公开(公告)号：US11952266B2

公开(公告)日：2024-04-09

申请号：US17066448

申请日：2020-10-08

Applicant: X-Celeprint Limited

Inventor： Pierluigi Rubino

IPC: B81C1/00

CPC classification number: B81C1/00039 ,  B81C1/00523 ,  B81C1/00555 ,  B81C2201/0105 ,  B81C2201/013

Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

公开(公告)号：US11845654B2

公开(公告)日：2023-12-19

申请号：US17352149

申请日：2021-06-18

Applicant: The University of British Columbia

Inventor： Edmond Cretu ,  Chang Ge

IPC: B81C1/00

CPC classification number: B81C1/00476 ,  B81C2201/0105 ,  B81C2201/0133 ,  B81C2201/0143 ,  B81C2201/0181

Abstract: According to at least one embodiment, a method of fabricating a micro electro-mechanical systems (MEMS) structure is disclosed. The method involves causing an etchant to remove a portion of a sacrificial layer of the MEMS structure, the sacrificial layer between a structural layer of the MEMS structure and a substrate of the MEMS structure. In this embodiment, causing the etchant to remove the portion of the sacrificial layer involves causing a target portion of the substrate to be released from the MEMS structure. According to another embodiment, another method of fabricating a MEMS structure is disclosed. The method involves causing an etchant including water to remove a portion of a sacrificial layer of the MEMS structure, the sacrificial layer between a structural layer of the MEMS structure and a substrate of the MEMS structure. In this embodiment, the sacrificial layer and the substrate are hydrophobic.

公开(公告)号：US20230375416A1

公开(公告)日：2023-11-23

申请号：US18228333

申请日：2023-07-31

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Tsai-Hao HUNG ,  Shih-Chi KUO

IPC: G01K7/32 ,  B81C1/00 ,  B81B3/00

CPC classification number: G01K7/32 ,  B81C1/00944 ,  B81B3/0008 ,  B81B2203/0136 ,  B81C2201/0105 ,  B81C2201/013 ,  B81C2201/0116 ,  B81B2201/0278 ,  B81B2203/04

Abstract: The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.

公开(公告)号：US20230357001A1

公开(公告)日：2023-11-09

申请号：US18246790

申请日：2021-09-30

Applicant: Robert Bosch GmbH

Inventor： Heribert Weber ,  Andreas Scheurle ,  Hans Artmann ,  Peter Schmollngruber ,  Thomas Friedrich ,  Uwe Schiller

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B2201/0257 ,  B81C2201/0105 ,  B81C2201/014 ,  B81C2203/038 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/033 ,  B81B2203/0353

Abstract: A production method for a micromechanical component for a sensor device or microphone device. The method includes: forming a supporting structure composed of a first sacrificial material on a substrate surface of a substrate with a first sacrificial material layer, a plurality of etching holes structured through the first sacrificial material layer, and a plurality of supporting posts projecting into the substrate; etching into the substrate surface at least one cavity spanned by the supporting structure; forming a diaphragm composed of at least one semiconductor material on or over the first sacrificial material layer of the supporting structure; depositing a layer stack comprising at least one sacrificial layer and at least one counter electrode; and exposing the diaphragm by at least partially removing at least the supporting structure and the at least one sacrificial layer.

公开(公告)号：US20230239641A1

公开(公告)日：2023-07-27

申请号：US18156155

申请日：2023-01-18

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Guofeng Chen ,  Yu Hui

IPC: H04R31/00 ,  B81B3/00 ,  B81C1/00 ,  H04R7/04 ,  H04R7/18 ,  H04R17/02 ,  H04R19/04

CPC classification number: H04R31/006 ,  B81B3/0072 ,  B81C1/00666 ,  H04R7/04 ,  H04R7/18 ,  H04R17/02 ,  H04R19/04 ,  H04R31/003 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81C2201/0105 ,  B81C2201/0132 ,  B81C2203/0118 ,  H04R2201/003

Abstract: A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

公开(公告)号：US09932224B2

公开(公告)日：2018-04-03

申请号：US14973319

申请日：2015-12-17

Applicant: Globalfoundries Singapore Pte. Ltd.

Inventor： Siddharth Chakravarty ,  Rakesh Kumar ,  Pradeep Yelehanka

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00293 ,  B81B7/0074 ,  B81B2203/0315 ,  B81C2201/0105 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2203/0136

Abstract: Semiconductor devices with enclosed cavities and methods for fabricating semiconductor devices with enclosed cavities are provided. In an embodiment, a method for fabricating a semiconductor device with a cavity includes forming a sacrificial structure in and/or over a substrate. The method includes depositing a permeable layer over the sacrificial structure and the substrate. Further, the method includes etching the sacrificial structure through the permeable layer to form the cavity bounded by the substrate and the permeable layer.

