公开(公告)号：US20180255636A1

公开(公告)日：2018-09-06

申请号：US15758527

申请日：2016-09-23

Applicant: AMOGREENTECH CO., LTD.

Inventor： In Yong SEO

IPC: H05K1/03 ,  H05K3/12 ,  D04H1/728

CPC classification number: H05K1/038 ,  A41D1/002 ,  D04H1/728 ,  D10B2401/18 ,  D10B2403/02431 ,  G02B27/017 ,  G06F1/163 ,  H05K1/0212 ,  H05K3/12 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/05 ,  H05K2201/10151

Abstract: Provided is a wearable device and a method of manufacturing the same. The wearable device includes: a wearable flexible printed circuit board having a circuit pattern formed on a base substrate having flexibility, air-permeability, and waterproofness; and a functional module mounted on the wearable flexible printed circuit board.

公开(公告)号：US09596765B2

公开(公告)日：2017-03-14

申请号：US14426364

申请日：2012-09-11

Applicant: Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

Inventor： Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

IPC: H05K3/30 ,  H05K3/00 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  C25D7/06 ,  H05K1/09 ,  H05K3/40 ,  H01L23/544 ,  H01L21/683 ,  H05K1/02 ,  H01L21/56

CPC classification number: H05K3/0008 ,  C25D7/0607 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/09 ,  H05K1/185 ,  H05K1/188 ,  H05K3/305 ,  H05K3/4007 ,  H05K3/403 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4658 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  H01L2924/00

Abstract: A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.

Abstract translation: 根据本发明的用于组件的基片的制造方法包括：根据形成在铜层上的标记来定位电子部件，该标记由铜蚀刻剂（铜蚀刻剂）蚀刻铜不易蚀刻的材料构成 在将电子部件粘附在铜层上之后，将电子部件和标记嵌入绝缘基板后，将铜层的一部分进行蚀刻除去，形成露出标记的窗口，形成 参照曝光标记的LVH到达电子部件的端子，经由通过将电镀施加到LVH而形成的导通孔将端子和铜层电连接，然后将铜层形成布线图案。

公开(公告)号：US09365693B2

公开(公告)日：2016-06-14

申请号：US14129183

申请日：2013-03-15

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara

IPC: C08K3/00 ,  C08K7/14 ,  C08K3/40 ,  C08L77/06 ,  C23C18/38 ,  C23C18/42 ,  C23C18/32 ,  H05K1/03 ,  C08K3/22 ,  C08K9/02 ,  H05K3/10 ,  F21V7/22 ,  C23C18/16 ,  C23C18/20 ,  C08L101/12

CPC classification number: C08K3/00 ,  C08K3/22 ,  C08K3/2279 ,  C08K3/40 ,  C08K7/14 ,  C08K9/02 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L23/06 ,  C08L77/06 ,  C08L91/06 ,  C08L101/12 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  F21V7/22 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0723 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

Abstract translation: 提供一种热塑性树脂组合物，其电镀性（电镀外观）优异，即使在热老化后也保持高反射率。 一种热塑性树脂组合物，其包含：（A）100重量份具有熔点的结晶热塑性树脂，其通过差示扫描量热法（DSC）以10℃/ min的加热速率测定为250℃，或 以上; （B）10〜80重量份玻璃填料; （C）1〜30重量份在450nm以上的反射率为25％以上的激光直接结构化添加剂; 和（D）20〜150重量份的氧化钛。

公开(公告)号：US09352351B2

公开(公告)日：2016-05-31

申请号：US14375680

申请日：2013-01-30

Applicant: STORA ENSO OYJ

Inventor： Petri Sirviö ,  Juha Maijala

IPC: B05D5/12 ,  B05C1/00 ,  B05D3/12 ,  H05K3/10 ,  B05C19/00 ,  B05D1/00 ,  B05D1/28 ,  B05D3/02 ,  B05D3/06 ,  C23C26/02 ,  H05K1/03 ,  H05K3/12

