公开(公告)号：US20060244150A1

公开(公告)日：2006-11-02

申请号：US11381357

申请日：2006-05-02

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L23/48

CPC classification number: G11C5/04 ,  B82Y10/00 ,  G01R31/2822 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49433 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/08 ,  H01P5/028 ,  H05K1/024 ,  H05K1/0243 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Disclosed are IC package structures having stair stepped layers and which have no plated vias. Such structures can be fabricated either as discrete packages or as strips such as might be beneficial in for use with memory devices wherein critical or high speed signals can be routed along the length of the multi-chip strip package without having to have the signals ascend and descend from the interconnection substrate on which the assembly is mounted to the IC package termination and back as the signal transmits between devices.

公开(公告)号：US07112098B2

公开(公告)日：2006-09-26

申请号：US10759304

申请日：2004-01-20

Applicant: Tsutomu Matsuo ,  Masakazu Nagata

Inventor： Tsutomu Matsuo ,  Masakazu Nagata

IPC: H01R24/00

CPC classification number: H05K1/117 ,  H01R12/722 ,  H05K1/144 ,  H05K2201/09154 ,  H05K2201/2027

Abstract: A transmission board (10) comprises a frame body (30) and a surface board (20) supported by the frame body (30) and having a transmission circuit. The frame body (30) has plugging edges (33, 34) that project from the edges of the surface board (20) for guiding the terminals of mating connectors to connection pads on the surface board (20). The plugging edges have guiding slopes 33A and 33B, and 34A and 34B. At least the plugging edges of the frame body (30) are made of a metal or resin molding.

Abstract translation: 传输板（10）包括框体（30）和由框体（30）支撑并具有传输电路的表面板（20）。 框体（30）具有从表面板（20）的边缘突出的插入边缘（33,34），用于将配合连接器的端子引导到表面板（20）上的连接焊盘。 堵塞边缘具有引导斜面33A和33B以及34A和34B。框体（30）的至少堵塞边缘由金属或树脂模塑制成。

公开(公告)号：US06879040B2

公开(公告)日：2005-04-12

申请号：US10649005

申请日：2003-08-26

Applicant: Kee Yean Ng ,  Gurbir Singh

Inventor： Kee Yean Ng ,  Gurbir Singh

IPC: H01C1/14 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L33/48 ,  H01L33/62 ,  H05K3/34 ,  H01L23/04 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L33/486 ,  H01C1/14 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10106 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A surface mountable electronic device includes a body with a first surface for mounting the device. The first surface has recessed portions therein. Electrical contacts are provided in the first surface. The electrical contacts include first portions that form at least a portion of at least one inner surface of said recessed portions.

Abstract translation: 可表面安装的电子设备包括具有用于安装设备的第一表面的主体。 第一表面在其中具有凹部。 电触头设置在第一表面。 电触点包括形成所述凹部的至少一个内表面的至少一部分的第一部分。

公开(公告)号：US06818168B2

公开(公告)日：2004-11-16

申请号：US10092186

申请日：2002-03-06

Applicant: Refugio C. Morales

Inventor： Refugio C. Morales

IPC: B29C5902

CPC classification number: B29C67/0044 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0195 ,  H05K2203/0228

Abstract: The present invention relates to a tool, and method of its use, that puts a pair of bevels onto an edge of a printed circuit board (PCB) so that the PCB can be inserted into an expansion slot of a computer. The tool has a bevel wheel, preferably with a bi-laterally symmetrical angle channel shape, that is connected to a carriage. The bevel wheel rolls along the carriage while the bevel wheel is pressed onto the edge of the PCB so as to form the pair of bevels on the edge of the PCB. No material is removed from the PCB while forming the pair of bevels. The bevel wheel is forced upon the edge using a piston that monitors and regulates the pressure applied to the edge of the PCB in order to achieve a preferred height and angular orientation of the pair of bevels.

Abstract translation: 本发明涉及一种工具及其使用方法，其将一对斜面放置在印刷电路板（PCB）的边缘上，使得PCB可以插入到计算机的扩展槽中。 该工具具有斜盘轮，优选地具有连接到托架的双向对称的角形通道形状。 斜齿轮沿滑架滚动，而斜齿轮被压在PCB的边缘上，以便在PCB的边缘上形成一对斜面。 在形成一对斜面时，没有从PCB上移除材料。 使用活塞来迫使斜齿轮在边缘上，所述活塞监测和调节施加到PCB的边缘的压力，以便实现该对斜面的优选高度和角度定向。

公开(公告)号：US06764937B1

公开(公告)日：2004-07-20

申请号：US10385487

申请日：2003-03-12

Applicant: Hubert Allen Vander Plas ,  Frank Berauer

Inventor： Hubert Allen Vander Plas ,  Frank Berauer

IPC: H01L244

CPC classification number: H05K3/3484 ,  H01L24/11 ,  H01L24/13 ,  H01L29/0657 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10157 ,  H05K3/3452 ,  H05K3/403 ,  H05K2201/09154 ,  H05K2201/099 ,  H05K2203/0568 ,  H05K2203/1394 ,  H01L2224/0401

Abstract: A method for depositing a solder layer or solder bump on a sloped surface. The method includes etching a sloped surface on a planar semiconductor substrate, depositing a solder-wettable layer on the sloped surface, masking the wettabler layer with a coating layer to control the position of the solder deposition, and using an organic film to prevent the solder from being deposited at regions not above either the wettable layer or the coating layer. Also, a semiconductor device structure on which a solder layer or solder bump is formed exclusively on a sloped surface.

