公开(公告)号：US20090300910A1

公开(公告)日：2009-12-10

申请号：US11989108

申请日：2006-04-10

Applicant: Markus Pfletschinger ,  Bernd Schwarz ,  Jan Krüger ,  Ingmar Petersen

Inventor： Markus Pfletschinger ,  Bernd Schwarz ,  Jan Krüger ,  Ingmar Petersen

IPC: H05K3/20

CPC classification number: H05K3/207 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/0116 ,  H05K2201/09118 ,  H05K2203/1327 ,  Y10T29/49128

Abstract: The invention relates to a method for applying electrical conductor patterns (1) to a target component (9) of plastic, it being provided according to the invention that a transfer medium on which the conductor patterns (1) are detachably arranged is placed in a mould part (3, 4) and the mould part (3, 4) is filled with a polymer material, the finished target component (9) being removed from the mould part (3, 4) after the filling.

Abstract translation: 本发明涉及一种用于将电导体图案（1）施加到塑料的目标部件（9）的方法，根据本发明，根据本发明提供了一种可拆卸地布置导体图案（1）的转印介质， 模具部件（3,4）和模具部件（3,4）填充有聚合物材料，在填充之后将最终的目标部件（9）从模具部件（3,4）中取出。

公开(公告)号：US07625141B2

公开(公告)日：2009-12-01

申请号：US11839755

申请日：2007-08-16

Applicant: Makato Iikawa

Inventor： Makato Iikawa

IPC: G03B9/02 ,  G03B17/00

CPC classification number: G02B7/08 ,  H05K1/0271 ,  H05K1/028 ,  H05K3/0058 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/09018

Abstract: A lens barrel includes an electronic component provided in the lens barrel so that a position of the electronic component in the lens barrel is adjustable; a flexible printed wiring board connected to the electronic component and installed to extend along a surface of an internal component of the lens barrel in a direction to adjust the position of the electronic component; and a low-repulsion layer interposed between the surface of the internal component and a surface of the flexible printed wiring board which faces the surface of the internal component.

Abstract translation: 透镜镜筒包括设置在透镜镜筒中的电子部件，使得透镜镜筒中的电子部件的位置是可调节的; 柔性印刷布线板，其连接到所述电子部件并且沿着调整所述电子部件的位置的方向沿着所述镜筒的内部部件的表面延伸; 以及插入在内部部件的表面和面向内部部件的表面的柔性印刷线路板的表面之间的低排斥层。

公开(公告)号：US20090126970A1

公开(公告)日：2009-05-21

申请号：US11922330

申请日：2006-05-31

Applicant: Yasushi Sasaki ,  Seiichiro Yokoyama

Inventor： Yasushi Sasaki ,  Seiichiro Yokoyama

IPC: H01B3/30

CPC classification number: H01P3/00 ,  C08J5/18 ,  C08J2367/02 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/0011 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2203/0271

Abstract: [Problems] To provide a high frequency electronic part which shows a remarkably low dielectric loss, which is excellent in electric insulation characteristics, and which is thin and excellent in mechanical strength being. [Means for Solving Problems] The high frequency electronic part comprises a conductor wiring for transmitting an electric signal of 100 MHz to 100 GHz, and an insulation layer composed of a void containing thermoplastic resin film orientated in at least one direction by stretching, and it is characterized in that said void containing thermoplastic resin film contains voids in the range between 3% and 45% by volume, and the number of voids in a thickness direction of the film is 5 or more, and a ratio of the number of voids to film thickness defined by the following equation is in the range between 0.1 and 10 voids/μm: ratio of the number of voids to film thickness(voids/μm)=the number of voids(voids)in film thickness direction/film thickness(μm).

Abstract translation: [问题]提供一种电绝缘特性优异的低介电损耗的高频电子部件，其机械强度薄且优异。 解决问题的手段高频电子部件包括用于传输100MHz至100GHz的电信号的导体布线，以及由包含通过拉伸至少一个方向取向的热塑性树脂膜的空隙构成的绝缘层，并且 其特征在于，所述含有热塑性树脂膜的空隙含有3〜45体积％范围的空隙，膜的厚度方向的空隙数为5个以上，空隙数与 由以下等式定义的膜厚度在0.1至10个空隙/ mum之间的范围内：<？in-line-formula description =“In-line Formulas”end =“lead”？>空隙数与膜厚之比 （空隙/ mum）=膜厚方向的空隙数（空隙）/膜厚（mum）<？内联式说明=“在线式”末端=“尾”→>

公开(公告)号：US07510744B2

公开(公告)日：2009-03-31

申请号：US11121115

申请日：2005-05-04

Applicant: Hiroshi Tamemasa ,  Makoto Omata ,  Shigeo Ohta ,  Takahiro Okayasu

Inventor： Hiroshi Tamemasa ,  Makoto Omata ,  Shigeo Ohta ,  Takahiro Okayasu

IPC: B05D7/02 ,  B05D7/04 ,  B05D3/10 ,  B32B3/26 ,  G03G15/20

CPC classification number: C25D5/56 ,  C23C18/1648 ,  C23C18/1653 ,  C23C18/1865 ,  C23C18/1882 ,  C23C18/40 ,  H01L2924/0002 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2203/0759 ,  H05K2203/0783 ,  Y10T428/1376 ,  Y10T428/249954 ,  Y10T428/249979 ,  Y10T428/24999 ,  Y10T428/249991 ,  Y10T428/249992 ,  H01L2924/00

Abstract: A process for producing a resin composition having a high adhesion between a resin layer and a metallic layer as well as an excellent durability includes providing a porous structure at least on the surface of the resin layer; and forming the metallic layer on the surface of the resin layer.

