Abstract:
A charged particle beam apparatus having a cold trap positioned in proximity to components, such as a shaping aperture and a backscattered electrons detector, to which contaminants tend to migrate to adversely affect the functions of these components. As a coolant is passed through the cold trap, the contaminants condense on the cold trap and away from the shaping aperture and the backscattered electrons detector.
Abstract:
Method and apparatus for processing a substrate with an energetic particle beam. Features on the substrate are oriented relative to the energetic particle beam and the substrate is scanned through the energetic particle beam. The substrate is periodically indexed about its azimuthal axis of symmetry, while shielded from exposure to the energetic particle beam, to reorient the features relative to the major dimension of the beam.
Abstract:
A method of operating a particle beam microscope includes: directing a particle beam onto a sample and detecting particles emanating from the sample during a first period for generating an image of the sample; generating electrons having a first distribution of kinetic energies and directing these electrons onto the sample during a second period for reducing a charge of the sample being generated while the directing the particle beam onto the sample; and generating electrons having a second distribution of their kinetic energies and directing these electrons onto the sample during a third period for further reducing the charge of the sample being generated while the directing of the particle beam onto the sample. An average value of the kinetic energy of the first distribution of the kinetic energy is greater than an average value of the kinetic energy of the second distribution of kinetic energies.
Abstract:
A multi charged particle beam writing apparatus according to one aspect of the present invention includes a first aperture member to form multiple beams, a blanker array provided with a plurality of blankers which respectively perform blanking deflection of a corresponding beam in the multiple beams, a first electromagnetic lens and a second electromagnetic lens arranged between the first aperture member and the blanker array, a second aperture member arranged between the first electromagnetic lens and the second electromagnetic lens and at a position of a convergence point of the multiple beams and configured to restrict passage of charged particles deviated from the convergence point, and a third aperture member to block each beam which was deflected to be in a beam off state by the plurality of blankers.
Abstract:
A particle source in which energy selection occurs by sending a beam of electrically charged particles eccentrically through a lens so that energy dispersion will occur in an image formed by the lens. By projecting this image onto a slit in an energy selecting diaphragm, it is possible to allow only particles in a limited portion of the energy spectrum to pass. Consequently, the passed beam will have a reduced energy spread. The energy dispersed spot is imaged on the slit by a deflector. When positioning the energy dispersed spot on the slit, central beam is deflected from the axis to such an extent that it is stopped by the energy selecting diaphragm. Hereby reflections and contamination resulting from this beam in the region after the diaphragm are avoided. Also electron-electron interaction resulting from the electrons from the central beam interacting with the energy filtered beam in the area of deflector is avoided.
Abstract:
A compound microscope device allowing simultaneous observation of one specimen by a transmission electron microscope and an optical microscope, is provided. A compound microscope device 1 of the present invention has a transmission electron microscope 2 and an optical microscope 4. A specimen 10 and a reflection mirror 41 are disposed on an electron optical axis C of an electron ray. The reflection mirror 41 is inclined from the electron optical axis C toward the optical object lens 43 and the specimen 10. Light from the specimen 10 (fluorescent light, reflection light, and the like) is reflected by the reflection mirror 41 and entered into the optical object lens 43. The electron ray from the electron microscope 2 passes through a mounting center hole 42 of the reflection mirror 41. This makes it possible to observe one specimen simultaneously by the electron microscope 2 and the optical microscope 4.
Abstract:
A multi charged particle beam writing apparatus according to one aspect of the present invention includes a first aperture member to form multiple beams, a blanker array provided with a plurality of blankers which respectively perform blanking deflection of a corresponding beam in the multiple beams, a first electromagnetic lens and a second electromagnetic lens arranged between the first aperture member and the blanker array, a second aperture member arranged between the first electromagnetic lens and the second electromagnetic lens and at a position of a convergence point of the multiple beams and configured to restrict passage of charged particles deviated from the convergence point, and a third aperture member to block each beam which was deflected to be in a beam off state by the plurality of blankers.
Abstract:
In a method of machining a substrate by an ion beam, the ion beam is guided by an orifice plate formed at least partly of carbon-containing material. Between the orifice plate and the substrate, an educt that is reactive with carbon is guided such that carbon released from the orifice plate by the ion beam oxidizes. An ion beam device for machining a substrate includes an ion beam source and at least one orifice plate, disposed between the ion beam source and the substrate, for adjusting a cross section of and guiding the ion beam. The orifice plate is formed of carbon-containing material. A delivery unit, for delivering an educt that is reactive with carbon, is disposed such that the educt can be guided between the orifice plate and the substrate, so that carbon released from the orifice plate by the ion beam oxidizes.
Abstract:
A gas-cluster-jet generator with improved vacuum management techniques and apparatus is disclosed. The gas-cluster-jet generator comprises a substantially conically shaped vacuum chamber for housing the nozzle and jet exit portions of the gas-cluster-jet generator. A skimmer may be located at the narrow end of the conical chamber and a close-coupled vacuum pump is located at the wide end of the conical chamber. Support members for the nozzle are high conductivity “spider” supports that provide support rigidity while minimizing gas flow obstruction for high pumping speed. The conically shaped vacuum chamber redirects un-clustered gas in a direction opposite the direction of the gas-cluster-jet for efficient evacuation of the un-clustered gas. The nozzle and a skimmer may have fixed precision relative alignment, or may optionally have a nozzle aiming adjustment feature for aligning the gas-cluster-jet with the skimmer and downstream beamline components. Also disclosed are various configurations of gas-cluster ion-beam processing tools employing the improved gas-cluster-jet generator.
Abstract:
An ion implanter and a method for implanting a wafer are provided, wherein the method includes the following steps. First, a wafer has at least a first portion requiring a first doping density and a second portion requiring a second doping density is provided. The first doping density is larger than the second doping density. Thereafter, the first portion is scanned by an ion beam with a first scanning parameter value, and the second portion is scanned by the ion beam with a second scanning parameter value. The first scanning parameter value can be a first scan velocity, and the second scanning parameter value can be a second scan velocity different than the first scan velocity. Alternatively, the first scanning parameter value can be a first beam current, and the second scanning parameter value can be a second beam current different than the first beam current.