公开(公告)号：US07940530B2

公开(公告)日：2011-05-10

申请号：US11541840

申请日：2006-10-02

Applicant: Jeffrey Scott Duppong ,  Dale Arthur Janssen ,  Amanda Renee Wyland ,  Richard James Livdahl ,  Vincent Guy Segal ,  Travis Lee Johnston ,  Nathan Matthew Hawk

Inventor： Jeffrey Scott Duppong ,  Dale Arthur Janssen ,  Amanda Renee Wyland ,  Richard James Livdahl ,  Vincent Guy Segal ,  Travis Lee Johnston ,  Nathan Matthew Hawk

IPC: H05K7/00

CPC classification number: H05K3/366 ,  H05K3/301 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10598 ,  H05K2201/10606

Abstract: A circuit board arrangement includes a first printed circuit board having a first edge connector and a second printed circuit board having a second edge connector. The first edge connector includes a plurality of fingers, with each finger having at least one first conductor pad. The second edge connector includes a plurality of openings positioned generally in line with each other and a plurality of second conductor pads. Each opening has a corresponding finger positioned therein. Each second conductor pad is positioned adjacent a corresponding opening and corresponding first conductor pad.

Abstract translation: 电路板装置包括具有第一边缘连接器的第一印刷电路板和具有第二边缘连接器的第二印刷电路板。 第一边缘连接器包括多个手指，每个手指具有至少一个第一导体垫。 第二边缘连接器包括多个通常彼此成直线定位的开口和多个第二导体焊盘。 每个开口具有定位在其中的相应手指。 每个第二导体焊盘定位在相应的开口和对应的第一导体焊盘附近。

公开(公告)号：US07923907B2

公开(公告)日：2011-04-12

申请号：US12355881

申请日：2009-01-19

Applicant: Thomas Tessnow ,  Kim Albright ,  Michael Tucker

Inventor： Thomas Tessnow ,  Kim Albright ,  Michael Tucker

IPC: F21V29/00 ,  F21S4/00 ,  H01J1/62

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21S41/141 ,  F21S41/192 ,  F21S43/14 ,  F21S43/195 ,  F21S45/47 ,  F21S45/49 ,  F21S45/50 ,  F21V29/89 ,  F21W2103/00 ,  F21Y2107/90 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/1034 ,  H05K2201/10598 ,  H05K2203/1572 ,  Y10S362/80

Abstract: A robust LED lamp may be assembly by forming a heat sinking sandwich with two metal heat sinks positioned around the circuit board and pinned together a heat conductive element. The assembly is positioned by pressing it into a base providing electrical connections. The robust assembly is rapidly assembled, thermally effective in draining or spreading heat from the circuit board and is readily adaptable to a variety of applications lighting. The heat sink may be decorated, colored or otherwise esthetically enhanced for consumer appreciation.

Abstract translation: 强大的LED灯可以通过形成散热夹层而组装，其中两个金属散热器位于电路板周围并且将导热元件固定在一起。 组件通过将其压入提供电连接的基座来定位。 坚固的组件被快速组装，热效率地从电路板排出或散布热量，并且容易适用于各种应用照明。 散热器可以装饰，着色或以其他方式美观地加强，以便消费者欣赏。

公开(公告)号：US20110049087A1

公开(公告)日：2011-03-03

申请号：US12550289

申请日：2009-08-28

Applicant: Jason Douglas Ferguson

Inventor： Jason Douglas Ferguson

IPC: H01B13/00 ,  C23F1/00 ,  B25B11/00 ,  B23Q7/00 ,  H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67346 ,  B23Q3/062 ,  B23Q2240/005 ,  B25B11/002 ,  H01L21/6708 ,  H01L21/67757 ,  H01L21/6776 ,  H05K1/0393 ,  H05K3/0085 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/104 ,  Y10T29/49998

Abstract: A rigid holder is provided for supporting a flexible article. The rigid holder may include a first frame member and a second frame member which are held together through magnets.