Abstract translation: 一种树脂层和金属层之间具有高粘附性的树脂组合物的制造方法以及优异的耐久性包括至少在树脂层的表面上提供多孔结构; 并在树脂层的表面上形成金属层。

公开(公告)号：US20090081419A1

公开(公告)日：2009-03-26

申请号：US11988723

申请日：2006-06-09

Applicant: Yuichi Idomoto ,  Yasuhiro Okuda

Inventor： Yuichi Idomoto ,  Yasuhiro Okuda

IPC: B32B3/10

CPC classification number: H05K1/119 ,  H01R12/7076 ,  H05K3/0058 ,  H05K3/368 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09045 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T428/24802

Abstract: In a composite porous resin base material, a porous resin film is provided with a functional section whereupon an electrode and/or a circuit is formed. On the periphery surrounding the functional section, a step having a height different from that of the functional section is formed, and a frame plate is arranged on a plane of the step. Provided is the composite porous resin base material which has a structure wherein the frame plate having rigidity is attached to the porous resin base material whereupon the electrode and/or a circuit is formed without deteriorating characteristics such as elasticity and conductivity of the porous resin base material.

Abstract translation: 在复合多孔树脂基材中，多孔树脂膜具有形成电极和/或电路的功能部。 在功能部周边的周边形成有与功能部不同的高度的台阶，并且在台阶的平面上配置框架板。 本发明提供一种复合多孔树脂基材，其特征在于，具有刚性的框架板附着在多孔树脂基材上，由此形成电极和/或电路，而不会导致多孔树脂基材的弹性和导电性等劣化 。

公开(公告)号：US20080286554A1

公开(公告)日：2008-11-20

申请号：US12045149

申请日：2008-03-10

Applicant: Dieter SCHWANKE ,  Achim Bittner ,  Ulrich Schmid ,  Mirco Harnack

Inventor： Dieter SCHWANKE ,  Achim Bittner ,  Ulrich Schmid ,  Mirco Harnack

IPC: B32B5/18 ,  C23F1/00

CPC classification number: H05K1/024 ,  C03C15/00 ,  C04B41/009 ,  C04B41/5353 ,  C04B41/91 ,  C04B2111/00844 ,  H01Q1/38 ,  H05K1/0306 ,  H05K3/002 ,  H05K2201/0116 ,  Y10T428/24479 ,  Y10T428/24562 ,  Y10T428/249969 ,  Y10T428/24997 ,  C04B35/10 ,  C04B35/00

Abstract: A method for producing a ceramic substrate material having a first layer and possibly a further layer is specified. The first layer comprises at least one first component made of a crystalline ceramic material and/or a glass material as a matrix and a second component made of a further crystalline ceramic material, which is provided in the matrix. An etching step is performed, mantle areas of the crystals and/or crystal agglomerates of the second component being etched selectively in the first layer to generate a cavity structure in the first layer. The present invention also relates to a corresponding ceramic substrate material, an antenna or an antenna array, and the use of the ceramic substrate material for an antenna or an antenna array.

Abstract translation: 规定了具有第一层和可能的另一层的陶瓷衬底材料的制造方法。 第一层包括至少一种由结晶陶瓷材料和/或作为基质的玻璃材料制成的第一组分和由另外的结晶陶瓷材料制成的第二组分，其被提供在基质中。 执行蚀刻步骤，在第一层中选择性地蚀刻第二组分的晶体的覆盖区和/或晶体聚集体，以在第一层中产生空腔结构。 本发明还涉及相应的陶瓷衬底材料，天线或天线阵列，以及陶瓷衬底材料用于天线或天线阵列的用途。

公开(公告)号：US20080261020A1

公开(公告)日：2008-10-23

申请号：US11904435

申请日：2007-09-27

Applicant: Mutsuyuki Kawaguchi ,  Satoshi Saitou ,  Masashi Deguchi ,  Tsuyoshi Amatani

Inventor： Mutsuyuki Kawaguchi ,  Satoshi Saitou ,  Masashi Deguchi ,  Tsuyoshi Amatani

IPC: B32B15/08 ,  B32B3/26

CPC classification number: C08J5/12 ,  B32B15/08 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0116 ,  H05K2203/0307 ,  H05K2203/072 ,  Y10T428/24999

Abstract: An adhesive layer for resin according to the present invention is formed of copper or a copper alloy for adhering a resin to a layer of copper or a copper alloy. The adhesive layer is formed of a metal layer of a coralloid structure made of an aggregation of a number of particles of copper or a copper alloy with gaps between the particles, and a plurality of micropores are present on the surface. The micropores have an average diameter in a range of 10 nm to 200 nm, and at least two micropores in average are present per 1 μm2 of the metal layer surface. Thereby, sufficient adhesion between the resin and the copper or copper alloy is provided. This serves to prevent ion migration caused by dendrites, which has been a problem in a conventional layer of tin or a tin alloy, and the adhesion to a resin having a high-glass transition temperature (Tg) is improved as well. The present invention also provides a method of producing a laminate including the adhesive layer.

