公开(公告)号：US09402300B2

公开(公告)日：2016-07-26

申请号：US14701730

申请日：2015-05-01

Applicant: NGK Insulators, Ltd.

Inventor： Shinsuke Yano ,  Makoto Tani ,  Hirokazu Nakanishi

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K1/02 ,  H01L33/48 ,  H05K1/05

CPC classification number: H05K1/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/053 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/1126 ,  H01L2924/00

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing an insulation reliability and high-humidity reliability of the substrate is provided.

Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基底和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种通过在不降低基板的绝缘可靠性和高湿度可靠性的情况下实现作为整个基板的总热阻的低热阻而能够显示高散热能力的发光二极管的基板。

公开(公告)号：US09397060B2

公开(公告)日：2016-07-19

申请号：US14819189

申请日：2015-08-05

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chen-Hua Yu ,  Mirng-Ji Lii ,  Hao-Yi Tsai ,  Hsien-Wei Chen ,  Kai-Chiang Wu

IPC: H01L23/02 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L25/10 ,  H01L23/367 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H01L23/498

CPC classification number: H01L24/14 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/11011 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/068 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A package on packaging structure comprising a first package and a second package provides for improved thermal conduction and mechanical strength by the introduction of a thermally conductive substrate attached to the second package. The first package has a first substrate and a first integrated circuit. The second package has a second substrate containing through vias that has a first coefficient of thermal expansion. The second package also has a second integrated circuit having a second coefficient of thermal expansion located on the second substrate. The second coefficient of thermal expansion deviates from the first coefficient of thermal expansion by less than about 10 or less than about 5 parts-per-million per degree Celsius. A first set of conductive elements couples the first substrate and the second substrate. A second set of conductive elements couples the second substrate and the second integrated circuit.

公开(公告)号：US09374889B2

公开(公告)日：2016-06-21

申请号：US14202140

申请日：2014-03-10

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kei Murayama ,  Mitsuhiro Aizawa ,  Koji Hara

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/46 ,  H01L23/00 ,  H05K1/03 ,  H05K3/40

CPC classification number: H05K1/0271 ,  H01L21/563 ,  H01L23/00 ,  H01L23/13 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K3/4061 ,  H05K3/467 ,  H05K3/4688 ,  H05K2201/0179 ,  H05K2201/068 ,  H05K2201/10378 ,  H01L2924/00

Abstract: An interposer includes a wiring member including a first inorganic substrate, a reinforcement member including a second inorganic substrate, and an adhesive part interposed between the wiring member and the reinforcement member. Each of the first and second inorganic substrates includes first and second surfaces. Multiple inorganic insulating layers formed on the first surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in a vertical direction with the adhesive part centered therebetween. An inorganic insulating layer and an organic insulating layer formed on the second surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in the vertical direction with the adhesive part. An organic insulating layer formed on the second surface of each of the first and second inorganic substrates is an outermost insulating layer.

Abstract translation: 插入件包括布线构件，该布线构件包括第一无机基板，包括第二无机基板的加强构件和插入在布线构件和加强构件之间的粘合部。 第一和第二无机基材中的每一个包括第一和第二表面。 形成在第一和第二无机基板的每一个的第一表面上的多个无机绝缘层具有相同的层构造，并且在粘合剂部分居中的同时在垂直方向上对称地布置。 形成在第一和第二无机基板的第二表面上的无机绝缘层和有机绝缘层具有相同的层构造，并且在垂直方向上与粘合部对称地配置。 形成在第一和第二无机基板的第二表面上的有机绝缘层是最外层的绝缘层。

公开(公告)号：US09363897B2

公开(公告)日：2016-06-07

申请号：US14133372

申请日：2013-12-18

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Yuichi Sugiyama ,  Tatsuro Sawatari ,  Yusuke Inoue ,  Masashi Miyazaki

IPC: H05K1/18 ,  H05K1/02 ,  H01L23/00 ,  H05K3/46

CPC classification number: H05K1/183 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface.

Abstract translation: 提供了具有内置电子部件的基板，包括部件存储层和两个累积层。 部件存储层包括电子部件和具有绝缘性的盖部。 电子部件包括终端面和主体。 盖部包括形成为与端子表面齐平的第一表面，覆盖电子部件的主体，并且具有第一线性膨胀系数。 两个堆积层各自包括绝缘层和通孔部分。 绝缘层与盖部相邻，并且具有大于第一线膨胀系数的第二线膨胀系数。 通孔部分设置在绝缘层中并连接到端子表面。 两个堆积层之一的绝缘层形成为与端子表面和第一表面接触。

公开(公告)号：US20160137787A1

公开(公告)日：2016-05-19

申请号：US14901006

申请日：2014-06-26

Applicant: UBE INDUSTRIES, LTD.

