公开(公告)号：US20160227649A1

公开(公告)日：2016-08-04

申请号：US14614401

申请日：2015-02-04

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K3/366 ,  H05K1/117 ,  H05K2201/09063 ,  H05K2201/09172 ,  H05K2201/10295 ,  H05K2201/1034

Abstract: A circuit module for connecting to a circuit board is disclosed, the circuit module for connecting to a circuit board, wherein the circuit module comprises a substrate having a top surface, a bottom surface and a lateral surface connecting the top surface and bottom surface, wherein at least one electrical component is disposed on the top or bottom surface and a plurality of surface-mount pads are disposed on the lateral surface of the substrate for electrically connecting to corresponding pads on the circuit board.

Abstract translation: 公开了用于连接到电路板的电路模块，用于连接到电路板的电路模块，其中电路模块包括具有顶表面，底表面和连接顶表面和底表面的侧表面的基板，其中 至少一个电气部件设置在顶表面或底表面上，并且多个表面安装焊盘设置在基板的侧表面上，用于电连接到电路板上的相应焊盘。

公开(公告)号：US09357649B2

公开(公告)日：2016-05-31

申请号：US13466682

申请日：2012-05-08

Applicant: Sungjun Chun ,  Brian J. Connolly

Inventor： Sungjun Chun ,  Brian J. Connolly

IPC: G06F1/16 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/117 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/09172 ,  H05K2201/10159

Abstract: An embodiment is a memory card including a rectangular printed circuit card having a first side and a second side, a first length of between 151.35 and 161.5 millimeters, and first and second ends having a second length smaller than the first length. The memory card also includes a first plurality of pins on the first side extending along a first edge of the rectangular printed circuit card that extends along a length of the rectangular printed circuit card, a second plurality of pins on the second side extending on the first edge of the rectangular printed circuit card, and a positioning key having its center positioned on the first edge of the rectangular printed circuit card and located between 94.0 and 95.5 millimeters from the first end of the rectangular printed circuit card.

Abstract translation: 一个实施例是一种存储卡，其包括具有第一侧和第二侧的矩形印刷电路卡，第一长度在151.35和161.5毫米之间，第一和第二端的第二长度小于第一长度。 存储卡还包​​括沿着矩形印刷电路卡的沿着矩形印刷电路卡的长度延伸的第一边沿第一侧延伸的第一多个销，第二侧上延伸的第二多个销在第一侧上延伸 矩形印刷电路卡的边缘，以及定位键，其中心位于矩形印刷电路卡的第一边缘上，并且距离矩形印刷电路卡的第一端位于94.0和95.5毫米之间。

公开(公告)号：US09351400B1

公开(公告)日：2016-05-24

申请号：US14185818

申请日：2014-02-20

Applicant: Apple Inc.

Inventor： Kuo-Hua Sung ,  Silvio Grespan ,  Brian Shadle ,  Romain A. Teil ,  Michael B. Wittenberg

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/09 ,  H05K3/40

CPC classification number: H05K1/11 ,  H05K3/403 ,  H05K2201/09172 ,  H05K2203/1361 ,  H05K2203/1476

Abstract: Conductive contacts can be disposed on multiple substrates or on different surfaces of a single substrate. Conductive material is disposed over at least a portion of the two conductive contacts to electrically connect the contacts. The conductive material may be disposed over at least one surface between the conductive contacts. One or more conductive borders can be formed on a surface of a conductive layer. The conductive border or borders can improve signal transmission across the surface of the conductive layer.

Abstract translation: 导电触点可以设置在单个基板的多个基板或不同的表面上。 导电材料设置在两个导电触点的至少一部分上以电连接触点。 导电材料可以设置在导电触点之间的至少一个表面上。 可以在导电层的表面上形成一个或多个导电边界。 导电边界或边界可以改善穿过导电层表面的信号传输。

公开(公告)号：US09313891B2

公开(公告)日：2016-04-12

申请号：US13759504

申请日：2013-02-05

Applicant: Jin-San Jung ,  Joo-Han Lee ,  Hyun-Seok Choi

Inventor： Jin-San Jung ,  Joo-Han Lee ,  Hyun-Seok Choi

IPC: H05K1/14 ,  H05K3/02 ,  H05K3/22 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/141 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/02 ,  H05K3/22 ,  H05K2201/09154 ,  H05K2201/09172 ,  H05K2201/10159 ,  H05K2203/0228 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A printed circuit board (PCB) prevents damage to tabs of the PCB and pins of a slot by reducing insertion force when the PCB is inserted in the slot. The PCB includes a body portion including a first surface and a second surface and a metal interconnection layer formed on at least one of the first and second surfaces. The metal interconnecting layer includes tabs formed along a first edge of the body portion. An insertion force alleviation portion in which at least a portion of the body portion is removed is formed in the first edge to reduce the insertion force required to seat the PCB within the slot.