Abstract translation: 根据本发明的用于树脂的粘合剂层由用于将树脂粘附到铜或铜合金层的铜或铜合金形成。 粘合剂层由金属层构成，该金属层由多个铜颗粒或铜合金的颗粒聚集而形成，其间具有间隙，并且表面上存在多个微孔。 微孔的平均直径在10nm至200nm的范围内，并且每1mum2的金属层表面平均存在至少两个微孔。 由此，提供了树脂与铜或铜合金之间的充分粘附。 这用于防止在常规的锡或锡合金层中已经存在问题的枝晶引起的离子迁移，并且对具有高玻璃化转变温度（Tg）的树脂的粘附性也得到改善。 本发明还提供一种制造包括粘合剂层的层压体的方法。

公开(公告)号：US07232608B2

公开(公告)日：2007-06-19

申请号：US11122138

申请日：2005-05-04

Applicant: Masahito Fujihara ,  Masahiro Kouno ,  Kazuya Edamura

Inventor： Masahito Fujihara ,  Masahiro Kouno ,  Kazuya Edamura

IPC: B32B9/00

CPC classification number: H05K3/1283 ,  B82Y30/00 ,  H05K3/102 ,  H05K3/107 ,  H05K3/1208 ,  H05K2201/0116 ,  H05K2201/0376 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T428/25 ,  Y10T428/30

Abstract: The present invention provides a conductive material having superior bending property and superior bending resistant property and a method for manufacturing the same. This object is achieved by a conductive material comprising a substrate and a conductive portion formed within the substrate, wherein a change ratio in the electric resistance values before and after a bending resistant property test, in which the conductive portion is bent by 180 degrees and a load of 1 kg/cm2 is imposed on the bent portion for one hour, is set within a range of ±10%.

Abstract translation: 本发明提供具有优异的弯曲性和优异的抗弯曲性的导电材料及其制造方法。 该目的通过包括基板和形成在基板内的导电部分的导电材料来实现，其中导电部分弯曲180度的抗弯曲性试验之前和之后的电阻值的变化率和 在弯曲部分施加1kg / cm 2的负荷1小时，设定在±10％的范围内。

公开(公告)号：US20070098882A1

公开(公告)日：2007-05-03

申请号：US11642732

申请日：2006-12-20

Applicant: Minoru Koyama ,  Yasunori Yamazaki

Inventor： Minoru Koyama ,  Yasunori Yamazaki

IPC: C23C26/00

CPC classification number: H05K3/125 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/038 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/1208 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/0284 ,  Y10T428/24802

Abstract: This device for manufacture of an electronic circuit forms a desired circuit pattern P by permeating liquid material (10, 40) including a material for circuit pattern formation into a permeable electronic substrate (100). This device for manufacture comprises an ink jet type head (20, 50) which discharges liquid material (10, 40) against an electronic substrate (100), and a shifting device (70) which relatively shifts the ink jet type head (20, 50) and the electronic substrate (100) with respect to one another.

Abstract translation: 用于制造电子电路的装置通过将包括用于电路图案形成的材料的液体材料（10,40）渗透到可渗透电子基板（100）中而形成期望的电路图案P. 该制造装置包括将液体材料（10,40）排放到电子基板（100）上的喷墨型头（20,50）和相对移动喷墨头（20）的移动装置（70） 50）和电子基板（100）。

公开(公告)号：US07171746B2

公开(公告)日：2007-02-06

申请号：US10758715

申请日：2004-01-16

Applicant: Frank Reil ,  Stefan Diel

Inventor： Frank Reil ,  Stefan Diel

IPC: H01K3/22

CPC classification number: H05K1/0373 ,  H05K3/027 ,  H05K3/04 ,  H05K3/043 ,  H05K2201/0116 ,  H05K2201/0215 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2203/025 ,  H05K2203/0746 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49163

Abstract: A process is described in which surfaces of foamed plastics are provided with electrical conductor tracks, with the aid of selectively ablating processes.The process permits low-cost production of moldings from plastic with conductor tracks integrated on the surface.The products of the process may be used in the electrical and electronics industries, for example.

Abstract translation: 描述了一种方法，其中泡沫塑料的表面设置有电导体轨迹，借助于选择性的烧蚀过程。 该工艺允许从导体轨迹集成在表面上的塑料模制品的低成本生产。 例如，该工艺的产品可用于电气和电子工业。