Inventor： Takuya Oka ,  Yukinori Kohama ,  Yoshiyuki Watanabe ,  Nobuharu Hisano

IPC: C08G73/10 ,  H05K1/03 ,  C09D179/08

CPC classification number: C08G73/1028 ,  C08G73/1007 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1078 ,  C08G73/14 ,  C09D179/08 ,  H05K1/0346 ,  H05K1/0353 ,  H05K2201/0154 ,  H05K2201/068

Abstract: A polyimide precursor consisting of a repeating unit represented by the following chemical formula (1): and a repeating unit represented by the following chemical formula (2): in which A is a tetravalent group of a tetracarboxylic acid, from which carboxyl groups have been removed; B is a divalent group of a diamine, from which amino groups have been removed; with the proviso that the A group and the B group contained in each repeating unit may be the same as, or different from each other; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, the amount of the repeating unit represented by the chemical formula (2) is 30 mol % or more and 90 mol % or less relative to the total repeating units, 50 mol % or more of the total amount of the B group in the chemical formula (1) and the chemical formula (2) is p-phenylene group and/or a specific divalent group containing two or more benzene rings, the polyimide precursor is produced by thermal imidization.

Abstract translation: 由以下化学式（1）表示的重复单元构成的聚酰亚胺前体和由以下化学式（2）表示的重复单元：其中A是四羧酸的四价基团，其中羧基已经被 删除 B是二胺基团，其中氨基已被除去; 条件是每个重复单元中所含的A基团和B基团可以彼此相同或不同; X 1和X 2各自独立地为氢，具有1至6个碳原子的烷基或具有3至9个碳原子的烷基甲硅烷基，由化学式（2）表示的重复单元的量为30摩尔％以上 相对于总重复单元为90摩尔％以下，化学式（1）和化学式（2）中的B基的总量的50摩尔％以上为对亚苯基和/或特定的 含有两个或更多个苯环的二价基团，通过热酰亚胺化制备聚酰亚胺前体。

公开(公告)号：US20160135279A1

公开(公告)日：2016-05-12

申请号：US14935512

申请日：2015-11-09

Applicant: United Technologies Corporation

Inventor： Paul Sheedy ,  Sameh Dardona ,  Michael G. McCaffrey ,  Wayde R. Schmidt ,  Slade R. Culp

IPC: H05K1/02 ,  H05K1/18 ,  G01M15/14 ,  H05K1/03

CPC classification number: H05K1/0201 ,  F01D5/284 ,  F01D17/02 ,  F01D25/005 ,  F05D2300/211 ,  F05D2300/222 ,  G01M15/14 ,  H05K1/0306 ,  H05K1/18 ,  H05K2201/068

Abstract: An instrumented article includes a ceramic-based substrate and at least one conformal electronic device deposited on a surface of the ceramic-based substrate. A compliant layer is located between the ceramic-based substrate and the one or more conformal electronic devices. The compliant layer has a thermal expansion that is intermediate of the thermal expansions of, respectively, the ceramic-based substrate and the one or more conformal electronic devices.

Abstract translation: 仪器化制品包括沉积在陶瓷基底表面上的基于陶瓷的衬底和至少一个保形电子器件。 柔性层位于陶瓷基底和一个或多个适形电子器件之间。 柔性层具有分别为基于陶瓷的衬底和一个或多个保形电子器件的热膨胀中间的热膨胀。

公开(公告)号：US09320148B2

公开(公告)日：2016-04-19

申请号：US13431091

申请日：2012-03-27

Applicant: Yukinobu Mikado ,  Shunsuke Sakai ,  Hirofumi Futamura

Inventor： Yukinobu Mikado ,  Shunsuke Sakai ,  Hirofumi Futamura

IPC: H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K3/46 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498

CPC classification number: H05K1/185 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/1469 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate having a penetrating hole extending through the core substrate, an electronic component accommodated in the penetrating hole of the core substrate, a filler resin filling clearance between the component and the core substrate, a first resin insulation layer formed on the component and a first surface of the core substrate, and a second resin insulation layer formed on the component and a second surface of the core substrate on the opposite side of the first surface of the core substrate. The filler resin has elastic modulus which is set to be lower than 0.2 Gpa and thermal expansion coefficient which is set to be higher than 100 ppm and lower than 200 ppm, and the core substrate has elastic modulus which is set to be higher than 30 Gpa, and thermal expansion coefficient which is set to be lower than 10 ppm.