Abstract translation: 印刷电路板（PCB）通过减少PCB插入插槽中时的插入力，防止PCB和插针的插针损坏。 PCB包括主体部分，其包括形成在第一表面和第二表面中的至少一个上的第一表面和第二表面以及金属互连层。 金属互连层包括沿主体部分的第一边缘形成的突出部。 在第一边缘中形成其中去除主体部分的至少一部分的插入力减轻部分，以减小将PCB安置在槽内所需的插入力。

公开(公告)号：US09095069B2

公开(公告)日：2015-07-28

申请号：US13243538

申请日：2011-09-23

Applicant: Buddy A. Stefanoff ,  Dana D. Stefanoff

Inventor： Buddy A. Stefanoff ,  Dana D. Stefanoff

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H05K3/36

CPC classification number: H05K1/142 ,  H05K3/36 ,  H05K3/403 ,  H05K2201/09172 ,  H05K2201/10106 ,  H05K2201/1059 ,  Y10T29/4913

Abstract: A printed circuit board is disclosed. The board has a first end having a plurality of fingers in a cooperating relationship with a second end of a second adjacent circuit board. The board has a second end having a second plurality of fingers in a cooperating relationship with a first end of a first adjacent circuit board. The board has a first portion of an electrical trace on at least one of the first plurality of fingers positioned to allow an electrical connection to the second end of the second adjacent circuit board, and a second portion of the electrical trace on at least one of the second plurality of fingers positioned to allow an electrical connection to the first end of the first adjacent circuit board.

Abstract translation: 公开了印刷电路板。 板具有与第二相邻电路板的第二端处于协作关系的多个指状物的第一端。 板具有第二端，其具有与第一相邻电路板的第一端协调关系的第二多个指状物。 所述板在所述第一多个手指中的至少一个手指上具有第一部分电迹线，所述第一多个指状物中的至少一个被定位成允许电连接到所述第二相邻电路板的第二端，并且所述电迹线的第二部分至少之一 第二多个指状物被定位成允许电连接到第一相邻电路板的第一端。

公开(公告)号：US20150118872A1

公开(公告)日：2015-04-30

申请号：US14591637

申请日：2015-01-07

Applicant: IDEAL Industries, Inc.

Inventor： Benjamin David Swedberg

IPC: H01R12/51 ,  H01R12/73 ,  H01R12/52

CPC classification number: H01R12/515 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R4/4818 ,  H01R12/52 ,  H01R12/523 ,  H01R12/7005 ,  H01R12/732 ,  H01R13/64 ,  H05K1/117 ,  H05K1/142 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/09172 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2203/167

Abstract: A connector for electrically connecting a first printed circuit board (PCB) with a second PCB wherein, in one example, the connector includes a housing having a keyed feature adapted to mate with a correspondingly keyed feature provided to each of the first and second PCBs and at least one connecting terminal carried by the housing having at least partially exposed opposed ends each of which electrically engages a contact pad formed on an underside of the respective PCBs. The connecting terminal may be arranged to accept a conductor and to thereby electrically couple the conductor to the first and second PCBs.

Abstract translation: 一种用于将第一印刷电路板（PCB）与第二PCB电连接的连接器，其中在一个示例中，所述连接器包括壳体，所述壳体具有适于与提供给所述第一和第二PCB中的每一个的相应的键入特征配合的键合特征，以及 由壳体承载的至少一个连接端子具有至少部分暴露的相对端，每个端部电接合形成在各个PCB的下侧上的接触焊盘。 连接端子可以被布置成接受导体，从而将导体电耦合到第一和第二PCB。

公开(公告)号：US08952518B2

公开(公告)日：2015-02-10

申请号：US14006527

申请日：2012-07-20

Applicant: Mahiro Tsujino ,  Manabu Miyahara

Inventor： Mahiro Tsujino ,  Manabu Miyahara

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/057 ,  H01L23/10

CPC classification number: H01L24/42 ,  H01L23/057 ,  H01L23/10 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/171 ,  H05K3/3442 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09409 ,  H05K2201/09909 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device housing package includes a base body having, on its upper surface, a mounting region of a semiconductor device; a frame body having a frame-like portion disposed on the upper surface of the base body, surrounding the mounting region, and an opening penetrating through from an inner side of the frame-like portion to an outer side thereof; a flat plate-like insulating member disposed in the opening, extending from an interior of the frame body to an exterior thereof; wiring conductors disposed on an upper surface of the insulating member, extending from the interior of the frame body to the exterior thereof; and a metallic film disposed on a part of the upper surface of the insulating member, the metallic film lying outside the frame body surrounding the wiring conductors.