CPC classification number: B05C1/003 ,  B05C19/008 ,  B05D1/007 ,  B05D1/28 ,  B05D3/0263 ,  B05D3/029 ,  B05D3/06 ,  B05D3/12 ,  C23C26/02 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/102 ,  H05K3/1241 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2201/0293 ,  H05K2203/0126 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/102 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1545 ,  H05K2203/1581

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Abstract translation: 公开了用于在表面上产生导电图案的方法和装置。 将导电固体颗粒转移到基板表面上的预定形式的区域上。 将导电固体颗粒加热到高于导电固体颗粒的特征熔点的温度，从而产生熔体。 熔融物在辊隙中被压靠在基底上，其中一部分辊隙对熔体的表面温度低于所述特征熔点。

公开(公告)号：US20150257263A1

公开(公告)日：2015-09-10

申请号：US14638272

申请日：2015-03-04

Applicant: Rogers Corporation

Inventor： Murali Sethumadhavan ,  Ani Shere ,  Mike White

IPC: H05K1/03 ,  H05K1/02 ,  H01L33/60 ,  H01L25/075 ,  H01L33/48

CPC classification number: H05K1/0366 ,  D21H13/00 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/038 ,  H05K2201/0141 ,  H05K2201/0162 ,  H05K2201/0191 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10T428/2495 ,  H01L2924/00

Abstract: A dielectric substrate comprises a resin composition impregnated with non-woven fibrous mat material having a thickness of 5 mils (127 micrometers), wherein the fibrous mat material comprises fibers, having a diameter of 1 nm to 10 μm, that have been extruded through one or more openings to produce fibers that have been collected in the form of a fibrous non-woven mat, and wherein the fibers exhibit a multi-directional orientation in the non-woven mat material. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent electrical and mechanical properties.

Abstract translation: 电介质基材包括浸渍有5密耳（127微米）厚度的无纺纤维垫材料的树脂组合物，其中纤维垫材料包括直径为1nm至10μm的纤维，其已经通过一个挤出 或更多的开口以产生以纤维无纺毡的形式收集的纤维，并且其中所述纤维在所述无纺毡材料中呈现多方向取向。 电介质基片在电路材料，电路和多层电路中是有用的，经济地制造，并具有优良的电气和机械性能。

公开(公告)号：US09125310B2

公开(公告)日：2015-09-01

申请号：US13328468

申请日：2011-12-16

Applicant: Mohammad Moniruzzaman

Inventor： Mohammad Moniruzzaman

IPC: H01B1/06 ,  H05K1/03 ,  H01B1/24 ,  H01L23/29 ,  H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0366 ,  H01B1/24 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K9/0079 ,  H05K2201/0154 ,  H05K2201/0293 ,  H01L2924/00

Abstract: The present disclosure relates to thermoplastic electrostatic dissipative (ESD) composites. The disclosed composites comprise a thermoplastic resin phase and a plurality of intermediate modulus carbon fibers dispersed within the thermoplastic resin phase. Also disclosed herein are methods for the manufacture and/or use of the disclosed ESD composites as well as articles formed from such composites.

Abstract translation: 本公开涉及热塑性静电耗散（ESD）复合材料。 所公开的复合材料包括分散在热塑性树脂相内的热塑性树脂相和多个中等模量的碳纤维。 本文还公开了用于制造和/或使用所公开的ESD复合材料以及由这种复合材料形成的制品的方法。

公开(公告)号：US20150159016A1

公开(公告)日：2015-06-11

申请号：US14367337

申请日：2011-12-29

Applicant: Yungdong Meng ,  Kehong Fang

Inventor： Yungdong Meng ,  Kehong Fang

IPC: C08L79/00 ,  C08L71/12 ,  C08L63/00 ,  C08J5/24

CPC classification number: C08L79/00 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/00 ,  C08J2463/00 ,  C08J2471/12 ,  C08J2479/00 ,  C08K5/5313 ,  C08L63/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2201/02 ,  C08L2205/03 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T428/31522 ,  Y10T442/20 ,  C08L79/04

Abstract: The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.

