公开(公告)号：US20140131082A1

公开(公告)日：2014-05-15

申请号：US13764184

申请日：2013-02-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu AHN ,  Min Cheol PARK ,  Tae Hyeok KIM ,  Sang Soo PARK

IPC: H05K1/02 ,  H01G4/12

CPC classification number: H01G4/12 ,  H01G2/065 ,  H01G4/012 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/613

Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer, the lower cover layer being thicker than the upper cover layer; a dummy electrode formed inside at least one of the upper and lower cover layers; and first and second external electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.

Abstract translation: 提供一种多层陶瓷电容器，包括：陶瓷体; 包括多个第一和第二内部电极的有源层; 上盖层; 下覆盖层，下覆盖层比上覆盖层更厚; 形成在上盖层和下盖层中的至少一个内的虚拟电极; 以及第一和第二外部电极，其中当A定义为陶瓷体的总厚度的1/2时，B定义为下覆盖层的厚度，C定义为有源层的总厚度的1/2， 定义为上覆盖层的厚度，活性层的中心与陶瓷体的中心（B + C）/ A的偏差比满足1.063＆lt;（B + C）/ A＆nlE; 1.745。

公开(公告)号：US20140076621A1

公开(公告)日：2014-03-20

申请号：US13957342

申请日：2013-08-01

Applicant: Apple Inc.

Inventor： Shawn X. ARNOLD ,  Jeffrey M. THOMA ,  Connor R. DUKE ,  Yanchu XU ,  Nelson J. KOTTKE

IPC: H01G4/01 ,  H05K13/04 ,  B23K26/22 ,  H05K1/18

CPC classification number: H01G4/01 ,  B23K26/22 ,  H01G2/06 ,  H01G2/10 ,  H01G4/224 ,  H01G4/228 ,  H01G4/40 ,  H05K1/181 ,  H05K3/3442 ,  H05K13/0465 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10962 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

Abstract translation: 所描述的实施例通常涉及包括电容器的印刷电路板（PCB），更具体地涉及用于将电容器与PCB机械隔离的设计，以减少当电容器在PCB上施加压电力时产生的声学噪声。 导电特征可以机械地和电耦合到位于电容器两端的电极。 导电特征可以放置在由压电力产生的振动幅度相对较小的拐角处。 然后可以将导电特征焊接到PCB上的焊盘图案以形成机械和电连接，同时减少从电容器传递到PCB的振动能量的数量。

公开(公告)号：US20140060911A1

公开(公告)日：2014-03-06

申请号：US14010772

申请日：2013-08-27

Applicant: Allison Transmission, Inc.

Inventor： Steve D. Slagle ,  James D. Shaw ,  George C. Mimms ,  Kyle E. Erickson

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H01G4/35 ,  F16H57/0006 ,  H01G2/065 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H05K1/0231 ,  H05K1/18 ,  H05K1/181 ,  H05K3/30 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/2045 ,  H05K2203/1572 ,  Y02P70/611 ,  Y10T29/4913

Abstract: Devices and methods are disclosed for reducing vibration and noise from capacitor devices. The device includes a circuit board, and first and second capacitor structures. The second capacitor structure has substantially the same properties as the first and is coupled to the opposite face of a supporting structure substantially opposite of the first capacitor structure. The first and second capacitor structures can receive substantially the same excitation signals, can be electrically connected in parallel or in series. The first and second capacitor structures can be discrete capacitors, capacitor layers, stacks or arrays of multiple capacitor devices, or other capacitor structures. Stacks of multiple capacitor devices can be arranged symmetrically about the supporting structure. Arrays of multiple capacitor devices can be arranged with offsetting capacitors on the opposite face of the supporting structure substantially opposite one another.

Abstract translation: 公开了用于减少电容器装置的振动和噪声的装置和方法。 该装置包括电路板，以及第一和第二电容器结构。 第二电容器结构具有与第一电容器结构基本上相同的特性，并且耦合到与第一电容器结构基本相反的支撑结构的相对面。 第一和第二电容器结构可以接收基本上相同的激励信号，可以并联或串联电连接。 第一和第二电容器结构可以是分立电容器，电容器层，堆叠或多个电容器器件的阵列，或其它电容器结构。 可以围绕支撑结构对称地布置多个电容器装置的堆叠。 多个电容器器件的阵列可以在支撑结构的相对面上大致相反地布置有抵消电容器。