Abstract translation: 印刷电路板包括具有延伸穿过芯基板的穿透孔的芯基板，容纳在芯基板的贯通孔中的电子部件，部件和芯基板之间的填充树脂填充间隙，形成第一树脂绝缘层 在芯基板的第一表面和与芯基板的第一表面相反的一侧上形成的第二树脂绝缘层和芯基板的第二表面上。 填充树脂的弹性模量设定为低于0.2Gpa，热膨胀系数设定为高于100ppm且低于200ppm，芯基材的弹性模量设定为高于30Gpa ，热膨胀系数设定为低于10ppm。

公开(公告)号：US09271393B2

公开(公告)日：2016-02-23

申请号：US13943618

申请日：2013-07-16

Applicant: Kabushiki Kaisha Nihon Micronics

Inventor： Noboru Otabe ,  Toshinori Omori ,  Takayasu Sugai

IPC: G01R31/00 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0271 ,  H05K1/167 ,  H05K2201/0317 ,  H05K2201/068 ,  H05K2201/09781

Abstract: A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers.

Abstract translation: 多层布线基板包括绝缘板，绝缘板包括由绝缘材料制成的多个合成树脂层，设置在绝缘板中的布线电路，沿着至少一个合成树脂层形成的薄膜电阻器，以被埋入 所述合成树脂层插入到所述布线电路中，以及形成为埋设在所述合成树脂层附近的所述合成树脂层中的形成所述薄膜电阻器以埋设的所述合成树脂层的热膨胀和收缩限制层， 薄膜电阻器，并且具有比相邻合成树脂层的线膨胀系数小的线性膨胀系数。

公开(公告)号：US20160044783A1

公开(公告)日：2016-02-11

申请号：US14821961

申请日：2015-08-10

Applicant: IBIDEN CO., LTD.

Inventor： Toshiki Furutani ,  Shunsuke Sakai ,  Yasushi Inagaki

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4007 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/48091 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/068 ,  H01L2924/00014

Abstract: A printed wiring board includes a wiring conductor layer having a first surface, conductor posts formed on a second surface of the wiring conductor layer on the opposite side with respect to the first surface, and a resin insulating layer embedding the wiring conductor layer such that the first surface of the wiring conductor layer is recessed with respect to a first surface of the resin insulating layer and exposed on the first surface of the resin insulating layer and covering side surfaces of the conductor posts such that an end surface of each of the conductor posts is protruding from a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer.

Abstract translation: 印刷电路板包括具有第一表面的布线导体层，形成在相对于第一表面的相对侧的布线导体层的第二表面上的导体柱，以及嵌入布线导体层的树脂绝缘层， 布线导体层的第一表面相对于树脂绝缘层的第一表面凹陷，并且暴露在树脂绝缘层的第一表面上并覆盖导体柱的侧表面，使得每个导体柱的端表面 从树脂绝缘层的与树脂绝缘层的第一表面相反的一侧的第二表面突出。

公开(公告)号：US20160037031A1

公开(公告)日：2016-02-04

申请号：US14449903

申请日：2014-08-01

Applicant: POINT GREY RESEARCH INC.

Inventor： Jeffrey David BULL ,  Donald Ray MURRAY

IPC: H04N5/225 ,  H05K7/20 ,  H05K1/14 ,  H05K1/02

CPC classification number: H04N5/2253 ,  H04N5/2254 ,  H04N13/239 ,  H05K1/0201 ,  H05K1/0278 ,  H05K1/14 ,  H05K7/2039 ,  H05K2201/042 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/10121

Abstract: A circuit-carrying assembly for use in an imaging system, the assembly comprising a first circuit carrier; a second circuit carrier spaced apart from the first circuit carrier; at least one attachment member to attach the circuit-carrying assembly to a rigid support member; and a compliant part between the first circuit carrier and the second circuit carrier, the compliant part allowing the second circuit carrier to move towards and away from the first circuit carrier.

Abstract translation: 一种用于成像系统的电路承载组件，该组件包括第一电路载体; 与第一电路载体间隔开的第二电路载体; 至少一个附接构件，以将电路承载组件附接到刚性支撑构件; 以及在第一电路载体和第二电路载体之间的顺应部分，柔性部分允许第二电路载体朝向和远离第一电路载体移动。