Abstract translation: 半导体器件壳体封装包括：基体，其上表面具有半导体器件的安装区域; 框架体，其具有设置在基体的上表面上的框状部分，围绕安装区域，以及从框状部分的内侧穿过其外侧的开口; 设置在所述开口中的平板状绝缘构件，从所述框体的内部延伸到其外部; 布线导体设置在绝缘构件的上表面上，从框体的内部延伸到其外部; 以及设置在所述绝缘构件的上表面的一部分上的金属膜，所述金属膜位于围绕所述布线导体的框架体的外侧。

公开(公告)号：US08628870B2

公开(公告)日：2014-01-14

申请号：US12643362

申请日：2009-12-21

Applicant: Bongyoung Kim ,  Jaeyoung Ha ,  Youngho Kim

Inventor： Bongyoung Kim ,  Jaeyoung Ha ,  Youngho Kim

IPC: H01M14/00 ,  H01M2/02 ,  H01M6/08

CPC classification number: H01M2/0404 ,  H01M2/22 ,  H01M10/0436 ,  H01M10/052 ,  H01M10/42 ,  H01M10/425 ,  H01M2200/106 ,  H05K1/117 ,  H05K3/328 ,  H05K3/3405 ,  H05K2201/09172 ,  H05K2201/1034

Abstract: Disclosed is a secondary battery comprising: a bare cell; a protection circuit module having a board having a first hole formed by opening a portion of a first short edge thereof and located on the bare cell; and a first lead plate located between the bare cell and the protection circuit module to support portions of the board located on opposite sides of the first hole about the first hole thereby.

Abstract translation: 公开了一种二次电池，包括：裸电池; 保护电路模块，具有板，其具有通过打开其第一短边缘的一部分并位于裸电池上而形成的第一孔; 以及位于裸电池和保护电路模块之间的第一引线板，用于支撑位于第一孔的相对侧上的板的围绕第一孔的部分。

公开(公告)号：US20130157480A1

公开(公告)日：2013-06-20

申请号：US13713987

申请日：2012-12-13

Applicant: IDEAL INDUSTRIES, INC.

Inventor： Benjamin David Swedberg

IPC: H01R12/52

CPC classification number: H01R12/515 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R4/4818 ,  H01R12/52 ,  H01R12/523 ,  H01R12/7005 ,  H01R12/732 ,  H01R13/64 ,  H05K1/117 ,  H05K1/142 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/09172 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2203/167

Abstract: A connector for electrically connecting a first printed circuit board (PCB) with a second PCB wherein, in one example, the connector includes a housing having a keyed feature adapted to mate with a correspondingly keyed feature provided to each of the first and second PCBs and at least one connecting terminal carried by the housing having at least partially exposed opposed ends each of which electrically engages a contact pad formed on an underside of the respective PCBs. The connecting terminal may be arranged to accept a conductor and to thereby electrically couple the conductor to the first and second PCBs.

公开(公告)号：US20120326943A1

公开(公告)日：2012-12-27

申请号：US13489568

申请日：2012-06-06

Applicant: Javier Ruben Flores-Cuadras ,  Jose Eleazar Zuniga-Juarez

Inventor： Javier Ruben Flores-Cuadras ,  Jose Eleazar Zuniga-Juarez

IPC: H01Q1/38 ,  H01Q21/00

CPC classification number: H01Q9/42 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q9/0421 ,  H05K1/117 ,  H05K1/14 ,  H05K1/165 ,  H05K2201/09172

Abstract: Described herein are antenna designs and configurations that provide flexible solutions for creating compact antennas with multiple-band capabilities. For example, a hybrid PIFA-monopole antenna configuration and design is described. As another example, non-planar (e.g., orthogonal) and composite radiating structures incorporating various radiating element and ground plane configurations are described. Connective structures are also described for providing physical rigidity and ground plane connectivity to composite radiation elements. In embodiments described herein of composite radiating structures, multiple antennas may be included through passive radiating elements potentially combined with active circuitry. Composite radiating structures with multiple antennas may be used in multiple-in and multiple-out (MIMO) antenna applications. For example, multiple different antennas within the composite radiating structures may be created using radiating elements on one or more of the vertical and/or horizontal portions of the composite radiating structure.

Abstract translation: 这里描述的是提供用于创建具有多频带能力的紧凑天线的灵活解决方案的天线设计和配置。 例如，描述了混合PIFA单极天线配置和设计。 作为另一示例，描述了包括各种辐射元件和接地平面配置的非平面（例如，正交）和复合辐射结构。 还描述了连接结构，用于提供与复合辐射元件的物理刚性和接地平面连接。 在这里描述的复合辐射结构的实施例中，可以通过潜在地与有源电路组合的无源辐射元件来包括多个天线。 具有多个天线的复合辐射结构可用于多输入多输出（MIMO）天线应用。 例如，可以使用复合辐射结构的一个或多个垂直和/或水平部分上的辐射元件来创建复合辐射结构内的多个不同的天线。