Abstract translation: 一种用于在倾斜表面上沉积焊料层或焊料凸块的方法。 该方法包括蚀刻平面半导体衬底上的倾斜表面，在倾斜表面上沉积焊料可润湿层，用涂层掩蔽湿润层以控制焊料沉积的位置，并使用有机膜防止焊料 不会沉积在可湿性层或涂层之上的区域。 此外，其中仅在倾斜表面上形成焊料层或焊料凸块的半导体器件结构。

公开(公告)号：US20030222335A1

公开(公告)日：2003-12-04

申请号：US10448921

申请日：2003-05-29

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Koichi Hirano ,  Seiichi Nakatani ,  Hiroyuki Handa ,  Tsunenori Yoshida ,  Yoshihisa Yamashita ,  Hiroyuki Ishitomi

IPC: H01L023/02

CPC classification number: H01G2/065 ,  H01L25/0652 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/3011 ,  H05K1/185 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10568 ,  H05K2201/10636 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A circuit component package of the present invention includes a mounting member including a substrate and a wiring pattern provided on the substrate, a circuit component including a component body and an external electrode provided at an end of the component body, the circuit component being arranged on the mounting member, and a conductive material that electrically connects the external electrode with the wiring pattern. In the circuit component, the component body is shaped so that a first portion of the component body on which the external electrode is provided is thinner than a second portion of the component body, the second portion being a portion on which the external electrode is not provided, and further, the external electrode is arranged in a region on a side on which the component body is positioned with respect to a reference plane containing a predetermined surface of the component body. The circuit component is arranged on the mounting member so that the component body is in contact with the mounting member. The predetermined surface of the component body is a surface of the component body that is to be opposed to the mounting member when the circuit component is mounted on the mounting member.

Abstract translation: 本发明的电路部件封装包括：安装构件，包括基板和设置在基板上的布线图案;电路部件，包括部件主体和设置在部件主体的端部的外部电极，电路部件布置在 安装构件和将外部电极与布线图案电连接的导电材料。 在电路部件中，部件主体的形状使得设置有外部电极的部件主体的第一部分比部件主体的第二部分薄，第二部分是外部电极不在其上的部分 并且进一步地，外部电极相对于包含组件主体的预定表面的参考平面布置在组件主体位于其一侧的区域中。 电路部件设置在安装部件上，使得部件主体与安装部件接触。 当电路部件安装在安装部件上时，部件主体的预定表面是组件主体的与安装部件相对的表面。

公开(公告)号：US06501663B1

公开(公告)日：2002-12-31

申请号：US09514484

申请日：2000-02-28

Applicant: Alfred I-Tsung Pan

Inventor： Alfred I-Tsung Pan

IPC: H01L2352

CPC classification number: H01L21/288 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/2413 ,  H01L2224/24137 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19043 ,  H05K3/321 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4053 ,  H05K2201/0305 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K2203/013 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05655 ,  H01L2924/00014

Abstract: A three-dimensional interconnect system is disclosed. The interconnect system electrically connects electrical devices that are disposed on different physical planes. The interconnect system includes a plurality of contiguously interconnected electrically conductive droplets such as solder ball droplets produced by a print-on-demand solder jet system. An interconnect is formed by repeatedly ejecting the conductive droplets along a predetermined path between components to be connected. Each ejected droplet is disposed adjacent to another ejected droplet to form a contiguously linked chain of droplets that bridge a physical gap between the components. A non-conductive coating can be deposited on the interconnect to protect the interconnect from damage and to encase the interconnect. The electrical resistance of the interconnect can be reduced by reflowing the droplets that form the interconnect, whereby the coating that encses the interconnect is operative to maintain the shape of the interconnect after reflow.

Abstract translation: 公开了一种三维互连系统。 互连系统电连接设置在不同物理平面上的电气设备。 互连系统包括多个连续互连的导电液滴，例如由按需喷墨喷墨系统产生的焊球液滴。 通过沿要连接的部件之间的预定路径反复喷射导电液滴形成互连。 每个喷射的液滴被设置成与另一个喷射的液滴相邻以形成连接的液滴链，其桥接组件之间的物理间隙。 可以在互连上沉积非导电涂层，以保护互连免受损坏并包围互连。 可以通过回流形成互连的液滴来降低互连的电阻，由此包裹互连的涂层可操作以在回流之后保持互连的形状。

公开(公告)号：US06452114B1

公开(公告)日：2002-09-17

申请号：US09663339

申请日：2000-09-15

Applicant: Theodore A. Schweitzer ,  Norman S. Saah ,  Paul H. Bock, Jr. ,  Dmitry H. Levitan