公开(公告)号：US20140008116A1

公开(公告)日：2014-01-09

申请号：US14027403

申请日：2013-09-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuo FUJII ,  Yoshinao NISHIOKA

IPC: H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0216 ,  H05K1/111 ,  H05K1/16 ,  H05K3/3442 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A mounting structure includes an electronic component mounted on a circuit board. Land electrodes are disposed on a board body and are connected to outer electrodes of the electronic component through solders, respectively. A distance from each of the land electrodes to a top of the corresponding solder is not larger than about 1.27 times a distance from each of the land electrodes to an exposed portion of a capacitor conductor exposed at an end surface of the electronic component, the capacitor conductor being positioned closest to the circuit board.

Abstract translation: 安装结构包括安装在电路板上的电子部件。 接地电极设置在电路板主体上，并分别通过焊料与电子部件的外部电极连接。 从每个焊盘电极到对应焊料的顶部的距离不大于从每个焊盘电极到暴露在电子部件的端面处的电容器导体的暴露部分的距离的大约1.27倍，电容器 导体定位成最靠近电路板。

公开(公告)号：US20130307636A1

公开(公告)日：2013-11-21

申请号：US13759402

申请日：2013-02-05

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kanehisa KIMBARA ,  Osamu KAWACHI

IPC: H03H9/70

CPC classification number: H03H9/46 ,  H03H9/0542 ,  H03H9/70 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10204 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A composite electronic component includes: a circuit board; a package that includes an acoustic wave filter and is located on a top surface of the circuit board; a dummy package that is located on the top surface of the circuit board; and a lid that is located above the package and the dummy package.

Abstract translation: 复合电子部件包括：电路板; 包括声波滤波器并且位于电路板的顶表面上的封装; 位于电路板的顶表面上的虚拟封装; 以及位于包装和虚拟包装上方的盖子。

公开(公告)号：US20130233606A1

公开(公告)日：2013-09-12

申请号：US13873303

申请日：2013-04-30

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Yasuo FUJII ,  Yoshinao NISHIOKA

IPC: H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0216 ,  H05K1/111 ,  H05K1/16 ,  H05K3/3442 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A mounting structure includes an electronic component mounted on a circuit board. Land electrodes are disposed on a board body and are connected to outer electrodes of the electronic component through solders, respectively. A distance from each of the land electrodes to a top of the corresponding solder is not larger than about 1.27 times a distance from each of the land electrodes to an exposed portion of a capacitor conductor exposed at an end surface of the electronic component, the capacitor conductor being positioned closest to the circuit board.

Abstract translation: 安装结构包括安装在电路板上的电子部件。 接地电极设置在电路板主体上，并分别通过焊料与电子部件的外部电极连接。 从每个焊盘电极到对应焊料的顶部的距离不大于从每个焊盘电极到暴露在电子部件的端面处的电容器导体的暴露部分的距离的大约1.27倍，电容器 导体定位成最靠近电路板。

公开(公告)号：US20120298407A1

公开(公告)日：2012-11-29

申请号：US13481348

申请日：2012-05-25

Applicant: Young Ghyu AHN ,  Byoung Hwa Lee ,  Min Cheol Park ,  Sang Soo Park ,  Dong Seok Park

Inventor： Young Ghyu AHN ,  Byoung Hwa Lee ,  Min Cheol Park ,  Sang Soo Park ,  Dong Seok Park

IPC: H05K1/16

CPC classification number: H05K1/111 ,  H01G4/12 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. The mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, in which a dielectric layer on which inner electrodes are disposed is stacked and external electrode terminals connecting the inner electrodes in parallel are disposed on both ends thereof, wherein the inner electrodes of the multi-layered ceramic capacitor and the circuit board are disposed so as to be a horizontal direction to connect the external electrode terminals with a land on the circuit board by a conductive material and a ratio of a bonding area ASOLEDER of the conductive material to the area AMLCC of the external electrode terminals AMLCC is set to be less than 1.4, thereby remarkably reducing the vibration noise.

