公开(公告)号：US20100230147A1

公开(公告)日：2010-09-16

申请号：US12438570

申请日：2007-08-10

Applicant: Manabu Gokan ,  Akihisa Nakahashi ,  Takayuki Hirose ,  Yoko Kasai ,  Kohichi Tanda

Inventor： Manabu Gokan ,  Akihisa Nakahashi ,  Takayuki Hirose ,  Yoko Kasai ,  Kohichi Tanda

IPC: H05K1/00 ,  H05K1/14

CPC classification number: H05K1/144 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/023 ,  H05K1/145 ,  H05K3/323 ,  H05K3/361 ,  H05K3/403 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/09181 ,  H05K2201/10234 ,  H05K2201/10287 ,  Y10T29/49117 ,  H01L2224/0401

Abstract: Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate (101) and a second circuit substrate (102) which are arranged in parallel such that their substrate surfaces are opposed to each other. The peripheral portion of the first circuit substrate (101) and the peripheral portion of the second circuit substrate (102) are connected to each other by connection members (10a to 10d) having a wiring member (103) and a thermal hardening anisotropic conductive sheet (107), thereby performing electric connection.

Abstract translation: 提供一种能够实现高密度/高功能安装，容易地检查和修复各个组成元件以及改善电子连接特性的分层电子电路装置。 分层电子电路器件包括平行布置以使得它们的衬底表面彼此相对的第一电路衬底（101）和第二电路衬底（102）。 第一电路基板（101）的周边部分和第二电路基板（102）的周边部分通过具有布线部件（103）和热硬化各向异性导电片的连接部件（10a〜10d）彼此连接 （107），从而进行电连接。

公开(公告)号：US20100123144A1

公开(公告)日：2010-05-20

申请号：US12621529

申请日：2009-11-19

Applicant: Tzu-Hao Chao

Inventor： Tzu-Hao Chao

IPC: H01L33/00 ,  H01L23/52

CPC classification number: H05K1/181 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09254 ,  H05K2201/09409 ,  H05K2201/10106 ,  Y02P70/611 ,  H01L2924/00

Abstract: A circuit structure of a package carrier including a plurality of chip pads, a first electrode, a second electrode, a third electrode and a fourth electrode is provided. These chip pads are arranged in an M×N array. A first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad are disposed clockwise in the peripheral area of each chip pad in sequence. The orientations of each of the first, second, third, and fourth bonding pads of the (S−1)th row rotated by 90 degrees are equal to the orientations of each of the first, second, third and fourth bonding pads of the Sth row, respectively. The first electrode is connected with each first bonding pad. The second electrode is connected with each second bonding pad. The third electrode is connected with each third bonding pad. The forth electrode is connected with each forth bonding pad.

Abstract translation: 提供了包括多个芯片焊盘，第一电极，第二电极，第三电极和第四电极的封装载体的电路结构。 这些芯片焊盘以M×N阵列排列。 第一接合焊盘，第二接合焊盘，第三接合焊盘和第四接合焊盘顺序地设置在每个芯片焊盘的外围区域中。 第（S-1）行的第一，第二，第三，第四和第四接合焊盘的旋转90度的取向与Sth的第一，第二，第三和第四接合焊盘的取向相等 行。 第一电极与每个第一接合焊盘连接。 第二电极与每个第二接合焊盘连接。 第三电极与每个第三接合焊盘连接。 第四电极与每个第四接合焊盘连接。

公开(公告)号：US07718927B2

公开(公告)日：2010-05-18

申请号：US11375797

申请日：2006-03-14

Applicant: Harold B. Kent ,  James J. Levante ,  Aaron T. Fine ,  Joseph R. Layton

Inventor： Harold B. Kent ,  James J. Levante ,  Aaron T. Fine ,  Joseph R. Layton

IPC: B23K1/00 ,  B23K3/00 ,  B23K3/06 ,  B23K3/08

CPC classification number: H05K3/3494 ,  H01L23/13 ,  H01L24/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19043 ,  H01R43/0256 ,  H05K1/116 ,  H05K1/184 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2203/0195 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/2075 ,  H01L2924/00014 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00015

Abstract: A micro solder pot includes a dielectric substrate having at least one hole formed therein, a conductive coating coupled to the interior of the hole, and at least one heat transfer pad spaced from the hole in thermal communication with the conductive coating of the hole. When the heat transfer pad is exposed to a heat source, the conductive coating inside the hole is heated. The micro solder pot may also include a thermally activated conductive material disposed within the hole. When the heat transfer pad is exposed to a heat source, the thermally activated conductive material becomes liquidus such that a component can be inserted into the liquidus material. When the heat source is removed, the thermally activated conductive material cools to couple the component to the conductive coating in the hole.

