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    Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins
    43.
    发明授权
    Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins 失效
    使用超声波搅拌销的阵列在非平面基板上分配焊膏的方法

    公开(公告)号：US5909839A

    公开(公告)日：1999-06-08

    申请号：US857159

    申请日：1997-05-15

    Applicant: Robert Edward Belke, Jr. ,  John Trublowski ,  Michael George Todd

    Inventor： Robert Edward Belke, Jr. ,  John Trublowski ,  Michael George Todd

    IPC: B23K1/20 ,  B23K31/02 ,  B23K35/14 ,  B60R16/02 ,  H05K1/00 ,  H05K3/34 ,  B23K35/12

    CPC classification number: H05K3/3484 ,  H02G3/266 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/0195 ,  H05K2203/0338

    Abstract: A method is provided for applying a fluid to a plurality of locations on a non-planar substrate. The apparatus used includes a movable base and an array of pins connected to the base. Each pin has a distal end which is vertically movable with respect to the base independently of the rest of the array of pins. Each distal end is adapted to transfer fluid to a location on the substrate by having a greater affinity for the fluid than the fluid has for itself and a lesser affinity for the fluid than the fluid has for the substrate. Accordingly, the distal ends may be dipped in the fluid and moved into contact with the substrate such that the distal ends may collapse toward the base as the distal ends engage the substrate to facilitate further movement of the base toward the substrate for application of fluid to each of the plurality of locations.

    Abstract translation: 提供了一种将流体施加到非平面基底上的多个位置的方法。 所使用的装置包括可移动基座和连接到基座的销的阵列。 每个销具有远端，该远端相对于底座可垂直移动，而与销的其余部分无关。 每个远端适合于通过对流体具有比流体本身更大的亲和力并且对流体具有比流体对底物更小的亲和力，将流体转移到基底上的位置。 因此，远端可以浸入流体中并且移动到与基底接触，使得当远端接合基底时，远端可能朝向基部折叠，以便于基部朝向基底的进一步移动以将流体施加到 多个位置中的每一个。

    Apparatus and method of elastically bowing a base plate
    44.
    发明授权
    Apparatus and method of elastically bowing a base plate 失效
    弹性弯曲底板的装置和方法

    公开(公告)号：US5461774A

    公开(公告)日：1995-10-31

    申请号：US217831

    申请日：1994-03-25

    Applicant: Jeffrey G. Holmes ,  Andrew C. McNeil

    Inventor： Jeffrey G. Holmes ,  Andrew C. McNeil

    IPC: H01L23/373 ,  H01L21/48 ,  H01L23/02 ,  H01L23/13 ,  H01L25/07 ,  H01L25/18 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H01R43/16 ,  H01B7/34

    CPC classification number: H05K3/0061 ,  H01L21/4878 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K2201/09018 ,  H05K2203/0405 ,  H05K3/341 ,  Y10T29/49144 ,  Y10T29/49863 ,  Y10T29/49869 ,  Y10T29/49968

    Abstract: An electronic module assembly (10) is constructed by attaching semiconductor die (20, 22) to corresponding ceramic substrates (16, 18). A solder preform (14) is placed between the ceramic substrates and a base plate (12) which in turn is placed on a mounting fixture (26). Steel shims (28-42) are placed around the perimeter between the base plate and the mounting fixture surface. A restraining mechanism (24) passes through the center of the base plate and fastens to the mounting fixture to create a force on the base plate causing it to bow in an elastic manner. The assembly is reflow soldered and cooled with the module assembly restrained in the pre-bow apparatus. The elastic bow compensates for differences in thermal expansion and contraction characteristics between the ceramic substrates and base plate encountered during the reflow and later processes to prevent stresses from developing on the solder bond between materials.

