公开(公告)号：US20120267825A1

公开(公告)日：2012-10-25

申请号：US13184564

申请日：2011-07-17

Applicant: Sung Jun LEE ,  Won Kyu JEUNG

Inventor： Sung Jun LEE ,  Won Kyu JEUNG

IPC: B29C70/00

CPC classification number: G01C19/56 ,  B81B2201/025 ,  B81C1/00182 ,  B81C2201/0108 ,  B81C2201/0187 ,  G01P15/0802 ,  G01P15/09

Abstract: The method of manufacturing an inertial sensor includes: (A) disposing a first mold 120 and a second mold 125 on both surfaces of a predetermined region R in a plate-shaped membrane 110, (B) forming a mass body 130, a post 140, and an upper cap 150 through a plating process or a filling process, (C) disposing a third mold 160 on an exposed surface of the first mold 120 and the mass body 130, and (D) forming a lower cap 170 through the plating process or the filling process. Since the mass body 130 is made of metal by a plating process or a filling process, the density of the mass body 130 may be increased and the mass body 130 may be formed to have a structure of a high aspect ratio, thereby improving the sensitivity of the inertial sensor 100.

Abstract translation: 惯性传感器的制造方法包括：（A）在板状膜110中的规定区域R的两面上设置第一模具120和第二模具125，（B）形成质量体130，柱140 ，以及通过电镀处理或填充处理的上盖150，（C）在第一模具120和质量体130的暴露表面上设置第三模具160，以及（D）通过电镀形成下盖170 过程或填充过程。 由于质量体130通过电镀处理或填充处理由金属制成，因此可以增加质量体130的密度，并且可以将质量体130形成为具有高纵横比的结构，从而提高灵敏度 的惯性传感器100。

公开(公告)号：US08137736B2

公开(公告)日：2012-03-20

申请号：US12348589

申请日：2009-01-05

Applicant: Mingwei Zhu ,  Yanfeng Chen ,  Zhenlin Wang ,  Yanqing Lu ,  Haixiong Ge ,  Yuefeng Tang

Inventor： Mingwei Zhu ,  Yanfeng Chen ,  Zhenlin Wang ,  Yanqing Lu ,  Haixiong Ge ,  Yuefeng Tang

IPC: B05D3/12

CPC classification number: B81C1/00476 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055 ,  B81B2203/0338 ,  B81B2203/0361 ,  B81C2201/0108

Abstract: A novel method suitable for commercially mass production of hollow microneedle with high quality for delivery of drugs across or into biological tissue is provided. It typically includes the following processes: (1) coating an elongated template of a first material with a second material to form a cover; (2) removing tips of the template and cover to form an opening in the cover; and (3) removing the template of the first material to obtain hollow microneedles of the second material. This simple, efficient and cost-effective fabrication method can mass produce hollow microneedle arrays involving no complicated and expensive equipments or techniques, which can be used in commercial fabrication of hollow needles for delivering drugs or genes across or into skin or other tissue barriers with advantages of minimal damage, painless, long-term and continuous usages.

Abstract translation: 提供了一种适用于商业上大规模生产用于将药物跨越或进入生物组织的高品质的中空微针的新方法。 它通常包括以下过程：（1）用第二材料涂覆第一材料的细长模板以形成盖子; （2）去除模板和盖子的尖端以在盖子上形成开口; 和（3）去除第一材料的模板以获得第二材料的中空微针。 这种简单，高效和成本有效的制造方法可以大规模生产中空微针阵列，其不涉及复杂而昂贵的设备或技术，其可用于商业制造用于将药物或基因跨越或进入皮肤或其它组织屏障的中空针 最小的伤害，无痛，长期和持续的使用。

公开(公告)号：US07994592B2

公开(公告)日：2011-08-09

申请号：US11182906

申请日：2005-07-18

Applicant: Yu-Chong Tai ,  Qing He

Inventor： Yu-Chong Tai ,  Qing He

IPC: H01L27/14

CPC classification number: B81C1/00333 ,  B01L3/502707 ,  B01L2200/0668 ,  B01L2200/12 ,  B01L2300/0896 ,  B81C1/00182 ,  B81C1/00476 ,  B81C2201/0108 ,  B82Y30/00 ,  G01N30/6095 ,  G01N2030/562 ,  G01N2030/6056

Abstract: MEMs devices are integrally fabricated with included micro or nanoparticles by providing a mixture of a sacrificial material and a multiplicity of particles, disposing the mixture onto a substrate, fabricating a MEMs structure on the substrate including at least part of the mixture, so that at least some of the mixture is enclosed in the MEMs structure, removing the sacrificial material, and leaving at least some of the multiplicity of particles substantially free and enclosed in the MEMs structure. The step of fabricating a MEMs structure is quite general and is contemplated as including one or a multiplicity of additional steps for creating some type of structure in which the particles, which may be microbeads or nanobeads, are included. A wide variety of useful applications for MEMs integrated with micro or nanoparticles are available.

