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公开(公告)号：US20160301150A1
公开(公告)日：2016-10-13
申请号：US15095362
申请日：2016-04-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jin-Hyuk CHOI , Jae-Woo LEE , Jee-Young JUNG , Jong-Chul CHOI
CPC classification number: H05K5/03 , G06F1/16 , G06F1/1616 , G06F1/1635 , G06F1/1647 , G06F1/1681 , G06F1/1683 , G06F2200/1633 , H04M1/0216 , H04M1/0247 , H04M2250/16 , H05K1/0281 , H05K1/148 , H05K2201/057
Abstract: An electronic device includes a first main body part at least one second main body part connected to the first main body part so as to be rotatable, or such that the first and second main body parts pivot relative to each other, and a connecting part that connects the second main body part to the first main body part or another second main body part adjacent thereto, wherein the connecting part includes a connecting member that rotatably connects the first and at least one second main body parts, a flexible printed circuit board (FPCB) that is surrounded by the connecting member and electrically connects at least one second main body part to the first main body part and a reinforcing member that is interposed between the connecting member and the FPCB and at least partially overlaps the FPCB.
Abstract translation: 电子设备包括第一主体部分，至少一个第二主体部分，其连接到第一主体部分以便可旋转，或者使得第一和第二主体部分相对于彼此枢转;以及连接部分， 将第二主体部分连接到与其相邻的第一主体部分或另一个第二主体部分，其中连接部分包括可旋转地连接第一和至少一个第二主体部分的连接部件，柔性印刷电路板（FPCB ），其被连接构件包围并且将至少一个第二主体部分电连接到第一主体部分，以及加强构件，其插入在连接构件和FPCB之间，并且至少部分地与FPCB重叠。
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公开(公告)号：US09407798B2
公开(公告)日：2016-08-02
申请号：US14028268
申请日：2013-09-16
Applicant: Apple Inc.
Inventor： David G. Havskjold , Emery A. Sanford
CPC classification number: H04N5/2253 , G01J1/4204 , H04M1/0264 , H04M1/0277 , H04M2250/12 , H05K1/028 , H05K1/189 , H05K2201/046 , H05K2201/055 , H05K2201/057 , H05K2201/09045
Abstract: An electronic device may have electrical components such as input-output devices. An electrical component may be mounted on a flexible printed circuit. The flexible printed circuit may have a bend that forms a flexible printed circuit spring to bias the electrical component in a desired direction. The electronic device may have a display with a display cover layer. In an inactive display area, opaque masking material may be formed on the display cover layer. A light window may be formed in the opaque masking layer. The flexible printed circuit spring may bias the electrical component against the display cover layer in alignment with the light window. An air gap under the electrical component may separate the component from a planar portion of the flexible printed circuit that is overlapped by the electrical component. The electrical component may be a camera, a light sensor, or other device.
Abstract translation: 电子设备可以具有诸如输入 - 输出设备的电气部件。 电气部件可以安装在柔性印刷电路上。 柔性印刷电路可以具有形成柔性印刷电路弹簧的弯曲部，以在期望的方向上偏置电气部件。 电子设备可以具有带有显示器覆盖层的显示器。 在非活动显示区域中，可以在显示器覆盖层上形成不透明掩模材料。 可以在不透明掩模层中形成光窗。 柔性印刷电路弹簧可以将电气部件偏置在与光窗口对准的显示器覆盖层上。 电气部件下方的空气间隙可以将部件与由电气部件重叠的柔性印刷电路的平面部分分离。 电气部件可以是相机，光传感器或其他装置。
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公开(公告)号：US20140166344A1
公开(公告)日：2014-06-19
申请号：US14183558
申请日：2014-02-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru KATO , Jun SASAKI , Satoshi ISHINO
IPC: H05K1/02
CPC classification number: H05K1/0281 , H05K1/024 , H05K1/028 , H05K1/0298 , H05K1/032 , H05K1/09 , H05K2201/0141 , H05K2201/057 , H05K2201/0715 , H05K2201/09018 , H05K2201/09409
Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
Abstract translation: 保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。 信号线在主体中延伸。 接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。 接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。 主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。
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公开(公告)号：US20140104792A1
公开(公告)日：2014-04-17
申请号：US13649324
申请日：2012-10-11
Applicant: APPLE INC.