    Abstract translation: 通过将半导体管芯（20,22）附接到相应的陶瓷衬底（16,18）来构造电子模块组件（10）。 焊料预成型件（14）放置在陶瓷基板和底板（12）之间，底板（12）又放置在安装固定件（26）上。 钢垫片（28-42）围绕基板和安装夹具表面之间的周边放置。 约束机构（24）穿过基板的中心并固定到安装夹具上，以在基板上形成一个力，使其以弹性方式弯曲。 将组件回流焊接并冷却，模块​​组件被限制在前弓装置内。 弹性弓补偿在回流期间遇到的陶瓷基板和基板之间的热膨胀和收缩特性的差异，并且后续处理以防止应力在材料之间的焊料接合上发展。

    Method of applying a layer of conductive ink
    46.
    发明授权
    Method of applying a layer of conductive ink 失效
    施加导电油墨层的方法

    公开(公告)号：US4508755A

    公开(公告)日：1985-04-02

    申请号：US480217

    申请日：1983-03-30

    Applicant: Anthony B. Reintjes ,  Robert J. Fleming ,  Bev W. T. Gumb

    Inventor： Anthony B. Reintjes ,  Robert J. Fleming ,  Bev W. T. Gumb

    IPC: B05D5/12 ,  H05K1/00 ,  H05K3/12 ,  B41F17/00

    CPC classification number: H05K3/1275 ,  B05D5/12 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/0113 ,  H05K2203/0534

    Abstract: Electret transducers, for example microphones, have a backplate which is metallized on one surface, the metallized surface forming one side of a capacitor. A frame sits on the metallized tape to hold the tape taut over the backplate. Metal connections are made to the backplate and frame to complete the circuit. The metallization is conventionally formed by vapor deposition of aluminum. This is a lengthy and relatively expensive process. Also the metallization can give rise to galvanic problems. The invention prints a pattern of conductive ink on the various parts. Good contact is obtained, galvanic action avoided and a reduction in manufacturing costs occurs. Simplified assembly is also obtained.

    Abstract translation: 驻极体传感器（例如麦克风）具有在一个表面上金属化的背板，金属化表面形成电容器的一侧。 框架位于金属化胶带上，以将胶带绷紧在背板上。 金属连接是由背板和框架完成的。 金属化通常由铝的气相沉积形成。 这是一个漫长而相对昂贵的过程。 金属化也可能引起电偶问题。 本发明在各种部件上印刷导电油墨的图案。 获得良好的接触，避免电动作用并发生制造成本的降低。 也获得了简化的装配。

    Flat flexible printed circuit cable for a print head
    47.
    发明授权
    Flat flexible printed circuit cable for a print head 失效
    用于打印头的扁平柔性印刷电路电缆

    公开(公告)号：US4265549A

    公开(公告)日：1981-05-05

    申请号：US40890

    申请日：1979-05-21

    Applicant: Henry L. Cote

    Inventor： Henry L. Cote

    IPC: B41J2/23 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  B41J3/12

    CPC classification number: B41J2/23 ,  H05K1/118 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/053 ,  H05K2201/09018 ,  H05K2201/09181 ,  H05K2201/09781 ,  H05K2201/1003 ,  H05K2201/1009 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K3/3405 ,  H05K3/4092

    Abstract: A print head of the dot matrix impact type is provided with a plurality of solenoid assemblies arranged in a circular array about the rearward portion of the print head. A thin flexible printed circuit cable encircles the solenoid assemblies and has imbedded therein thin flexible wires each terminating at one end in an exposed connecting terminal and connected at their opposite ends to a connector plug mounted upon the cable and adapted to releaseably receive a mating connector. Embedded in the cable are a plurality of flat rigid plates serving as a stiffening member, interlocking tab and tab receiving members, a clamping member having an elongated embracing tab and a locating member having a pair of locating tabs for positively locating and orienting the printed circuit cable relative to the solenoid assemblies and for securing the locating member to one of the solenoid assemblies to prevent the cable from sliding about the print head solenoid assembly array.

    Abstract translation: 点阵冲击式的打印头设置有围绕打印头的后部以圆形阵列布置的多个螺线管组件。 薄柔性印刷电路电缆包围螺线管组件，并且内嵌有薄柔性电线，每根端接在暴露的连接端子的一端，并在其相对端连接到安装在电缆上的连接器插头，并适于可释放地接收配合连接器。 嵌入电缆中的是用作加强构件，互锁突片和突片接收构件的多个平坦的刚性板，具有细长的包围突片的夹紧构件和具有一对定位突片的定位构件，用于将印刷电路 电缆，并且用于将定位构件固定到螺线管组件中的一个，以防止电缆围绕打印头螺线管组件阵列滑动。

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