公开(公告)号：US07280364B2

公开(公告)日：2007-10-09

申请号：US10996722

申请日：2004-11-24

Applicant: Shaun L. Harris ,  Steven A. Belson ,  Eric C. Peterson ,  Gary W. Williams ,  Christian L. Belady ,  Jeffrey P. Christenson

Inventor： Shaun L. Harris ,  Steven A. Belson ,  Eric C. Peterson ,  Gary W. Williams ,  Christian L. Belady ,  Jeffrey P. Christenson

IPC: H05K7/20

CPC classification number: H05K1/141 ,  G06F1/184 ,  G06F1/185 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0263 ,  H05K2201/10189 ,  H05K2201/1056 ,  H01L2924/00

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.

Abstract translation: 一个实施例包括具有耦合到第二PCB的第一印刷电路板（PCB）的电子组件。 第二PCB具有至少两个处理器并且设置在第一PCB上方。 散热装置设置在第二PCB的上方，从两个处理器散热，并提供一个气流路径。 电力系统与散热装置相邻并且在气流路径的路径中。

公开(公告)号：US20070218721A1

公开(公告)日：2007-09-20

申请号：US11547965

申请日：2005-01-12

Applicant: Masanori Naritomi

Inventor： Masanori Naritomi

IPC: H01R13/44

CPC classification number: H05K5/062 ,  H01R9/2466 ,  H01R13/6658 ,  H01R43/24 ,  H02G3/088 ,  H05K3/284 ,  H05K5/0047 ,  H05K2201/1034 ,  H05K2201/1056 ,  H05K2203/1147 ,  H05K2203/1311

Abstract: The present invention provides electrical equipment for junction improved in sealing performance and reduced in size and weight, and also provides a method of manufacturing the same. A face cover 6 and a back cover 7 are press-formed from an aluminum alloy. An electrical component 2 including a board 3, electronic parts 4 and terminals 5 is tightly held between the face cover 6 and the back cover 7. The peripheral edge A of the face cover 6 and the back cover 7 is hermetically sealed with a resin mold 10 formed by injection molding. The resin mold 10 has connector portions 10b in which the terminals 5 project out nakedly to allow connection with external electrical equipment.

Abstract translation: 本发明提供了一种改善密封性能并减小了尺寸和重量的接头的电气设备，并且还提供了一种制造该方法的方法。 面盖6和后盖7由铝合金压制成型。 包括板3，电子部件4和端子5的电气部件2被紧密地保持在面罩6和后盖7之间。 面盖6的周缘A和后盖7通过注射成型形成的树脂模具10气密密封。 树脂模具10具有连接器部分10b，其中端子5裸露地突出以允许与外部电气设备的连接。

公开(公告)号：US20070126125A1

公开(公告)日：2007-06-07

申请号：US11668425

申请日：2007-01-29

Applicant: Russell Rapport ,  Paul Goodwin ,  James Cady

Inventor： Russell Rapport ,  Paul Goodwin ,  James Cady

IPC: H01L23/52

CPC classification number: H05K1/117 ,  G11C5/04 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/4691 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.

公开(公告)号：US20070126124A1

公开(公告)日：2007-06-07

申请号：US11668416

申请日：2007-01-29

Applicant: Russell Rapport ,  Paul Goodwin ,  James Cady

Inventor： Russell Rapport ,  Paul Goodwin ,  James Cady

IPC: H01L23/52

CPC classification number: H05K1/117 ,  G11C5/04 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/4691 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.

Abstract translation: 提供了一种电路模块，其中两个辅助基板或卡或刚性柔性组件的刚性部分填充有集成电路（IC）。 辅助基板与柔性电路连接。 柔性电路的一侧具有适于连接到边缘连接器的触点。 柔性电路围绕优选金属衬底的边缘缠绕，以将两个次要衬底中的一个设置在衬底的第一侧上，并且在衬底的第二侧上设置另一个辅助衬底。

公开(公告)号：US20070086189A1

公开(公告)日：2007-04-19

申请号：US11538790

申请日：2006-10-04

Applicant: Robert Raos ,  Nilesh Desai ,  Steven Flank

Inventor： Robert Raos ,  Nilesh Desai ,  Steven Flank

IPC: F21V21/00 ,  F21V29/00 ,  H01L29/00

CPC classification number: G09F9/33 ,  G09F13/20 ,  H05K1/0209 ,  H05K3/28 ,  H05K2201/064 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/1056 ,  H05K2203/081 ,  H05K2203/1178

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

公开(公告)号：US20070081323A1

公开(公告)日：2007-04-12

申请号：US11549004

申请日：2006-10-12

Applicant: Hyeong Won YUN ,  Hyun Ho LEE

Inventor： Hyeong Won YUN ,  Hyun Ho LEE

IPC: G09F13/04

CPC classification number: H05K1/021 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133628 ,  H01L2224/48091 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/1056 ,  H01L2924/00014

Abstract: An LED backlight unit includes a light source; a board including a circuit pattern printed on an underside thereof, and having at least one mounting hole perforated therein where the light source is inserted; a metal chassis having an inside surface on which an underside of the light source is mounted, and receiving the board to be arranged in parallel to and with a gap from the metal chassis; and a reflector arranged on a top surface of the board to reflect light generated from the light source. The heat radiating path for transferring heat from the light source to the outside can be more simplified to enhance heat radiation efficiency thereby raising product reliability. The number of whole components can be reduced and the board with the light mounted thereon can be replaced with an inexpensive part thereby saving fabrication cost.

