned at the inside of the annular engaging portion, the connecting terminal portion is put in electrical connection with a core conductor of a coaxial cable at the outside of the annular engaging portion, and the resilient engaging portion extends from the connecting terminal portion through the mating connector to engage with a signal terminal provided on the circuit board to which the mating connector is fixed.

Abstract translation: 一种电气同轴连接器，包括具有连接端子部分和弹性接合部分的信号接触部件，接地触头部件具有用于与固定在电路板上的匹配连接器接合的环形接合部分和从环形接合部分延伸的壳体部分 以及用于支撑信号接触构件和接地接触构件的壳体，其中弹性接合部分位于环形接合部分的内侧，连接端子部分与同轴电缆的芯导体电连接 环形接合部分的外部，弹性接合部分通过配合连接器从连接端子部分延伸，以与配置连接器固定在电路板上的信号端接合。

公开(公告)号：US20120292660A1

公开(公告)日：2012-11-22

申请号：US13521294

申请日：2011-01-18

Applicant: Hideyuki Kanno

Inventor： Hideyuki Kanno

IPC: H01L33/62

CPC classification number: H01L33/647 ,  F21K9/90 ,  F21V7/05 ,  F21V17/12 ,  F21Y2101/00 ,  F21Y2103/33 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/01322 ,  H05K1/0203 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10962 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact.

Abstract translation: LED装置（27）具有直接安装在金属触点（28）上的LED裸芯片（25），并且向裸芯片供电并通过金属触点从裸芯片传导热量。

公开(公告)号：US20120270423A1

公开(公告)日：2012-10-25

申请号：US13518104

申请日：2010-12-21

Applicant: Mituru Iida

Inventor： Mituru Iida

IPC: H01R12/73

CPC classification number: H01R12/7082 ,  H01R12/79 ,  H05K3/365 ,  H05K2201/0397 ,  H05K2201/1031 ,  H05K2201/10446 ,  H05K2201/1059 ,  Y02P70/611

Abstract: The connector includes a male connector block and a female connector block. The male connector block includes a base substrate formed of an insulating flat member; a conductive projection arranged on one surface of the base substrate; a first circuit pattern led out from the conductive projection; and a soldering terminal section electrically connected to the conductive projection through the first circuit pattern. The female connector block includes: an insulating film having a fitting insertion section; a conductive section formed on one surface of the insulating film and electrically connected to the conductive projection inserted into the fitting insertion section; a second circuit pattern led out from the conductive section; a soldering terminal section electrically connected to the conductive section through the second circuit pattern; and a second base substrate making close contact with the other surface of the insulating film.

Abstract translation: 连接器包括阳连接器块和阴连接器块。 阳连接器块包括由绝缘平板构件形成的基底; 布置在所述基底基板的一个表面上的导电突起; 从导电突起引出的第一电路图案; 以及通过第一电路图案与导电突起电连接的焊接端子部。 阴连接器块包括：具有配件插入部的绝缘膜; 导电部，形成在所述绝缘膜的一个表面上并与插入到所述嵌合件插入部的所述导电突起电连接; 从导电部分引出的第二电路图案; 焊接端子部分，通过第二电路图形电连接到导电部分; 以及与绝缘膜的另一表面紧密接触的第二基底基板。

公开(公告)号：US20120018747A1

公开(公告)日：2012-01-26

申请号：US13187515

申请日：2011-07-21

Applicant: ANDREW CHENG ,  CHIH-PI CHENG

Inventor： ANDREW CHENG ,  CHIH-PI CHENG

IPC: H01L33/62 ,  H01L33/08 ,  H01L33/52

CPC classification number: H05K3/32 ,  F21K9/90 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48472 ,  H05K3/284 ,  H05K2201/0311 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/1031 ,  Y02P70/611

Abstract: An LED lead frame assembly comprises a wiring board having a plurality set of positive and negative poles arranged on a top surface thereof A plurality of LED chips are disposed on the wiring board, and electrically bonded to the bus line. A transparent cover is arranged upon the wiring board and covering the LED chip and the conductive lead.

Abstract translation: LED引线框架组件包括布置在其顶表面上的多组正极和负极的布线板。多个LED芯片设置在布线板上，并电连接到总线上。 透明盖布置在接线板上并覆盖LED芯片和导电引线。

公开(公告)号：US20110211314A1

公开(公告)日：2011-09-01

申请号：US12662242

申请日：2010-04-07

Applicant: Yu Hong-Chi

Inventor： Yu Hong-Chi

IPC: H05K7/20

CPC classification number: H01R12/716 ,  H01L23/367 ,  H01L23/48 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01R12/73 ,  H05K1/0203 ,  H05K1/117 ,  H05K3/32 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/10159 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A high-density integrated circuit module structure comprises a substrate and a heat sink at least wherein the substrates form a reversely-staggered contacting stack structure by electrically contacting heat sinks and heat conductors on the heat sink have a non-flat structure at least to realize the present invention which extends the product's functions within an electronic product's restricted height and has a better vibration resistance capability, heat dissipation effect, and no steps involving junctions between solder balls and a carrier in an assembling procedure to simply an assembling procedure with improved functions, increased capacity, and reduced manufacturing costs.