Abstract translation: 通过提供牺牲材料和多个颗粒的混合物将MEM装置与包含的微型或纳米颗粒整体制造，将混合物设置在衬底上，在包括至少部分混合物的衬底上制造MEM结构，使得至少 一些混合物被包封在MEMs结构中，去除牺牲材料，并且使至少一些多个颗粒基本上自由并且封闭在MEM结构中。 制造MEMs结构的步骤是相当普遍的，并且被设想为包括用于产生某些类型的结构的一个或多个附加步骤，其中可以包括可以是微珠或纳米珠的颗粒。 可以使用与微型或纳米颗粒集成的MEM的各种有用的应用。

公开(公告)号：US07851366B2

公开(公告)日：2010-12-14

申请号：US11854155

申请日：2007-09-12

Applicant: Fabrice Casset ,  Sofiane Soulimane

Inventor： Fabrice Casset ,  Sofiane Soulimane

IPC: H01L21/311

CPC classification number: B81C1/00158 ,  B81B2203/0109 ,  B81C1/00103 ,  B81C2201/0108 ,  H01G5/011 ,  H01G5/18

Abstract: The invention relates to a method of realization of a sacrificial layer, including the steps of: lithography of a resin deposited on a substrate in order to supply a lithographed resist pattern on a substrate zone, the zone having a given size and a given form, the pattern occupying a given volume, annealed according to a thermal cycle of the lithographed resist pattern, the method being characterised in that it includes, according to the resin, the determination of the size and of the form of said zone of the substrate, and the determination of the volume of the resin deposited on said zone so that the thermal cycle annealing supplies a profile chosen from among the following profiles: a planarising domed profile and a “double air gap” profile.

Abstract translation: 本发明涉及一种实现牺牲层的方法，包括以下步骤：沉积在衬底上的树脂的光刻法，以便在衬底区域上提供光刻抗蚀剂图案，该区域具有给定的尺寸和给定的形式， 所述图案占据给定体积，根据所蚀刻的抗蚀剂图案的热循环退火，所述方法的特征在于，根据所述树脂，所述图案包括所述基材的所述区域的尺寸和形式的确定，以及 确定沉积在所述区域上的树脂的体积，使得热循环退火提供从以下简档中选择的轮廓：平面化圆顶轮廓和“双气隙”轮廓。

公开(公告)号：US20090107952A1

公开(公告)日：2009-04-30

申请号：US12273114

申请日：2008-11-18

Applicant: Paul A. Kohl ,  Paul Jayachandran Joseph ,  Hollie Reed ,  Sue Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

Inventor： Paul A. Kohl ,  Paul Jayachandran Joseph ,  Hollie Reed ,  Sue Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

IPC: B44C1/22

CPC classification number: B81C1/00476 ,  B81C2201/0108 ,  H01L21/7682 ,  Y10S430/114

Abstract: Compositions, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary composition, among others, includes a polymer and a catalytic amount of a negative tone photoinitiator.

公开(公告)号：US20070158775A1

公开(公告)日：2007-07-12

申请号：US11492671

申请日：2006-07-25

Applicant: Shawn Cunningham ,  Dana DeReus ,  Subham Sett ,  John Gilbert

Inventor： Shawn Cunningham ,  Dana DeReus ,  Subham Sett ,  John Gilbert

IPC: H01L31/058

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Methods for Implementation of a Switching Function in a Microscale Device and for Fabrication of a Microscale Switch. According to one embodiment, a method is provided for implementing a switching function in a microscale device. The method can include providing a stationary electrode and a stationary contact formed on a substrate. Further, a movable microcomponent suspended above the substrate can be provided. A voltage can be applied between the between a movable electrode of the microcomponent and the stationary electrode to electrostatically couple the movable electrode with the stationary electrode, whereby the movable component is deflected toward the substrate and a movable contact moves into contact with the stationary contact to permit an electrical signal to pass through the movable and stationary contacts. A current can be applied through the first electrothermal component to produce heating for generating force for moving the microcomponent.

