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    Lightweight electronic device for automotive applications and method
    31.
    发明授权
    Lightweight electronic device for automotive applications and method 有权
    汽车应用轻便电子设备及方法

    公开(公告)号：US08681507B2

    公开(公告)日：2014-03-25

    申请号：US13344807

    申请日：2012-01-06

    Applicant: Edgar Glenn Hassler

    Inventor： Edgar Glenn Hassler

    IPC: H05K5/00

    CPC classification number: H05K3/00 ,  B29C70/68 ,  B29C70/882 ,  B29C70/885 ,  H04B1/082 ,  H05K1/0215 ,  H05K1/141 ,  H05K7/12 ,  H05K7/14 ,  H05K7/1417 ,  H05K7/142 ,  H05K7/1422 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T428/24917

    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

    Abstract translation: 用于车辆应用的轻量级无线电/ CD播放器实际上是“无紧固件”，并且包括由聚合物基材料形成的壳体和正面接口，其被模制以提供细节以接收音频设备，如回放机构（如果需要）和无线电接收器，以及 作为电气控制和显示所需的电路板。 外壳和正面接口为复合结构，包括已经通过模制操作预先形成轮廓的镶嵌模制导电丝网。 金属丝网通过暴露的金属丝网垫和相邻的接地夹提供EMC，RFI，BCI和ESD屏蔽和电路板的接地。 主要部件和组件通过整体引导和连接功能自我互连，实现“滑动锁定”和“卡锁”自动互连。 主要部件和子组件通过与裸露的，弹性的，压花的网状部分形成过盈配合而自我研磨。

    CIRCUIT BOARD SYSTEM
    34.
    发明申请
    CIRCUIT BOARD SYSTEM 审中-公开
    电路板系统

    公开(公告)号：US20130344716A1

    公开(公告)日：2013-12-26

    申请号：US13919243

    申请日：2013-06-17

    Applicant: TELLABS OY

    Inventor： Alf BJORKLOF ,  Antti HOLMA

    IPC: H01R13/04 ,  H01R43/20

    CPC classification number: H01R13/04 ,  H01R43/205 ,  H05K3/222 ,  H05K3/306 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/4913

    Abstract: A method for manufacturing a circuit board system includes attaching (501), to a circuit board, electrical components that constitute together with the circuit board a first functional entity and a second functional entity that are disconnected from each other so that operations of the first and second functional entities are substantially free from mutual interactions. The method includes directing (502) electrical activity, for example testing and/or data loading, to the first functional entity and/or to the second functional entity. Subsequently, the method includes providing (503) at least one galvanic connection between the first and second functional entities by pushing one or more press-fit pins in holes of the circuit board in order to enable the first and second functional entities to co-operate with each other. The method allows functional entity-specific testing, data loading, and other electrical activity after e.g. a soldering process and prior to possible functionality testing (504).

    Abstract translation: 一种用于制造电路板系统的方法，包括：将与所述电路板一起构成的第一功能实体和第二功能实体与电路板连接（501），所述第一功能实体和第二功能实体彼此断开连接，使得所述第一和第 第二功能实体基本上没有相互作用。 该方法包括将电活动（例如测试和/或数据加载）引导（502）到第一功能实体和/或第二功能实体。 随后，该方法包括在第一和第二功能实体之间提供（503）至少一个电流连接，通过将一个或多个压配合引脚推入电路板的孔中，以使第一和第二功能实体能够合作 与彼此。 该方法允许功能实体特异性测试，数据加载和其他电活动。 焊接过程和可能的功能测试之前（504）。

    CONNECTOR, CIRCUIT MODULE, AND ELECTRONIC APPARATUS
    36.
    发明申请
    CONNECTOR, CIRCUIT MODULE, AND ELECTRONIC APPARATUS 审中-公开
    电路模块和电子设备连接器

    公开(公告)号：US20130308283A1

    公开(公告)日：2013-11-21

    申请号：US13734116

    申请日：2013-01-04

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Ichioh Murakami

    IPC: H01R13/46 ,  H05K5/00 ,  H05K1/00

    CPC classification number: H01R13/465 ,  H01R12/724 ,  H01R43/0263 ,  H05K1/00 ,  H05K1/0269 ,  H05K1/18 ,  H05K5/0069 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2203/168

    Abstract: According to one embodiment, a connector includes a connector main body, and a mark. The connector main body is mounted on a connector mounting portion of a substrate, and has an outer surface extending along a direction intersecting with a mounting surface. The mark is provided on the outer surface of the connector main body. The mark configured to indicate a degree of tilt of the connector main body relative to the mounting surface.