公开(公告)号：US20160023889A1

公开(公告)日：2016-01-28

申请号：US14532675

申请日：2014-11-04

Applicant: Silicon Laboratories Inc.

Inventor： Emmanuel P. Quevy ,  Jeremy R. Hui ,  Carrie Wing-Zin Low

IPC: B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00246 ,  B81B3/0021 ,  B81B7/007 ,  B81B7/0077 ,  B81B7/008 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00158 ,  B81C1/00269 ,  B81C1/00285 ,  B81C1/00333 ,  B81C1/0038 ,  B81C2201/0105 ,  B81C2201/056 ,  B81C2203/0118 ,  B81C2203/0136 ,  B81C2203/0172 ,  B81C2203/019 ,  B81C2203/0735 ,  G01N27/223 ,  G01N27/227

Abstract: Membrane transducer structures and thin-film encapsulation methods for manufacturing the same are provided. In one example, the thin film encapsulation methods may be implemented to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) that include the membrane transducers.

Abstract translation: 提供了用于制造薄膜换能器结构和薄膜封装方法。 在一个示例中，可以实现薄膜封装方法以共同整合用于薄膜封装和形成微电子器件的工艺和包括膜换能器的微机电系统（MEMS）。

公开(公告)号：US20130126022A1

公开(公告)日：2013-05-23

申请号：US13635972

申请日：2011-03-10

Applicant: Christian Schoen ,  Michael Wagner

Inventor： Christian Schoen ,  Michael Wagner

IPC: B01J4/00

CPC classification number: B01J4/001 ,  B01L3/502707 ,  B01L3/502738 ,  B01L3/502746 ,  B01L2200/0621 ,  B01L2200/10 ,  B01L2300/0636 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2300/0822 ,  B01L2300/0864 ,  B01L2300/0887 ,  B01L2300/161 ,  B01L2400/0406 ,  B01L2400/0688 ,  B01L2400/088 ,  B81C1/00047 ,  B81C1/00063 ,  B81C2201/0105 ,  B81C2201/0143 ,  B81C2201/0156 ,  Y10T137/85938

Abstract: The invention relates to a component (4) of a biosensor, comprising at least one first device (6) for receiving a sample liquid, wherein the device (6) is connected via a distributor channel (7) to further receiving devices (8 to 11), into each of which a feed channel (71, 72, 73, 74) branching off from the distributor channel (7) opens, and the feed channels (71, 72, 73, 74) are arranged in succession in flow direction (S) of the sample liquid passed on through the distributor channel (7). In accordance with the invention, it is envisaged that, in the distributor channel (7), in each case between two immediately successive feed channels (71, 72; 72, 73; 73, 74) in flow direction (S), at least one region (K) for at least temporary slowing or stoppage of the capillary flow of the sample liquid has been inserted. It is thus possible to control the capillary flow of the sample liquid such that always only one receiving device (8, 9, 10, 11) is filled with the volume flow of sample liquid available before the next is filled, and effectively simultaneous filling of the receiving devices (8, 9, 10, 11) is prevented. This leads to rapid and complete filling of the respective receiving device (8, 9, 10, 11). Additionally presented is a process with which the regions (K) can be inserted into the distributor channel (7) in a simple manner.

Abstract translation: 本发明涉及生物传感器的组件（4），其包括用于接收样品液体的至少一个第一装置（6），其中所述装置（6）经由分配器通道（7）连接到另外的接收装置（8至 其中，从分配器通道（7）分支出的进料通道（71,72,73,74）打开，并且进料通道（71,72,73,74）在流动方向上连续地排列 （S）通过分配器通道（7）通过的样品液体。 根据本发明，设想在分配器通道（7）中，在每种情况下，在流动方向（S）处的两个紧邻的供给通道（71,72; 72,73; 73,74）之间至少 已经插入了用于至少暂时放慢或停止样品液体的毛细管流动的区域（K）。 因此，可以控制样品液体的毛细管流动，使得总是只有一个接收装置（8,9,10,11）填充下一个填充之前可用的样品液体的体积流量，并且有效地同时填充 接收装置（8,9,10,11）被防止。 这导致相应的接收装置（8,9,10,11）的快速和完全的填充。 另外提出了一种可以简单地将区域（K）插入到分配器通道（7）中的过程。