Inventor： Peter N. Jeziorek
CPC classification number: H05K3/0061 , H05K1/189 , H05K2201/057
Abstract: A flexible printed circuit may be laminated to a metal stiffener. The stiffener may be bent to hold the flexible printed circuit in a desired position. Openings may be formed in the stiffener. Metal traces on the flexible printed circuit may be accessed through the openings. Test points in the metal traces may be accessed through the openings or components may be mounted to the metal traces on the flexible printed circuit through the openings. The stiffener may have bends. The bends may be used to shape the stiffener and flexible printed circuit to form an enclosure. The openings in the stiffener may overlap the bends or may be located away from the bends. Flexible printed circuits mounted on bent stiffeners may be used to form elongated tubes with planar sides.
Abstract translation: 柔性印刷电路可以层压到金属加强件上。 加强件可以被弯曲以将柔性印刷电路保持在期望的位置。 开口可以形成在加强件中。 柔性印刷电路上的金属迹线可以通过开口进入。 可以通过开口访问金属迹线中的测试点，或者可以通过开口将部件安装到柔性印刷电路上的金属迹线上。 加强筋可能有弯曲。 弯曲部可用于成形加强件和柔性印刷电路以形成外壳。 加强件中的开口可以与弯曲重叠，或者可以远离弯曲部分。 安装在弯曲加强筋上的柔性印刷电路可用于形成具有平面侧面的细长管。
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公开(公告)号：US20120138340A1
公开(公告)日：2012-06-07
申请号：US13369363
申请日：2012-02-09
Applicant: Noboru KATO , Jun SASAKI , Satoshi ISHINO
Inventor： Noboru KATO , Jun SASAKI , Satoshi ISHINO
IPC: H05K1/09
CPC classification number: H05K1/0281 , H05K1/024 , H05K1/028 , H05K1/0298 , H05K1/032 , H05K1/09 , H05K2201/0141 , H05K2201/057 , H05K2201/0715 , H05K2201/09018 , H05K2201/09409
Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
Abstract translation: 保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。 信号线在主体中延伸。 接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。 接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。 主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。
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Patent Agency Ranking
公开(公告)号：US06948240B2
公开(公告)日：2005-09-27
申请号：US10256842
申请日：2002-09-27
Applicant: Yung-Tsun Hsieh
Inventor： Yung-Tsun Hsieh
CPC classification number: H05K1/0281 , B29C53/04 , B29C53/84 , B29K2069/00 , B29K2079/08 , B29L2031/3431 , H05K3/0064 , H05K2201/0129 , H05K2201/057 , H05K2201/2009 , H05K2203/1105 , H05K2203/302 , Y10T29/49117 , Y10T29/49187
Abstract: A method for shaping an object. The method includes the steps of preparing an attachment material having a glass transition temperature lower than that of the object, fixing the attachment material on the object, forming the object into a predetermined shape, heating the attachment material until the temperature is higher than its glass transition temperature, and cooling the attachment material and the object until the temperature is lower than the glass transition temperature of the attachment material. Additionally, shaping of the object and heating of the attachment material can achieve the same results.
Abstract translation: 一种用于成形物体的方法。 该方法包括以下步骤：制备玻璃化转变温度低于物体的附着材料，将附着材料固定在物体上，将物体形成预定形状，加热附着材料直到温度高于玻璃 过渡温度，并且冷却附着材料和物体直到温度低于附着材料的玻璃化转变温度。 此外，物体的成形和附着材料的加热可以获得相同的结果。
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47.发明申请Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects 审中-公开用于生产包括至少一个可发泡区域的功能元件的材料和用于定位和安装物体的所述功能元件的使用公开(公告)号：US20050145411A1
公开(公告)日：2005-07-07
申请号：US10497757
申请日：2003-01-23
Applicant: Ulf Feistel , Roland Diener , Uwe Weinzierl
Inventor： Ulf Feistel , Roland Diener , Uwe Weinzierl
CPC classification number: G02B6/4405 , G02B6/4226 , H05K1/0281 , H05K1/0289 , H05K3/4084 , H05K2201/0112 , H05K2201/057 , H05K2201/2009 , H05K2203/107 , H05K2203/1189
Abstract: The aim of the invention is to provide positioning and mounting options with improved handling characteristics even at places that are difficult to access or in other difficult conditions. Said aim is achieved by using functional elements comprising at least one area that can be foamed by supply energy. At least one of said areas is used as a positioning element for positioning an object or for stiffening flexible or easily bendable materials in a shape-stabilizing manner.