Abstract translation: 用于实现微尺度装置中的切换功能以及用于制造微型开关的方法。 根据一个实施例，提供了一种用于在微型设备中实现切换功能的方法。 该方法可以包括提供固定电极和形成在基板上的固定触点。 此外，可以提供悬浮在基板上方的可移动微型部件。 可以在微型组件的可动电极和固定电极之间施加电压，以使可动电极与固定电极静电耦合，由此可动部件朝向基板偏转，并且可动触点移动到与固定触点接触 允许电信号通过可移动和固定触点。 可以通过第一电热部件施加电流以产生用于产生用于移动微型部件的力的加热。

公开(公告)号：US07176047B2

公开(公告)日：2007-02-13

申请号：US10769346

申请日：2004-01-30

Applicant: Ming-Chih Chang ,  H Shu Wu ,  Tsang-Mu Lai

Inventor： Ming-Chih Chang ,  H Shu Wu ,  Tsang-Mu Lai

IPC: H01L21/00

CPC classification number: B81C99/0085 ,  B81C2201/0108 ,  B81C2201/0133 ,  B81C2201/0152

Abstract: A method for forming a free standing micro-structural member including providing a substrate; blanket depositing a first sacrificial resist layer over the substrate; exposing and developing the first sacrificial resist layer to form a first resist portion; subjecting the first resist portion to at least a hard bake process to form the first resist portion having a predetermined first smaller volume compared to a desired final resist portion volume; blanket depositing at least a second sacrificial resist layer followed by exposure, development and the at least a hard bake process to form the final resist portion volume; and, depositing at least one structural material layer over the final resist portion.

Abstract translation: 一种形成独立式微结构构件的方法，包括提供基底; 在衬底上铺设第一牺牲抗蚀剂层; 曝光和显影第一牺牲抗蚀剂层以形成第一抗蚀剂部分; 使所述第一抗蚀剂部分至少进行硬烘烤处理，以形成具有预定的第一较小体积的第一抗蚀剂部分，与期望的最终抗蚀剂部分体积相比; 毯毯沉积至少第二牺牲抗蚀剂层，随后曝光，显影和至少硬烘烤工艺以形成最终的抗蚀剂部分体积; 并且在最终抗蚀剂部分上沉积至少一个结构材料层。

公开(公告)号：US07052821B2

公开(公告)日：2006-05-30

申请号：US10699330

申请日：2003-10-31

Applicant: Paul A. Kohl ,  Paul Jayachandran Joseph ,  Hollie Reed ,  Sue Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

Inventor： Paul A. Kohl ,  Paul Jayachandran Joseph ,  Hollie Reed ,  Sue Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

IPC: G03F1/14 ,  G03F7/039

CPC classification number: B81C1/00476 ,  B81C2201/0108 ,  H01L21/7682 ,  Y10S430/114

Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a composition having a sacrificial polymer and a photoacid generator.

Abstract translation: 提供聚合物，其使用方法及其分解方法。 一个示例性聚合物，其中包括具有牺牲聚合物和光致酸产生剂的组合物。

公开(公告)号：US20060076316A1

公开(公告)日：2006-04-13

申请号：US11203524

申请日：2005-08-12

Applicant: Lynn Bollinger ,  Iskander Tokmouline

Inventor： Lynn Bollinger ,  Iskander Tokmouline

IPC: H01L21/302 ,  H01L21/324

CPC classification number: H01L21/31138 ,  B81B2203/0353 ,  B81C1/00476 ,  B81C1/00619 ,  B81C99/0025 ,  B81C2201/0108 ,  B81C2201/0132 ,  G03F7/427 ,  H01J37/32055 ,  H01J37/32825 ,  H01L21/02057 ,  H01L21/02063 ,  H05H1/42 ,  H05H2240/10 ,  H05H2245/123

Abstract: A system that generates an intense hot gas stream is described to etch a polymer on a substrate used in the manufacture of semiconductor and MEMS devices with no surface damage. The etching process is particularly useful to remove a polymer from relatively high aspect Height-to-Width and Width-to-Height ratio holes that can include trenches, having relatively large aspect ratios for removal of polymers used in connection with the manufacturing of microstructures.

Abstract translation: 描述了产生强烈热气流的系统来蚀刻用于制造半导体和MEMS器件的衬底上的聚合物，其没有表面损伤。 蚀刻工艺特别适用于从相对较高的方面的高度 - 宽度和宽度 - 高度比的孔中除去聚合物，该孔可以包括沟槽，具有相对较大的纵横比用于去除与微结构制造有关的聚合物。

公开(公告)号：US06876482B2

公开(公告)日：2005-04-05

申请号：US10291107

申请日：2002-11-08

Applicant: Dana Richard DeReus

Inventor： Dana Richard DeReus

IPC: B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  G02B26/00 ,  G01J1/36 ,  H01B13/00 ,  H01S57/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: MEMS Device Having Contact and Standoff Bumps and Related Methods. According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves.

Abstract translation: 具有接触和间接碰撞的MEMS器件及相关方法。 根据一个实施例，提供悬挂在衬底上的可移动MEMS组件。 该部件可以包括具有通过间隙从基板分离的可移动电极的结构层。 该部件还可以包括附接到结构层并延伸到间隙中的至少一个支座凸块，以防止当部件移动时可动电极与导电材料的接触。