Abstract translation: 提供用于支撑柔性制品的刚性保持器。 刚性保持器可以包括通过磁体保持在一起的第一框架构件和第二框架构件。

公开(公告)号：US07877867B2

公开(公告)日：2011-02-01

申请号：US12117126

申请日：2008-05-08

Applicant: Yoshihiro Kawamura

Inventor： Yoshihiro Kawamura

IPC: H05K3/30

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/10015 ,  H05K2201/10462 ,  H05K2201/10598 ,  H05K2201/2036 ,  H05K2203/0191 ,  H05K2203/0588 ,  Y10T29/43 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A resist having a predetermined thickness is formed on a printed circuit board except for portions of the printed circuit board that oppose a convex portion of a component when the component is mounted on the printed circuit board. A silk screen printed layer having a predetermined thickness is formed on the resist. Thereafter, a concave portion of the component is bonded to the silk screen printed layer using double coated tape having a predetermined thickness. The component is mounted such that the convex portions of the component oppose the portions of the printed circuit board that do not have a resist formed thereon. The sum of the thicknesses of the resist, the silk screen printed layer and the double coated tape is larger than a height difference between the concave portion and the convex portion of the component.

Abstract translation: 具有预定厚度的抗蚀剂形成在印刷电路板上，除了当该部件安装在印刷电路板上时，印刷电路板的与部件的凸部相对的部分。 在抗蚀剂上形成具有预定厚度的丝网印刷层。 此后，使用具有预定厚度的双面胶带将该部件的凹部与丝网印刷层结合。 该部件被安装成使得该部件的凸出部分与印刷电路板上没有形成抗蚀剂的部分相对。 抗蚀剂，丝网印刷层和双面胶带的厚度之和大于该部件的凹部与凸部之间的高度差。

公开(公告)号：US20100310829A1

公开(公告)日：2010-12-09

申请号：US12696404

申请日：2010-01-29

Applicant: Takahiro YADA

Inventor： Takahiro YADA

IPC: B32B3/30 ,  B32B37/02

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T156/1002 ,  Y10T156/1066 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/24612

Abstract: A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities.

Abstract translation: 一种用于制造具有框架部分和连接到框架部分的多个部分的多片板的方法包括：从用于框架部分的制造面板形成框架部分，通过检查片段的质量来分选多个可接受片段， 在框架部分和可接受的片部分中形成切口部分，使得切口部分允许相对于框架部分布置可接受的片部分，将片部分和框架部分临时固定在相应的位置，将粘合剂注入 当框架部分和片段彼此临时固定时，由切口部分形成的空腔，以及通过固化注入到空腔中的粘合剂将可接受片段与框架部分接合。

公开(公告)号：US20100263462A1

公开(公告)日：2010-10-21

申请号：US12762510

申请日：2010-04-19

Applicant: Hidehiro NAKAMURA

Inventor： Hidehiro NAKAMURA

IPC: H05K1/00 ,  G01D21/00 ,  H01R43/02

CPC classification number: H05K13/00 ,  G01D1/00 ,  G01D15/00 ,  H05K1/028 ,  H05K1/118 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/4602 ,  H05K3/4635 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09163 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2203/061 ,  H05K2203/167

Abstract: There is provided a method of manufacturing a concave connector substrate that has high connection accuracy, a low manufacturing cost, and high flexibility in design, can ensure stable repeated use, and significantly improve use convenience.A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and holds the plate-shaped connector at the connection position and a cut portion for removing a section having a shape corresponding to the guide/holding region on at least one side; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

Abstract translation: 提供了一种制造具有高连接精度，低制造成本和高设计灵活性的凹形连接器基板的方法，可以确保稳定的重复使用，并且显着提高使用方便性。 一种制造凹形连接器基板的方法包括：准备具有引导/保持区域的导向基板的步骤，该导向基板将板状连接器引导到连接位置并将板状连接器保持在连接位置， 在至少一个侧面上移除具有与所述引导/保持区域相对应的形状的部分; 在导向基板的两个表面上布置和对准两个布线基板，每个布线基板具有布线和与布线电连接的通孔连接部分，并且将粘合剂施加到引导基板的预定区域以键合 布线基板到引导基板; 将布线基板的一部分朝向引导基板的切断部的内侧弯曲并使配置在弯曲部的布线与切断部的内部压力接触的步骤; 以及去除切割部分内的部分以形成引导/保持区域的步骤。

公开(公告)号：US07797823B2

公开(公告)日：2010-09-21

申请号：US11967756

申请日：2007-12-31

Applicant: Fabien Létourneau ,  Stefano DeCecco ,  Peter Serjak

Inventor： Fabien Létourneau ,  Stefano DeCecco ,  Peter Serjak

IPC: H05K3/30

CPC classification number: H05K3/303 ,  H01L23/467 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/301 ,  H05K2201/09072 ,  H05K2201/09127 ,  H05K2201/10522 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies.

