Abstract:
The present invention provides an optically transparent electrode being resistant to corrosion regardless of the shape of the pattern and enabling uniform electroless plating thereon regardless of the shape of the pattern. The optically transparent electrode has, on a support, an optically transparent electrode unit and a peripheral wire unit formed of at least one peripheral wire, of which one end is electrically connected with the optically transparent electrode unit and the other end is connected with the outside, and the optically transparent electrode unit and the peripheral wire unit are formed of the same metal. The line width of at least one metal wire forming the peripheral wire unit is not uniform, and when the at least one metal wire is divided into a thinnest metal wire segment A and the other metal wire segment B electrically connected with the metal wire segment A, the line width of the metal wire segment A is 1.2 to 20 times the line width of the metal wires forming the optically transparent electrode unit, the line width of the metal wire segment B is 1.5 to 3 times the line width of the metal wire segment A, and the number of peripheral wires where the total length of the metal wire segment A of a single peripheral wire is 0.01 to 40 times the total length of the metal wire segment B of the same wire accounts for 40% or more of the total number of wires in the peripheral wire unit.
Abstract:
In some embodiments, same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning (SAP) is presented. In this regard, a method is introduced including patterning a first density region of a laminated substrate surface using LPP, patterning a second density region of the laminated substrate surface using SAP, and plating the first and second density regions of the laminated substrate surface, wherein features spanning the first and second density regions are directly coupled. Other embodiments are also disclosed and claimed.
Abstract:
To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate (10); a first signal line (L31A) that constitutes differential signal lines formed on the insulating substrate (10) and includes a curved portion; a second signal line (L31B) provided along the first signal line (L31A) and side by side inside the curved portion; and a ground layer (30) formed for the first signal line (L31A) and the second signal line (L31B) via an insulating material (10). The ground layer (30) includes a first ground layer (G31A) corresponding to a first region (D1) and a second ground layer (G31B) corresponding to a second region (D2). The first region (D1) is defined based on the first signal line (L31A) and has a first predetermined width (W31A). The second region (D2) is defined based on the second signal line (L31B) and has a second predetermined width (W31B). The first ground layer (G31A) has a remaining ratio lower than a remaining ratio of the second ground layer (G31B).
Abstract:
Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ∈1 and has a first principal surface and a second principal surface. A signal line is provided in the dielectric element assembly. A ground conductor is provided in the dielectric element assembly and on the first principal surface side with respect to the signal line, faces the signal line, and is provided with an opening that overlaps the signal line. A high dielectric constant layer has a relative dielectric constant ∈2 higher than the relative dielectric constant ∈1 and is provided on the first principal surface so as to overlap the opening.
Abstract:
A circuit board comprises a signal routing layer, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first ground layer, a second ground layer, and a third ground layer. The signal routing layer includes chip traces, connector traces, and signal traces connected to components. The first dielectric layer, the first ground layer, the second dielectric layer, the second ground layer, the third dielectric layer, and the third ground layer, in that order, are located at gradually increasing distances from the signal routing layer. The first ground layer corresponds to the chip traces, the second ground layer corresponds to the signal traces, and the third ground layer corresponds to the connector traces.
Abstract:
A tape package includes a base substrate including a signal transmitting area and a protruding area protruded from the signal transmitting area, an integrated circuit chip mounted on the base substrate, and a lead line disposed on the base substrate and including a first portion electrically connected with the integrated circuit chip, a second portion electrically connected with the first portion and extending in a first direction, and a third portion electrically connected with the second portion and extending in a second direction crossing the first direction.
Abstract:
In some embodiments, same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning (SAP) is presented. In this regard, a method is introduced including patterning a first density region of a laminated substrate surface using LPP, patterning a second density region of the laminated substrate surface using SAP, and plating the first and second density regions of the laminated substrate surface, wherein features spanning the first and second density regions are directly coupled. Other embodiments are also disclosed and claimed.
Abstract:
A touch window includes a substrate, a sensing electrode on the substrate, a wire electrically connected with the sensing electrode, a ground wire adjacent to the wire, and a printed circuit board connected with the wire and the ground wire. An overlap length between the ground wire and the printed circuit board is longer than an overlap length between the wire and the printed circuit board. Alternatively or simultaneously, a line width of the ground wire is wider than an interval or gap between the wire parallel to the printed circuit.
Abstract:
A tunable filter design. The filter is implemented using transmission line sections as inductive and capacitive components. At least one capacitive component is a tunable capacitor. In some implementations, the tunable capacitor may be an interdigitated array of finger elements arranged so that the spacing between fingers may be adjusted. The design has a number of advantages including high capacitance for a given circuit area, small area for a given desired capacitance, mechanical stability, high self resonance frequency, and high quality factor.
Abstract:
A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged thereon in pairs. The contact pads of each pair are spaced apart from each other to provide a pair of points to which cable wire free ends may be terminated, such as by soldering. The spacing of the pads apart from each other in effect reduces to amount of capacitance in the cable wire termination area on the circuit board, thereby reducing the impedance and insertion loss in that area at high frequencies. The contact pads of each pair may be further interconnected together by a thin, conductive trace that extends lengthwise between the contact pads.