Abstract translation: 高密度集成电路模块结构包括基板和散热片，至少其中基板通过电接触散热器形成反交错的接触叠层结构，散热片上的热导体具有非平坦结构，至少实现 本发明在电子产品的限制高度内延伸产品的功能，并且具有更好的抗振动能力，散热效果，并且在组装过程中没有包括焊球和载体之间的接合的步骤，简单地具有改进的功能的组装过程， 增加容量，降低制造成本。

公开(公告)号：US20110187003A1

公开(公告)日：2011-08-04

申请号：US13086499

申请日：2011-04-14

Applicant: Takeshi Oi ,  Seiji Oka ,  Yoshiko Obiraki ,  Osamu Usui ,  Yasushi Nakayama

Inventor： Takeshi Oi ,  Seiji Oka ,  Yoshiko Obiraki ,  Osamu Usui ,  Yasushi Nakayama

IPC: H01L27/12

CPC classification number: H05K3/32 ,  H01L23/3121 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/284 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

Abstract: A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits.

Abstract translation: 功率半导体器件包括接合到电路基板的布线图案的电力半导体元件，圆柱形外部端子连通部分和用于形成例如功率半导体元件和圆筒形外部端子连接部分之间的电连接的布线装置。 功率半导体元件，圆筒形外部端子连通部分和布线装置用传递模塑树脂密封。 圆筒形的外部端子连通部分布置在布线图案上，以便大致垂直于布线图案，使得外部端子可插入并可连接到圆柱形外部端子连通部分，并且使得多个圆柱形外部端子连通部分 在作为主电路的每个布线图案上，圆柱形外部端子通信部分二维布置。

公开(公告)号：US20110053392A1

公开(公告)日：2011-03-03

申请号：US12856940

申请日：2010-08-16

Applicant: Yoshihiro IHARA

Inventor： Yoshihiro IHARA

IPC: H01R12/30

CPC classification number: H01R12/57 ,  H01R13/2435 ,  H05K3/32 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0949 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10962 ,  Y02P70/611

Abstract: Connection terminals each include: a bonding portion bonded to a pad of a substrate; a contacting portion disposed to face the bonding portion; a spring portion present between the bonding portion and the contacting portion; and an engaging portion engaged with a portion of a slit provided in a plate-like member. These constituent portions of the connection terminal are formed integrally with each other. The plate-like member has recessed portions formed at predetermined positions, and the connection terminals are electrically connected to the pads of the substrate with the bonding portions of the connection terminals being locked to the recessed portions.

Abstract translation: 连接端子各自包括：结合到基板的焊盘的接合部分; 接触部，设置成面对所述接合部; 存在于所述接合部和所述接触部之间的弹簧部; 以及与设置在板状构件中的狭缝的一部分接合的接合部。 连接端子的这些构成部分彼此一体地形成。 板状构件具有形成在预定位置的凹部，连接端子与基板的焊盘电连接，连接端子的接合部分被锁定到凹部。

公开(公告)号：US20100331050A1

公开(公告)日：2010-12-30

申请号：US12797421

申请日：2010-06-09

Applicant: Ui-Soo TAHK ,  Kyoung-Hwa Kim

Inventor： Ui-Soo TAHK ,  Kyoung-Hwa Kim

IPC: H04B1/38 ,  H04M1/00

CPC classification number: H05K3/366 ,  H01Q1/243 ,  H01Q1/38 ,  H01R13/2442 ,  H01R2201/02 ,  H04M1/236 ,  H05K1/141 ,  H05K1/182 ,  H05K3/325 ,  H05K3/403 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10446 ,  Y02P70/611

Abstract: A portable terminal includes a circuit board having edge and component mounting surfaces. The edge surface includes a first contact terminal and an antenna includes a second contact terminal. The component mounting surface is at least substantially parallel with a display screen of the terminal and the edge surface is at least substantially perpendicular to the display screen. The first and second contact terminals are coupled together to establish an electrical connection between the circuit board and antenna when the antenna and edge surface are mounted in parallel to one another within a housing of the terminal.

Abstract translation: 便携式终端包括具有边缘和部件安装表面的电路板。 边缘表面包括第一接触端子，天线包括第二接触端子。 元件安装表面至少基本上与端子的显示屏平行，并且边缘表面至少基本上垂直于显示屏。 当天线和边缘表面在端子的壳体内彼此平行地安装时，第一和第二接触端子耦合在一起以在电路板和天线之间建立电连接。