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    Maximizing surface area of surface mount contact pads of circuit board also having via contact pads
    43.
    发明授权
    Maximizing surface area of surface mount contact pads of circuit board also having via contact pads 有权
    最大限度地提高电路板表面贴装接触焊盘的表面积，并具有通孔接触垫

    公开(公告)号：US09510448B2

    公开(公告)日：2016-11-29

    申请号：US14473509

    申请日：2014-08-29

    Applicant: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.

    Inventor： Eric R. Ao ,  Stephen J. Flint ,  Michael W. J. Hogan ,  Shannon D. McGale ,  Rodolfo B. Salinas

    IPC: H05K7/00 ,  H05K1/16 ,  H05K1/11 ,  H05K7/10 ,  H01K3/10 ,  H05K1/18 ,  H05K3/34

    CPC classification number: H05K1/113 ,  H05K1/111 ,  H05K1/116 ,  H05K1/181 ,  H05K3/3415 ,  H05K2201/0939 ,  H05K2201/09609 ,  Y02P70/611

    Abstract: A circuit board has a first side and a second side opposite thereto. The board includes vias extending through the substrate from the first side to the second side, and via contact pads on the second side, each of which surrounds a corresponding via. The board includes a pair of surface mount contact pads on the second side. Each surface mount contact pad has a surface area and edges, each of which can have a shape to maximize the surface area while maintaining predetermined minimum separation distances. Each edge except one or more edges that are opposite another surface mount contact pad have a curved shape, and each edge opposite another surface mount contact pad have a linear shape. Curved edges adjacently opposite corresponding via contact pads can have curved shapes can have concave shapes, and curved edges not adjacently opposite via contact pads can have convex shapes.

    Abstract translation: 电路板具有与其相对的第一侧和第二侧。 该板包括从第一侧延伸穿过基板的通孔到第二侧，以及通过第二侧上的接触焊盘，其中每一个围绕相应的通孔。 该板包括一对表面贴装接触垫在第二面。 每个表面安装接触垫具有表面积和边缘，每个表面区域和边缘可以具有使表面积最大化的形状，同时保持预定的最小间隔距离。 除了与另一表面安装接触垫相对的一个或多个边缘之外的每个边缘具有弯曲形状，并且与另一表面安装接触垫相对的每个边缘具有线性形状。 通过接触焊盘相对相对相对的弯曲边缘可以具有弯曲形状可以具有凹形形状，并且通过接触垫不相邻相对的弯曲边缘可以具有凸形形状。

    ATTENUATION REDUCTION STRUCTURE FOR HIGH FREQUENCY SIGNAL CONNECTION PADS OF CIRCUIT BOARD WITH INSERTION COMPONENT
    44.
    发明申请
    ATTENUATION REDUCTION STRUCTURE FOR HIGH FREQUENCY SIGNAL CONNECTION PADS OF CIRCUIT BOARD WITH INSERTION COMPONENT 有权
    具有插入元件的电路板高频信号连接板的衰减减少结构

    公开(公告)号：US20150270593A1

    公开(公告)日：2015-09-24

    申请号：US14637898

    申请日：2015-03-04

    Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

    Inventor： CHIH-HENG CHUO ,  GWUN-JIN LIN ,  KUO-FU SU

    IPC: H01P1/22 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H01P1/227 ,  H03H7/38 ,  H05K1/0225 ,  H05K1/0251 ,  H05K1/116 ,  H05K1/189 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09718 ,  H05K2201/10931

    Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.

    Abstract translation: 公开了一种具有插入部件的电路板的高频连接焊盘的衰减减小结构。 电路板包括形成在其上的至少一对差模信号线。 衬底具有分别设置有至少一对上连接焊盘和下连接焊盘的上表面和下表面。 第一金属层形成在基板的下表面上。 第一金属层包括衰减减小接地图案结构。 衰减降低接地图案结构包括中空区域和至少一个突出部分。 突出部分沿着朝向下连接焊盘的方向从第一金属层延伸。

    WIRING BOARD AND ELECTRONIC DEVICE
    46.
    发明申请
    WIRING BOARD AND ELECTRONIC DEVICE 有权
    接线板和电子设备

    公开(公告)号：US20150146397A1

    公开(公告)日：2015-05-28

    申请号：US14404938

    申请日：2013-05-30

    Applicant: KYOCERA Corporation

    Inventor： Yukio Fujihara ,  Kenjirou Fukuda

    IPC: H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/111 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/181 ,  H05K1/02 ,  H05K1/112 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/0939 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: There is provided a wiring board capable of strengthening the bonding between an external terminal and a wiring of an external circuit board. A wiring board includes an insulating substrate having two main surfaces facing each other, side surfaces connecting to the two main surfaces and concave portions concave from the side surfaces and connecting to at least one of the two main surfaces; and external terminals disposed from one of the main surfaces to inner surfaces of the respective concave portions, each of the external terminals having a convex-shaped section disposed on one main surface side along each of the concave portions.