    Abstract translation: 根据一个实施例，连接器包括连接器主体和标记。 连接器主体安装在基板的连接器安装部分上，并且具有沿着与安装表面相交的方向延伸的外表面。 标记设置在连接器主体的外表面上。 该标记被构造成指示连接器主体相对于安装表面的倾斜程度。

    Portable terminal
    37.
    发明授权
    Portable terminal 有权
    便携式终端

    公开(公告)号：US08587485B2

    公开(公告)日：2013-11-19

    申请号：US12797421

    申请日：2010-06-09

    Applicant: Ui-Soo Tahk ,  Kyoung-Hwa Kim

    Inventor： Ui-Soo Tahk ,  Kyoung-Hwa Kim

    IPC: H01Q1/24

    CPC classification number: H05K3/366 ,  H01Q1/243 ,  H01Q1/38 ,  H01R13/2442 ,  H01R2201/02 ,  H04M1/236 ,  H05K1/141 ,  H05K1/182 ,  H05K3/325 ,  H05K3/403 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10446 ,  Y02P70/611

    Abstract: A portable terminal includes a circuit board having edge and component mounting surfaces. The edge surface includes a first contact terminal and an antenna includes a second contact terminal. The component mounting surface is at least substantially parallel with a display screen of the terminal and the edge surface is at least substantially perpendicular to the display screen. The first and second contact terminals are coupled together to establish an electrical connection between the circuit board and antenna when the antenna and edge surface are mounted in parallel to one another within a housing of the terminal.

    Abstract translation: 便携式终端包括具有边缘和部件安装表面的电路板。 边缘表面包括第一接触端子，天线包括第二接触端子。 元件安装表面至少基本上与端子的显示屏平行，并且边缘表面至少基本上垂直于显示屏。 当天线和边缘表面在端子的壳体内彼此平行地安装时，第一和第二接触端子耦合在一起以在电路板和天线之间建立电连接。

    Printed circuit board impedance matching step for microwave (millimeter wave) devices
    39.
    发明授权
    Printed circuit board impedance matching step for microwave (millimeter wave) devices 有权
    微波（毫米波）器件的印刷电路板阻抗匹配步骤

    公开(公告)号：US08547187B2

    公开(公告)日：2013-10-01

    申请号：US12895347

    申请日：2010-09-30

    Applicant: Hsueh-Yuan Pao ,  Jerardo Aguirre ,  Paul Sargis

    Inventor： Hsueh-Yuan Pao ,  Jerardo Aguirre ,  Paul Sargis

    IPC: H01P5/00 ,  H03H7/38

    CPC classification number: H01R24/50 ,  H05K1/0253 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2201/10189 ,  H05K2201/10446

    Abstract: An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.

    Abstract translation: 与印刷电路板中的四分之一波长变压器部分的阻抗匹配接地平面步骤提供了从板连接器或需要薄衬底到厚衬底（>四分之一波长）宽带微波（毫米波）的其它元件的宽带微波匹配过渡 ） 设备。 一种在均匀厚度的衬底上构造微波和其它高频电路的方法，其中电路由具有不同阻抗的多个互连元件形成，该互连元件分别需要不同厚度的衬底，通过提供均匀厚度的衬底， 复合或多层基材; 并且形成中间接地面或者阻抗匹配步骤的图案，所述中间接地平面或阻抗匹配步骤通过位于电路各部分的不同阻抗位置的通孔相互连接，使得电路的每个部分具有最佳的接地平面衬底厚度，而整个电路为 形成在均匀厚度的基底上。

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