Abstract:
An exemplary patch panel includes a printed circuit board having a plurality of signal terminals for connecting to two pairs of peripheral component interconnect express (PCI-E) X1 differential signal terminals of an I/O controller hub (ICH), an interface terminal of a high definition multimedia interface (HDMI), four pairs of differential signal terminals of the HDMI, four pairs of differential signal terminals of a graphic and memory controller hub (GMCH), one of another differential signal terminal of the GMCH, and two pairs of differential signal terminals of a PCI-E X16 slot. Therefore, the ICH is connected to the PCI-E X16 slot via the patch panel for supporting a PCI-E X1 card while the GMCH is connected to the HDMI via the patch panel. A patch panel connector is provided to mount the patch panel on a motherboard.
Abstract:
The invention relates to a data processing system with a main board, in which main board has at least one multipoint connector, in which at least one riser card is accommodated, and a first daughter card is accommodated in first riser card in such a manner that first daughter card is arranged parallel to main board. The data processing system further comprises a second multipoint connector, wherein a second riser card is accommodated in second multipoint connector, and a second daughter card is accommodated in second riser card in such a manner that second daughter card is arranged parallel to main board. The First multipoint connector and the second multipoint connectors are arranged on opposite outer sides of the main board. Each daughter card comprises a respective I/O interface which each cooperates with a common rear panel and is pointed towards the common rear panel. Relative to second daughter card, first daughter card is arranged rotated by 180° about an axis running parallel to main board.
Abstract:
A circuit topology for multiple loads includes a driving terminal, a first node coupled to the driving terminal via a main transmission line, a second node coupled to the first node via a first branch transmission line, a first receiving terminal coupled to the first node via a second branch transmission line, a third node coupled to the second node via a third branch transmission line, and a second receiving terminal coupled to the second node via a fourth branch transmission line. The second branch transmission line is longer than the first transmission line, and a first resistor is connected in the second branch transmission line. The third branch transmission line is longer than the fourth branch transmission line, and a second resistor is connected in the third branch transmission line.
Abstract:
A differential connector has a plurality of rows. Each row includes a plurality of signal conductors provided as differential pairs. Each signal conductor has a first contact end connectable to a printed circuit board, a second contact end, and an intermediate portion having a first width. For each differential pair, one first contact end lies along a first line parallel to the plurality of rows and the other first contact end lies along a second line parallel to and spaced from the first line. The differential connector further includes a plurality of ground conductors, with each ground conductor corresponding to a differential pair. Each ground conductor has a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion having a second width that is at least twice the first width.
Abstract:
System including backplane, and first and second circuit boards. First circuit board is attached to backplane and has first optical signal transmitter. Second circuit board is attached to backplane and has first optical signal receiver. First optical signal transmitter and first optical signal receiver are mutually configured and mutually aligned for circuit board test signal communication from first circuit board to second circuit board across free space. Method includes providing backplane and first and second circuit boards, where first circuit board has first optical signal transmitter and second circuit board has first optical signal receiver. Method further includes attaching first and second circuit boards to backplane, and mutually configuring and mutually aligning first optical signal transmitter and first optical signal receiver for circuit board test signal communication from first circuit board to second circuit board across free space.
Abstract:
A memory module includes a first signal line to carry a first signal that enters the module at a first end of the first signal line and a second signal line to carry a second signal that enters the module at a first end of the second signal line. The module includes a first memory device disposed on a first side of the module and a second memory module disposed on a second side of the module positioned opposite to the first side. The first memory device and the second memory device are connected to the first signal line and the second signal line. The first signal and the second signal traverse alongside each other to arrive in turn at the first memory device and the second memory device.
Abstract:
An exemplary motherboard includes a driving module, a first slot module arranged for mounting a first type of memory and connected to the driving module via a first channel, a second slot module arranged for mounting a second type of memory and connected to the driving module via a second channel, and a voltage regulator electronically connected to the first slot module and the second slot module. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly.
Abstract:
A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.
Abstract:
A power plane including a supply power pin receptacle, a first connector power pin receptacle, and a second power pin receptacle, where a first electrical resistance between the supply power pin receptacle and the first connector power pin receptacle is substantially equal to a second electrical resistance between the supply power pin receptacle and the second connector power pin receptacle.
Abstract:
A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. Specific via designs reduce differential signal distortion due to the via pair, allowing the backplane to operate reliably at differential signal rates in excess of 3 Gigabits per second. In particular, each via passes through nonfunctional conductive pads on selected digital ground plane layers, the pads separated from the remainder of its ground plane layer by a clearance, thereby modifying the impedance of the via and reducing reflections from the stubs created by the via.