Abstract translation: 微焊料罐包括具有形成在其中的至少一个孔的电介质衬底，耦合到孔的内部的导电涂层以及与所述孔间隔开的与所述孔的导电涂层热连通的至少一个传热垫。 当传热垫暴露于热源时，孔内的导电涂层被加热。 微焊料罐还可以包括设置在孔内的热活化导电材料。 当传热垫暴露于热源时，热活化的导电材料变成液相线，使得部件可以插入液相线材料中。 当热源被去除时，热活化的导电材料冷却以将部件耦合到孔中的导电涂层。

公开(公告)号：US07690930B2

公开(公告)日：2010-04-06

申请号：US12253623

申请日：2008-10-17

Applicant: Hubert Chen ,  Ascanio Orlandini

Inventor： Hubert Chen ,  Ascanio Orlandini

IPC: H01R12/00

CPC classification number: H01R9/038 ,  H01R12/62 ,  H01R43/0256 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2203/0455

Abstract: A direct galvanic connection between a cable, having a preferred flat cross-section, and an electronic Printed Circuit Board (“Target PCB”) (228) by means of an intermediate PCB (“Interconnection PCB”) (200) allowing an impedance matched and length balanced electrical connection is described, thus offering ideal conditions for high speed and high frequency data connections. At the same time, the connection allows to keep the flexibility of a modular production and assembly workflow, typical of the use of well known connectors.

Abstract translation: 具有优选平坦横截面的电缆与电子印刷电路板（“目标PCB”）（228）之间的直接电连接通过中间PCB（“互连PCB”）（200）允许阻抗匹配 并描述了长度平衡的电气连接，从而为高速和高频数据连接提供了理想的条件。 同时，连接允许保持模块化生产和组装工作流程的灵活性，这通常是使用众所周知的连接器。

公开(公告)号：US20100012357A1

公开(公告)日：2010-01-21

申请号：US12548933

申请日：2009-08-27

Applicant: Alan E. Wang ,  Kevin C. Olson

Inventor： Alan E. Wang ,  Kevin C. Olson

IPC: H05K1/03 ,  H05K1/11

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US07646255B2

公开(公告)日：2010-01-12

申请号：US11985132

申请日：2007-11-14

Applicant: Robert A. Jacobson ,  Elisio C. Das Neves ,  Glen Reeser ,  Thomas A. Knecht

Inventor： Robert A. Jacobson ,  Elisio C. Das Neves ,  Glen Reeser ,  Thomas A. Knecht

IPC: H03B5/12

CPC classification number: H03B5/1847 ,  H03B2200/0008 ,  H03B2200/0034 ,  H03B2200/004 ,  H05K1/0243 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10734

Abstract: A voltage controlled oscillator (VCO) assembly and module incorporating a ball grid array resonator as part of the tank circuit of the voltage controlled oscillator. The VCO module preferably incorporates at least an oscillator circuit, the tank circuit, and an output buffer stage circuit all defined by a plurality of interconnected electrical/electronic components including the ball grid array resonator which are mounted to a printed circuit board. In another embodiment, the oscillator assembly also includes a phase-locked loop circuit defined at least in part by an integrated circuit mounted to the printed circuit board.

Abstract translation: 压控振荡器（VCO）组件和模块结合有球栅阵列谐振器作为压控振荡器的电路的一部分。 VCO模块优选地至少包括振荡器电路，振荡电路和输出缓冲级电路，其全部由包括安装到印刷电路板的球栅阵列谐振器的多个互连的电气/电子部件限定。 在另一个实施例中，振荡器组件还包括至少部分地由安装到印刷电路板的集成电路限定的锁相环电路。

公开(公告)号：US20090273939A1

公开(公告)日：2009-11-05

申请号：US12435090

申请日：2009-05-04

Applicant: Klaus Oesterheld ,  Kenneth Jenkins

Inventor： Klaus Oesterheld ,  Kenneth Jenkins

IPC: F21V15/00 ,  H05K7/02

CPC classification number: F21K9/20 ,  F21W2111/00 ,  H05K1/141 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10106

Abstract: The present invention is directed to a surface mount circuit board indicator. In one embodiment the surface mount circuit board indicator includes a printed circuit board (PCB) having at least one light emitting diode (LED) die, one or more traces and at least one lens, a housing comprising at least one opening on a side along a perimeter of the housing, wherein the PCB is coupled to the housing such that a light output surface of the at least one LED die faces a same direction as the at least one opening and at least one alignment pin coupled to the housing.