    Abstract translation: 提供了能够加强外部端子与外部电路板的布线之间的接合的布线板。 布线基板包括具有彼此面对的两个主表面的绝缘基板，连接到两个主表面的侧表面和从侧表面凹入并连接到两个主表面中的至少一个的凹部; 以及外部端子，其从一个主表面设置到各个凹部的内表面，每个外部端子具有沿着每个凹部设置在一个主表面侧上的凸形部分。

    WIRING PATTERN FORMING METHOD, DEVICE AND ELECTRONIC APPARATUS
    49.
    发明申请
    WIRING PATTERN FORMING METHOD, DEVICE AND ELECTRONIC APPARATUS 审中-公开
    布线图案形成方法，装置和电子装置

    公开(公告)号：US20080121412A1

    公开(公告)日：2008-05-29

    申请号：US11946098

    申请日：2007-11-28

    Applicant: Jun YAMADA ,  Junichiro SHINOZAKI

    Inventor： Jun YAMADA ,  Junichiro SHINOZAKI

    IPC: H05K1/00 ,  B05D5/12

    CPC classification number: H05K3/125 ,  H05K2201/09272 ,  H05K2201/0939 ,  H05K2203/013

    Abstract: A wiring pattern forming method comprises: relatively moving a droplet discharging head and a substrate, each in a predetermined direction; discharging a liquid material in a form of droplet onto the substrate from a plurality of discharging nozzles formed on the droplet discharging head; forming a predetermined wiring pattern on the substrate; and forming an end portion of a wiring pattern in a tapered shape, or a bent portion of a wiring pattern in a curved shape.

    Abstract translation: 一种布线图案形成方法，包括：在预定方向上相对移动液滴喷射头和基底; 从形成在液滴喷射头上的多个排出喷嘴将液滴形式的液体材料排放到基板上; 在所述基板上形成预定的布线图案; 并且形成呈锥形的布线图案的端部或弯曲形状的布线图案的弯曲部分。

    Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch
    50.
    发明授权
    Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch 失效
    具有布置在彼此内部和外部的具有减小的端子间距的平台阵列的印刷电路板

    公开(公告)号：US06218630B1

    公开(公告)日：2001-04-17

    申请号：US09107478

    申请日：1998-06-30

    Applicant: Kotaro Takigami

    Inventor： Kotaro Takigami

    IPC: H01R1204

    CPC classification number: H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09227 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611

    Abstract: A printed circuit board includes a plurality of lands thereon. The size D2 of the outer land 3 in the direction along the outside array is less than the size D1 of the inner land 1 in the direction along the inside array. Therefore, it is possible to pass the pattern 4 with enough clearance against the outer land 3. The outer lands 3 are formed with an oval, elliptical or oblong shape. Namely, the size D3 of the outer land 3 in the direction perpendicular to the direction of the outside array is greater than the size D2. Then, it is possible to ensure a sufficient reliability of a soldered part. Preferably, the connected area 5 between the inner land 1 and the pattern 4 and the connected area 7 between the outer land 3 and the pattern 6 are formed as a shape of a tear-drop. Then, the patterns 4, 6 cannot be easily cut by a thermal stock or a heat cycle. The solder resist 8 is coated, around the outer land 3, from an outer area to an inner area of the outer land 3, except for the central area 3A. The resist 8 is further coated, around the inner land 1, from an outer area to an inner area of the inner land 1, except for the central area 1A. Then, each area 5, 7 is reinforced by the resist 8. Further, since a clearance between exposed areas 1A and a clearance between exposed areas 3A are widened, a bridge of solder does not easily occur.

    Abstract translation: 印刷电路板包括多个焊盘。 沿着外部阵列的方向的外部焊盘3的尺寸D2小于沿着内部阵列的方向的内部焊盘1的尺寸D1。 因此，可以使图案4以足够的间隙通过外缘3。外缘3形成为椭圆形，椭圆形或椭圆形。 也就是说，在与外部阵列的方向垂直的方向上的外部焊盘3的尺寸D3大于尺寸D2。 然后，可以确保焊接部件的足够的可靠性。 优选地，内部平台1和图案4之间的连接区域5和外部凸台3与图案6之间的连接区域7形成为泪滴形状。 然后，图案4,6不能容易地被热料或热循环切断。 除了中心区域3A之外，阻焊剂8围绕外部焊盘3从外部区域外围区域涂覆到外部区域3的内部区域。 除了中心区域1A之外，抗蚀剂8从内部区域1的外部区域到内部区域1的内部区域进一步被涂覆在内部区域1周围。 然后，每个区域5,7由抗蚀剂8加强。此外，由于暴露区域1A之间的间隙和暴露区域3A之间的间隙变宽，所以焊接桥不容易发生。

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