公开(公告)号：US20170090516A1

公开(公告)日：2017-03-30

申请号：US14866742

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Pei-yang Sung ,  Ming-Che Lee ,  Oliver Tsui ,  Simon Tsai

IPC: G06F1/16 ,  H02J7/00

CPC classification number: G06F1/1632 ,  G06F1/1635 ,  G06F1/1669 ,  G06F1/1671 ,  G06F1/1681 ,  G06F1/1696 ,  H02J7/0042

Abstract: Particular embodiments described herein provide for an electronic device, that includes a main body, an interconnect attached to the main body, where the interconnect can electrically couple with different sized first housings, a hinge attached to the interconnect, where the hinge can rotatably couple the interconnect with the main body, and a porch, where the porch can accommodate different sized second housings.

公开(公告)号：US09557778B2

公开(公告)日：2017-01-31

申请号：US14752920

申请日：2015-06-27

Applicant: Intel Corporation

Inventor： Pei-Yang Sung ,  Jeff Ku ,  Ming-Che Lee ,  Simon Tsai

IPC: G06F1/16 ,  E05F1/12

CPC classification number: G06F1/1681 ,  E05F1/1215 ,  E05Y2900/606 ,  G06F1/1626

Abstract: Particular embodiments described herein provide for device that includes a first housing, a cradle, and a hinge that rotatable couples the first housing to the cradle. The hinge includes a switch bolt configured to selectively provide friction torque to the hinge, a torsion spring configured to provide spring torque to the hinge, and a switch mechanism to activate and deactivate the switch bolt, wherein the friction torque provided by the switch bolt is greater than the spring torque provided by the torsion spring.

Abstract translation: 本文描述的特定实施例提供了包括第一壳体，支架和铰链的装置，其可旋转地将第一壳体耦合到支架。 铰链包括：开关螺栓，其构造成选择性地向铰链提供摩擦转矩;扭簧，其构造成向铰链提供弹簧扭矩;以及开关机构，用于启动和停用开关螺栓，其中由开关螺栓提供的摩擦转矩是 大于由扭转弹簧提供的弹簧扭矩。

公开(公告)号：US12284793B2

公开(公告)日：2025-04-22

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu Bawa ,  Ruander Cardenas ,  Kathiravan D ,  Jia Yan Go ,  Chin Kung Goh ,  Jeff Ku ,  Prakash Kurma Raju ,  Baomin Liu ,  Twan Sing Loo ,  Mikko Makinen ,  Columbia Mishra ,  Juha Paavola ,  Prasanna Pichumani ,  Daniel Ragland ,  Kannan Raja ,  Khal Ern See ,  Javed Shaikh ,  Gokul Subramaniam ,  George Baoci Sun ,  Xiyong Tian ,  Hua Yang ,  Mark Carbone ,  Vivek Paranjape ,  Nehakausar Pinjari ,  Hari Shanker Thakur ,  Christopher Moore ,  Gustavo Fricke ,  Justin Huttula ,  Gavin Sung ,  Sammi Wy Liu ,  Arnab Sen ,  Chun-Ting Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Shih Wei Nien ,  Lance Lin ,  Evan Kuklinski

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US20250113460A1

公开(公告)日：2025-04-03

申请号：US18979203

申请日：2024-12-12

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Smit Kapila ,  Min Suet Lim ,  Surya Pratap Mishra ,  Kari Mansukoski ,  Shantanu D. Kulkarni

IPC: H05K7/20 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for foldable thermal ground planes for electronic devices. An example an apparatus to cool an electronic device includes a first plate; a second plate; a plurality of first pillars extending between the first plate and the second plate, the plurality of first pillars having a first shape; a plurality of second pillars extending between the first plate and the second plate, the plurality of second pillars having a second shape, the second shape different than the first shape; and a hinge separating the apparatus into a first section and a second section, the plurality of second pillars in the hinge.

公开(公告)号：US11930610B2

公开(公告)日：2024-03-12

申请号：US17543690

申请日：2021-12-06

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Juha Paavola ,  Mark Carbone ,  Shantanu Kulkarni ,  Mikko Makinen ,  Gustavo Fricke

IPC: H05K5/00 ,  G06F1/16 ,  H05K5/02 ,  H05K5/03 ,  H05K7/20

CPC classification number: H05K5/03 ,  G06F1/1618 ,  G06F1/1656 ,  G06F1/1669 ,  G06F1/1681 ,  H05K5/0226 ,  H05K5/0234 ,  H05K7/20163

Abstract: Personal computing device covers having stands are disclosed. A disclosed example apparatus includes a protective cover to at least partially cover a personal computing device. The cover includes a fixed panel to be thermally coupled to a chassis of the personal computing device to define a heatsink of the personal computing device, and a foldable panel to be rotatably coupled to the fixed panel via a hinge to support the personal computing device to stand at an angle from a surface.

公开(公告)号：US11726579B2

公开(公告)日：2023-08-15

申请号：US17553294

申请日：2021-12-16

Applicant: Intel Corporation

Inventor： Shantanu D. Kulkarni ,  Jeff Ku ,  James Okuley

IPC: G06F3/02 ,  G06F1/16

CPC classification number: G06F3/0227 ,  G06F1/166 ,  G06F1/1666

Abstract: Apparatus, devices, systems, methods, and articles of manufacture are disclosed for physical keyboards with multi-display computing devices. An example computing device includes a first display, a second display, and a keyboard.

公开(公告)号：US11649993B2

公开(公告)日：2023-05-16

申请号：US16457229

申请日：2019-06-28

Applicant: INTEL CORPORATION

Inventor： Gavin Sung ,  Gerry Juan ,  Harish Jagadish ,  Ivan By Wang ,  Jason Y. Jiang ,  Sammi Wy Liu ,  Tim Liu ,  Jeff Ku

IPC: F25B21/02 ,  F25B9/00 ,  F25B25/00

CPC classification number: F25B21/02 ,  F25B9/006 ,  F25B25/00

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.

公开(公告)号：US20230017925A1

公开(公告)日：2023-01-19

申请号：US17946808

申请日：2022-09-16

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Min Suet Lim ,  Tin Poay Chuah ,  Yew San Lim ,  Twan Sing Loo

IPC: H05K1/02 ,  H05K7/20 ,  G06F1/20

Abstract: Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.

公开(公告)号：US11556157B2

公开(公告)日：2023-01-17

申请号：US17089752

申请日：2020-11-05

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Chee Chun Yee ,  Yew San Lim ,  Jeff Ku ,  Tin Poay Chuah

IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16

Abstract: According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.

公开(公告)号：US20220404862A1

公开(公告)日：2022-12-22

申请号：US17896831

申请日：2022-08-26

Applicant: Intel Corporation

Inventor： Prakash Kurma Raju ,  Navneet Singh ,  Amruta Ranade ,  Ajmeer Kaja ,  Jeff Ku

IPC: G06F1/16

Abstract: Apparatus, systems, and articles of manufacture for separable electronic devices are disclosed. A separable electronics device includes a first panel having a first zipper component, the first panel including a front housing, display cover glass, a display panel, display electronics, and a first panel-panel interface. The separable electronics device further includes a second panel having a second zipper component, the second panel including a back housing, and a second panel-panel interface, wherein the first panel and the second panel are physically coupled by a mechanical connection of the first zipper component and the second zipper component.