Abstract translation: 本发明涉及一种表面贴装电路板指示器。 在一个实施例中，表面安装电路板指示器包括具有至少一个发光二极管（LED）裸片，一个或多个迹线和至少一个透镜的印刷电路板（PCB），壳体包括沿着一侧的至少一个开口 壳体的周边，其中PCB耦合到壳体，使得至少一个LED管芯的光输出表面面向与至少一个开口相同的方向，以及耦合到壳体的至少一个对准销。

公开(公告)号：US07612298B2

公开(公告)日：2009-11-03

申请号：US11614985

申请日：2006-12-22

Applicant: Sheng-Chieh Lung ,  Mau-Yuan Hung

Inventor： Sheng-Chieh Lung ,  Mau-Yuan Hung

IPC: H01B17/16

CPC classification number: H01R33/0836 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10113

Abstract: A connecting unit for accommodating a wick of a cold cathode fluorescent lamp is disclosed. The connecting unit includes a substrate having a conductive layer disposed thereon, a v-shaped opening, and a c-shaped opening. The width of the front end of the v-shaped opening is greater than the diameter of the wick, and the width of the back end of the v-shaped opening is less than the diameter of the c-shaped opening and less than the diameter of the wick. The conductive layer is disposed on a surface of the c-shaped opening and the v-shaped opening.

Abstract translation: 公开了一种用于容纳冷阴极荧光灯灯芯的连接单元。 连接单元包括其上设置有导电层的基板，v形开口和c形开口。 v形开口的前端的宽度大于芯的直径，v形开口的后端的宽度小于c形开口的直径，小于直径 的灯芯 导电层设置在c形开口和v形开口的表面上。

公开(公告)号：US07556543B2

公开(公告)日：2009-07-07

申请号：US11926657

申请日：2007-10-29

Applicant: Ronald Martin Weber

Inventor： Ronald Martin Weber

IPC: H01R11/22

CPC classification number: H01R4/2454 ,  H01R4/4809 ,  H01R12/53 ,  H01R12/721 ,  H05K3/325 ,  H05K2201/09181 ,  H05K2201/10287 ,  H05K2201/10386 ,  H05K2201/1059 ,  H05K2201/10962

Abstract: A system and method for terminating a wire to an electrical device, such as a printed circuit board, is disclosed. The system includes a terminal having slots configured to receive, secure and form an electrical connection with the wire. The terminal also has compliant electrical contact fingers that form a physical and electrical connection with the electrical device, thereby electrically connecting and physically securing the wire to the device. The compliant fingers exert a normal force on the electrical device to secure the terminal and wire to the electrical device.

Abstract translation: 公开了一种用于将线材端接到例如印刷电路板的电气设备的系统和方法。 该系统包括具有被配置为接收，固定和形成与电线的电连接的槽的端子。 该终端还具有与电气设备形成物理和电气连接的顺应性电接触指，从而将电线电连接并物理地固定到设备上。 柔性手指在电气装置上施加法向力以将端子和线固定到电气装置。

公开(公告)号：US20090160580A1

公开(公告)日：2009-06-25

申请号：US12170071

申请日：2008-07-09

Applicant: Yu-Chen HSIEH ,  Chih-Tse Chen ,  Yi-Bin Lee

Inventor： Yu-Chen HSIEH ,  Chih-Tse Chen ,  Yi-Bin Lee

IPC: H03H7/00 ,  H01F27/02 ,  H01F27/06

CPC classification number: H01F41/10 ,  H01F17/062 ,  H01F27/027 ,  H01F27/29 ,  H03H2001/0092 ,  H05K1/18 ,  H05K3/403 ,  H05K2201/09145 ,  H05K2201/09181 ,  H05K2201/1003 ,  H05K2201/10287 ,  H05K2201/10446

Abstract: A filter includes a coil leading structure and at least one coil. The coil leading structure includes a board and at least one pin. The pin is disposed at a side of the board and formed integrally with the board as a monolithic piece. The core is disposed on the board and has at least one end to be coupled with the pin.

Abstract translation: 滤波器包括线圈引导结构和至少一个线圈。 线圈引导结构包括板和至少一个引脚。 销设置在板的一侧，并与板一体地形成为一块整体。 芯部设置在板上，并且至少一端与销连接。