Abstract translation: 本发明的目的是提供即使在难以进入的地方或在其他困难条件下的改进的处理特性的定位和安装选项。 所述目的通过使用包括至少一个可通过供应能发泡的区域的功能元件实现。 所述区域中的至少一个用作用于定位物体的定位元件或用于以形状稳定的方式加固柔性或易弯曲的材料。
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公开(公告)号：US20030066678A1
公开(公告)日：2003-04-10
申请号：US10256842
申请日：2002-09-27
Applicant: BENQ CORPORATION
Inventor： Yung-Tsun Hsieh
IPC: H05K001/00 , B29C031/00
CPC classification number: H05K1/0281 , B29C53/04 , B29C53/84 , B29K2069/00 , B29K2079/08 , B29L2031/3431 , H05K3/0064 , H05K2201/0129 , H05K2201/057 , H05K2201/2009 , H05K2203/1105 , H05K2203/302 , Y10T29/49117 , Y10T29/49187
Abstract: A method for shaping an object. The method includes the steps of preparing an attachment material having a glass transition temperature lower than that of the object, fixing the attachment material on the object, forming the object into a predetermined shape, heating the attachment material until the temperature is higher than its glass transition temperature, and cooling the attachment material and the object until the temperature is lower than the glass transition temperature of the attachment material. Additionally, shaping of the object and heating of the attachment material can achieve the same results.
Abstract translation: 一种用于成形物体的方法。 该方法包括以下步骤：制备玻璃化转变温度低于物体的附着材料，将附着材料固定在物体上，将物体形成预定形状，加热附着材料直到温度高于玻璃 过渡温度，并且冷却附着材料和物体直到温度低于附着材料的玻璃化转变温度。 此外，物体的成形和附着材料的加热可以获得相同的结果。
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公开(公告)号：US4997702A
公开(公告)日：1991-03-05
申请号：US475454
申请日：1990-02-06
Applicant: Samuel Gazit , Gary W. Adams
Inventor： Samuel Gazit , Gary W. Adams
CPC classification number: H05K1/0373 , B32B27/20 , H05K1/0366 , H05K1/0393 , H05K2201/015 , H05K2201/0209 , H05K2201/0239 , H05K2201/0251 , H05K2201/0254 , H05K2201/0278 , H05K2201/0293 , H05K2201/057 , H05K2201/068 , Y10S428/901 , Y10T428/24917 , Y10T442/2713
Abstract: A printed circuit board composed of an epoxy impregnated nonwoven web substrate laminated to electrically conductive sheets is presented. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems. The printed circuit board also has improved thermal properties achieved through the addition of up to 70% by weight of low coefficient of thermal expansion (CTE) particulate fillers and/or the use of thermally stable reinforcement fibers in the non-woven web.
Abstract translation: 提出了一种印刷电路板，其由层压在导电片上的环氧树脂浸渍非织造网基材组成。 印刷电路板的灵活性在于它可以弯曲成任何所需的多平面形状，并且在电气互连系统所要求的安装之后将保持该形状。 印刷电路板还具有通过添加高达70重量％的低热膨胀系数（CTE）颗粒填料和/或在无纺布网中使用热稳定的增强纤维而获得的改进的热性能。
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公开(公告)号：US4528748A
公开(公告)日：1985-07-16
申请号：US445127
申请日：1982-11-29
Applicant: Charles W. Eichelberger , Robert J. Wojnarowski , Abraham Auerbach
Inventor： Charles W. Eichelberger , Robert J. Wojnarowski , Abraham Auerbach
CPC classification number: H05K3/44 , H05K3/0014 , H05K1/053 , H05K1/056 , H05K1/095 , H05K1/189 , H05K2201/0347 , H05K2201/057 , H05K2203/0709 , H05K2203/302 , Y10T29/49124 , Y10T29/49135
Abstract: A method is described for batch-fabricating flat printed circuit boards and subsequently forming the circuit boards to a particular desired shape. In particular, a conductive substrate is coated with an insulating coating and conductors are fabricated thereon, with integrated circuit and chip resistor/capacitor parts being mounted to the fabricated conductor patterns. After part-mounting, the circuit board is bent to the desired shape.
Abstract translation: 描述了用于批量制造平面印刷电路板并且随后将电路板形成为特定期望形状的方法。 特别地，导电基板涂覆有绝缘涂层，并且在其上制造导体，其中集成电路和芯片电阻器/电容器部件安装到制造的导体图案。 在部件安装之后，电路板弯曲到所需的形状。
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