Abstract translation: 本发明涉及一种热固性树脂组合物，以及由其制成的用于印刷电路板的预浸料和层压材料。 热固性树脂组合物包含以下组分：低分子量的含磷聚苯醚树脂，环氧树脂，氰酸酯树脂和促进剂。 使用树脂组合物制造的预浸料包含基材，并且通过浸渍和干燥将热固性树脂组合物粘附到基材上。 使用该树脂组合物制造的印刷电路板用层压体包括多层叠预浸料，通过压制覆盖层叠预浸料坯的一面或两面的金属箔，每个预浸料坯包含基材，并且热固性树脂组合物粘附于基材 材料通过浸渍和干燥。 本发明的热固性树脂组合物具有低介电常数和介电损耗因子，高耐热性，高玻璃化转变温度和阻燃性等性质。使用该印刷电路板制造的印刷电路板的层压板具有优异的 金属箔剥离强度，耐热性和介电性能，适用于高频高速电路板。

公开(公告)号：US20140147682A1

公开(公告)日：2014-05-29

申请号：US14129183

申请日：2013-03-15

Applicant: MITSUBISHI ENGINEERING PLASTICS CORPORATION

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara

IPC: C08K3/00 ,  H05K1/03 ,  F21V7/22

CPC classification number: C08K3/00 ,  C08K3/22 ,  C08K3/2279 ,  C08K3/40 ,  C08K7/14 ,  C08K9/02 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L23/06 ,  C08L77/06 ,  C08L91/06 ,  C08L101/12 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  F21V7/22 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0723 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

Abstract translation: 提供一种热塑性树脂组合物，其电镀性（电镀外观）优异，即使在热老化后也保持高反射率。 一种热塑性树脂组合物，其包含：（A）100重量份具有熔点的结晶热塑性树脂，其通过差示扫描量热法（DSC）以10℃/ min的加热速率测定为250℃，或 以上; （B）10〜80重量份玻璃填料; （C）1〜30重量份在450nm以上的反射率为25％以上的激光直接结构化添加剂; 和（D）20〜150重量份的氧化钛。

公开(公告)号：US20140002311A1

公开(公告)日：2014-01-02

申请号：US14005692

申请日：2012-03-16

Applicant: Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

IPC: C08K13/04 ,  H01Q1/38

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract translation: 提供了弯曲强度，弯曲模量和夏氏冲击强度优异的热塑性树脂成型体，其上可以成功地形成镀层。 用于激光直接结构的热塑性树脂组合物包括：相对于100重量份的热塑性树脂，10至150重量份的无机纤维和1至30重量份的激光直接结构化添加剂，所述激光直接结构化添加剂包含 铜，锑和锡中的至少一种，并且具有比无机纤维的莫氏硬度小1.5或更大的莫氏硬度。

公开(公告)号：US20130260123A1

公开(公告)日：2013-10-03

申请号：US13827796

申请日：2013-03-14

Applicant: John R. Krahn ,  Erich Otto Teutsch ,  Dennis Lockyer ,  Thomas Adjei

Inventor： John R. Krahn ,  Erich Otto Teutsch ,  Dennis Lockyer ,  Thomas Adjei

IPC: H01B3/52 ,  H01B19/00

CPC classification number: H01B3/52 ,  B32B27/12 ,  B32B2262/02 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/14 ,  B32B2307/206 ,  B32B2379/08 ,  B32B2457/00 ,  B32B2457/04 ,  C08J5/048 ,  C08J2379/08 ,  D04H1/541 ,  D21H5/0002 ,  D21H5/2671 ,  D21H17/72 ,  D21H21/18 ,  H01B19/00 ,  H05K1/0366 ,  H05K2201/0293

Abstract: Fibrous substrates containing polyetherimides and other synthetic fibers are disclosed, along with methods of preparing electrical insulation paper and articles comprising the fibrous substrates.

Abstract translation: 公开了含有聚醚酰亚胺和其它合成纤维的纤维底物，以及制备电绝缘纸和包含纤维基材的制品的方法。