Abstract translation: LED背光单元包括光源; 包括印刷在其下侧上的电路图案的板，并且在其中插入有光源的至少一个穿孔的安装孔; 具有安装有光源的下侧的内表面的金属底座，并且容纳与所述金属底座平行且间隔配置的所述基板; 以及布置在所述板的顶表面上以反射从所述光源产生的光的反射器。 可以更加简化用于将光从光源传递到外部的散热路径，以提高散热效率，从而提高产品的可靠性。 可以减少整个部件的数量，并且可以用廉价的部件替换其上安装有灯的板，从而节省制造成本。

公开(公告)号：US07145774B2

公开(公告)日：2006-12-05

申请号：US10748771

申请日：2003-12-29

Applicant: Edoardo Campini ,  William F. Handley ,  Mark D. Summers

Inventor： Edoardo Campini ,  William F. Handley ,  Mark D. Summers

IPC: H05K7/20

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A thermal management apparatus is provided, wherein heat generated by an electronic component coupled to a backside of a carrier substrate may be transferred to an opposite front side of the carrier substrate through a thermal conductor sized to pass through an opening in the carrier substrate.

Abstract translation: 提供了一种热管理装置，其中耦合到载体基板的背面的电子部件产生的热可以通过尺寸适于穿过载体基板中的开口的热导体转移到载体基板的相对的前侧。

公开(公告)号：US07129577B2

公开(公告)日：2006-10-31

申请号：US10377202

申请日：2003-02-27

Applicant: John A. Maxwell

Inventor： John A. Maxwell

IPC: H01L23/10 ,  H01L23/34

CPC classification number: H01L23/5385 ,  H01L25/115 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/1305 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/145 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A packaging system for a high current, low voltage power supply. The power supply uses bare die power FETs which are directly mounted to a thermally conductive substrate by a solder attachment made to the drain electrode metallization on the back side of the FETs. The source electrode and gate electrode of each FET are coupled to the circuitry on an overhanging printed circuit board, using CSP solder balls affixed to the front side of the FET die. The heat generated by the FETs is effectively dissipated by the close coupling of the FETs to the thermally conductive underlying substrate.

Abstract translation: 用于大电流，低压电源的封装系统。 电源使用裸芯片功率FET，其通过在FET的背面上与漏电极金属化形成的焊接附件直接安装到导热基板。 每个FET的源电极和栅极电极使用固定在FET裸片正面的CSP焊球与偶数印刷电路板上的电路相连。 由FET产生的热量通过FET与导热底层基板的紧密耦合而被有效消散。

公开(公告)号：US07079972B1

公开(公告)日：2006-07-18

申请号：US10649371

申请日：2003-08-27

Applicant: Peter R. Wood ,  Narc V. Peralta ,  Frank S. Madren ,  Dileep Sivasankaran

Inventor： Peter R. Wood ,  Narc V. Peralta ,  Frank S. Madren ,  Dileep Sivasankaran

IPC: G01R27/28 ,  G01R21/02

CPC classification number: H01L23/34 ,  G06F1/206 ,  H01L2924/0002 ,  H05K1/0212 ,  H05K2201/10022 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10689 ,  H01L2924/00

Abstract: One embodiment disclosed relates to an apparatus for temperature control of an integrated circuit on a circuit board. The apparatus includes a first resistor on the circuit board, a second resistor on the circuit board, and a heat conductive material. The heat conductive material is attached to both the first and second resistors and to a surface of a package containing the integrated circuit. Another embodiment disclosed relates to an apparatus that provides both cooling and heating functionality in order to maintain the operational temperature of the IC within an acceptable range.

Abstract translation: 公开的一个实施例涉及一种用于电路板上的集成电路的温度控制的装置。 该装置包括电路板上的第一电阻器，电路板上的第二电阻器和导热材料。 导热材料连接到第一和第二电阻器以及包含集成电路的封装的表面。 所公开的另一实施例涉及提供冷却和加热功能以便将IC的工作温度保持在可接受范围内的装置。

公开(公告)号：US20060090102A1

公开(公告)日：2006-04-27

申请号：US11283355

申请日：2005-11-18

Applicant: James Wehrly ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

Inventor： James Wehrly ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

IPC: G06F11/00

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to, higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

Abstract translation: 灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。 触点沿柔性电路分布，以提供模块与应用环境之间的连接。 填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。 衬底形式优选地由导热材料设计，并且一个或多个热扩散器设置成与模块的组成集成电路中的至少一些热接触。 可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。