Inventor： Theodore A. Schweitzer ,  Norman S. Saah ,  Paul H. Bock, Jr. ,  Dmitry H. Levitan

IPC: H01R1204

CPC classification number: H01R12/89 ,  H05K1/117 ,  H05K2201/0746 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/094

Abstract: A plug-in circuit board assembly requires reduced insertion force during connection to a plurality of shorting contacts in a socket or receptacle. The connector portion of the circuit board assembly has a pair of end sections with beveled insertion edges that extend substantially perpendicular to the insertion direction of the circuit board. A shallow V-shaped cut-out with non-beveled insertion edges is located between the end sections. Electrically conductive fingers are carried by the connector portion of the circuit board assembly and extend toward the insertion edges of the end sections and V-shaped cut-out. The electrically conductive fingers adjoining the V-shaped cut-out are positioned to make contact with shorting contacts in the socket or receptacle, while the electrically conductive fingers of the beveled end sections are positioned to make contact with conventional (non-shorting) contacts in the socket or receptacle. The angled insertion edges of the V-shaped cut-out cause the electrically conductive fingers adjoining the cut-out to make contact with the shorting contacts in a sequential or progressive manner when the circuit board assembly is inserted into the socket or receptacle, thereby reducing the insertion force that would otherwise be encountered due to the absence of a bevel on the insertion edges of the cut-out

Abstract translation: 插入式电路板组件在连接到插座或插座中的多个短路触头时需要减小的插入力。 电路板组件的连接器部分具有一对端部，其具有大致垂直于电路板的插入方向延伸的斜面插入边缘。 具有非斜面插入边缘的浅V形切口位于端部之间。 导电指状物由电路板组件的连接器部分承载并且朝向端部的插入边缘和V形切口延伸。 与V形切口相邻的导电指状物定位成与插座或插座中的短路触点接触，而斜切端部的导电指状物定位成与常规（非短路）触点接触 插座或插座。 当电路板组件插入到插座或插座中时，V形切口的成角度的插入边缘使得邻接切口的导电指状物以顺序或渐进的方式与短路触点接触，从而减少 由于在切口的插入边缘上不存在斜面而否则将会遇到的插入力

公开(公告)号：US06368540B1

公开(公告)日：2002-04-09

申请号：US09383862

申请日：1999-08-26

Applicant: Refugio C. Morales

Inventor： Refugio C. Morales

IPC: B29C5902

CPC classification number: B29C67/0044 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0195 ,  H05K2203/0228

Abstract: The present invention relates to a tool, and method of is use, that puts a pair of bevels onto an edge of a printed circuit board (PCB) so that the PCB can be inserted into an expansion slot of a computer. The tool has a bevel wheel, preferably with a bi-laterally symmetrical angle channel shape, that is connected to a carriage. The bevel wheel rolls along the carriage while the bevel wheel is pressed onto the edge of the PCB so as to form the pair of bevels on the edge of the PCB. No material is removed from the PCB while forming the pair of bevels. The bevel wheel is forced upon the edge using a piston that monitors and regulates the pressure applied to the edge of the PCB in order to achieve a preferred height and angular orientation of the pair of bevels.

Abstract translation: 本发明涉及一种使用的工具和方法，其将一对斜面放置在印刷电路板（PCB）的边缘上，使得PCB可以插入到计算机的扩展槽中。 该工具具有斜盘轮，优选地具有连接到托架的双向对称的角形通道形状。 斜齿轮沿滑架滚动，而斜齿轮被压在PCB的边缘上，以便在PCB的边缘上形成一对斜面。 在形成一对斜面时，没有从PCB上移除材料。 使用活塞来迫使斜齿轮在边缘上，所述活塞监测和调节施加到PCB的边缘的压力，以便实现该对斜面的优选高度和角度定向。

公开(公告)号：US06344616B1

公开(公告)日：2002-02-05

申请号：US09605713

申请日：2000-06-27

Applicant: Sakae Yokokawa

Inventor： Sakae Yokokawa

IPC: H01B700

CPC classification number: H05K1/189 ,  H01B7/00 ,  H05K3/007 ,  H05K3/403 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2201/0347 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/10356 ,  H05K2201/10446 ,  H05K2201/10674

Abstract: A cable for use in connection between integrated circuit elements each having terminals. The cable body has an insulator and a plurality of conductors buried in the insulator to have a matrix pattern in section. The cable body has longitudinal end faces as mounting surfaces which are for mounting the integrated circuit elements, respectively. On each of the mounting surfaces, a plurality of conductor pads are formed to connect with the conductors. The conductor pads are connected to the terminals of each of the integrated circuit elements, respectively.

Abstract translation: 用于连接各自具有端子的集成电路元件之间的电缆。 电缆主体具有绝缘体和埋入绝缘体中的多个导体以具有矩阵图案的截面。 电缆体具有分别用于安装集成电路元件的纵向端面作为安装表面。 在每个安装表面上，形成多个导体焊盘以与导体连接。 导体焊盘分别连接到每个集成电路元件的端子。