Abstract translation: 用于提供高密度组件组件的装置和方法，例如机电或电光组件。

公开(公告)号：US20100202119A1

公开(公告)日：2010-08-12

申请号：US12668835

申请日：2008-06-02

Applicant: Tetsuro Nagami ,  Shinji Serizawa ,  Yoichi Yasui

Inventor： Tetsuro Nagami ,  Shinji Serizawa ,  Yoichi Yasui

IPC: H05K1/14

CPC classification number: H05K1/147 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0058 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: A flexible wiring board 1 includes an insulating member 12 having a conductor 11 formed therein, a reinforcing board 13 for reinforcing the insulating member 12 in the vicinity of the connection terminal 11a of the flexible wiring board 1, and a lock member 14 to be locked to a board 3 having a connector 2, with the board 3 having an opening 31 for receiving the lock member 14 fit therein in a state where the connection terminal 11a is connected and secured to the connector 2.

Abstract translation: 柔性布线基板1具有形成有导体11的绝缘件12，用于加强柔性布线板1的连接端子11a附近的绝缘件12的加强板13和锁定件 连接到具有连接器2的板3，其中板3具有用于接收锁定构件14的开口31，其中连接端子11a连接并固定到连接器2的状态。

公开(公告)号：US20100124038A1

公开(公告)日：2010-05-20

申请号：US12537586

申请日：2009-08-07

Applicant: Yasushi HASEGAWA

Inventor： Yasushi HASEGAWA

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K3/30 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/161 ,  Y10T29/49126

Abstract: A method of fabricating a multi-piece board includes: adhering a first frame element connected to multiple piece portions to a second frame element, the first frame element forming a board main portion of a multi-piece board, the first frame element and the second frame element forming a frame portion of the multi-piece portion, thereby yielding the multi-piece board; mounting multiple electronic components on the piece portions, respectively; separating the piece portions from the frame portion; separating, from the first frame element, the second frame element adhered thereto; and adhering the second frame element to a first frame element of another board main portion.

Abstract translation: 一种制造多片板的方法包括：将连接到多片部分的第一框架元件粘附到第二框架元件，第一框架元件形成多片板的板主体部分，第一框架元件和第二框架元件 框架元件形成多片部分的框架部分，从而产生多片板; 分别在零件上安装多个电子部件; 将所述片部分与所述框架部分分离; 从第一框架元件分离粘附到其上的第二框架元件; 以及将所述第二框架元件粘合到另一个板主体部分的第一框架元件。

公开(公告)号：US20100115766A1

公开(公告)日：2010-05-13

申请号：US12500041

申请日：2009-07-09

Applicant: Yasushi HASEGAWA

Inventor： Yasushi HASEGAWA

IPC: H05K3/36

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/0169 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/166 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49789 ,  Y10T29/49895

Abstract: A fabrication method for a multi-piece board having a frame part and multi piece parts each having a printed wiring board includes producing the frame part having a first coupling portion, and the multi-piece parts including piece parts each having a second coupling portion coupled to the first coupling portion at a production panel with at least the frame part and the piece parts being separated from each other, separating the frame part and the multi-piece parts from the production panel, and coupling the first coupling portion to the second coupling portion to couple the frame part and the piece parts and combine the frame part and the multi piece parts so as to yield the multi-piece board.

Abstract translation: 一种具有框架部分和多片部分的多片板的制造方法，每个具有印刷线路板包括制造具有第一联接部分的框架部分，并且所述多片部件包括件部件，每个部件具有联接的第二联接部分 在至少框架部分和零件彼此分离的生产面板处的第一联接部分处，将框架部分和多件部件与生产面板分离，并将第一联接部分连接到第二联接器 联接框架部分和零件，并且组合框架部分和多件部件以产生多片板。