Abstract translation: 这里公开了一种其上具有多层陶瓷电容器的电路板的安装结构。 其上设置有多层陶瓷电容器的电路板的安装结构，其中布置有内部电极的电介质层，并且将其内部电极并联连接的外部电极端子设置在其两端，其中内部电极 将多层陶瓷电容器和电路板设置成水平方向，以通过导电材料将导电材料的外部电极端子与电路板上的焊盘接合，并且将导电材料的接合面积ASOLEDER与 外部电极端子AMLCC的面积AMLCC被设定为小于1.4，从而显着地降低了振动噪声。

公开(公告)号：US20120287591A1

公开(公告)日：2012-11-15

申请号：US13511765

申请日：2010-11-24

Applicant: Shigeki Ishikawa

Inventor： Shigeki Ishikawa

IPC: H05K1/14

CPC classification number: H01R12/613 ,  H01R12/57 ,  H01R12/91 ,  H05K1/142 ,  H05K1/147 ,  H05K2201/09263 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2201/10424 ,  H05K2201/2045 ,  H05K2203/0271

Abstract: A connection member that connects different boards, includes a plurality of conductive elastic members each of which includes two contact portions that are in contact with the different boards at ends, respectively, and an elastic portion that is provided between the two contact portions and is stretchable according to a force applied from outside the connection member, and an insulating restraining member that restrains movement of each of the elastic members by holding part of each of the elastic members, so that the force due to board vibrations applied to a joint of solder or the like can be relaxed.

Abstract translation: 连接不同板的连接构件包括多个导电弹性构件，每个导电弹性构件分别包括与端部处的不同板接触的两个接触部分，以及设置在两个接触部之间并且是可拉伸的弹性部分 根据从连接构件外部施加的力，以及绝缘抑制构件，其通过保持每个弹性构件的一部分来限制每个弹性构件的移动，使得由于板振动施加在焊接接头上的力或 这样可以放松。

公开(公告)号：US20120067634A1

公开(公告)日：2012-03-22

申请号：US12309118

申请日：2006-07-21

Applicant: Oskar Schallmoser

Inventor： Oskar Schallmoser

IPC: H05K1/16

CPC classification number: H05K1/0271 ,  H05K1/0231 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/1003 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: Surface mounted ceramic capacitors (14) on printed circuit boards (10′) are subject to vibrations (18) caused by the piezo effect. Other electronic components are subject to magnetostriction and likewise generate vibrations. In prior art, the vibrations can propagate (20) on a printed circuit board (10). To suppress the propagation of the vibrations caused by the electronic component (14), the invention provides at least one slot (22) in the printed circuit board (10′). The slot (22) extends, for example, parallel to a side wall of the electronic component (14).

Abstract translation: 印刷电路板（10'）上的表面安装陶瓷电容器（14）受到由压电效应引起的振动（18）。 其他电子元件会受到磁致伸缩的影响，并产生振动。 在现有技术中，振动可以在印刷电路板（10）上传播（20）。 为了抑制由电子部件（14）引起的振动的传播，本发明在印刷电路板（10'）中提供至少一个槽（22）。 槽（22）例如平行于电子部件（14）的侧壁延伸。

公开(公告)号：US20100277880A1

公开(公告)日：2010-11-04

申请号：US12433541

申请日：2009-04-30

Applicant: Jenq-Gong DUH ,  Chia-Yen Tan

Inventor： Jenq-Gong DUH ,  Chia-Yen Tan

IPC: H01R12/00

CPC classification number: H01R4/01 ,  H05K1/0271 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/068 ,  H05K2201/2045 ,  Y02P70/613

Abstract: The present invention discloses an electronic package structure, which comprises an electronic element, a plurality of SMA (Shape Memory Alloy) connection portions, and a plurality of solder connection members. One side of the SMA connection portion is joined to the electronic element, and the solder connection member is arranged over the other side of the SMA connection portion. The SMA connection portions can comply with the strains caused by thermal stresses during the operation of the electronic product and can restore the original shape after the thermal stresses disappear. Therefore, the preset invention can prevent the junctions between the SMA connection portions and the electronic element/the solder connection members from the crack or disconnection caused by thermal stresses.

Abstract translation: 本发明公开了一种电子封装结构，其包括电子元件，多个SMA（形状记忆合金）连接部以及多个焊料连接部件。 SMA连接部的一侧与电子元件接合，焊接连接部件配置在SMA连接部的另一侧。 SMA连接部分可以符合在电子产品操作期间由热应力引起的应变，并且可以在热应力消失之后恢复原始形状。 因此，本发明可以防止SMA连接部和电子元件/焊料连接部件之间的接合部由于热应力引起的裂纹或断开。