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    Solderable electrical connection element with a solder deposit
    41.
    发明授权
    Solderable electrical connection element with a solder deposit 有权
    具有焊料沉积的可焊接电气连接元件

    公开(公告)号：US06461188B2

    公开(公告)日：2002-10-08

    申请号：US09867819

    申请日：2001-05-31

    Applicant: Bernhard Reul

    Inventor： Bernhard Reul

    IPC: H01R424

    CPC classification number: H01R43/0235 ,  H01R4/022 ,  H01R4/187 ,  H01R4/2495 ,  H05K3/363 ,  H05K2201/1034 ,  H05K2201/10916 ,  H05K2203/1189

    Abstract: According to the invention, a metal insertion piece (6) is provided in a solderable electrical connection element (1) with a thin support sheet (2), at least one metal conductor (3) and at least one free contact face (5), which may be joined to an associated connection face (11) of another component (12), by means of a soldered joint that can be made using a solder deposit (9), which metal insertion piece (6) passes through the connection element (1) and the support sheet (2) respectively in the region of the contact face (5) and is securely joined to this support sheet, which serves as a base for the solder deposit (9). Preferably, the insertion pieces (6) may be derived from conventional crimp attachments. They may also be used for mechanically fastening both the solder deposit (9) and an electrical conductor to the support sheet (2).

    Abstract translation: 根据本发明，金属插入件（6）设置在具有薄的支撑片（2），至少一个金属导体（3）和至少一个自由接触面（5）的可焊接电连接元件（1）中， ，其可以通过可以使用焊料沉积物（9）制成的焊接接头连接到另一部件（12）的相关联的连接面（11），该金属插入件（6）穿过连接元件 （1）和支撑片（2）分别在接触面（5）的区域中，并牢固地接合到作为焊料沉积物（9）的基底的该支撑片材上。 优选地，插入件（6）可以衍生自常规的卷边附件。 它们也可以用于将焊料沉积物（9）和电导体机械地固定到支撑片（2）上。

    Semiconductor device and mounting method therefor
    43.
    发明授权
    Semiconductor device and mounting method therefor 失效
    半导体装置及其安装方法

    公开(公告)号：US6019274A

    公开(公告)日：2000-02-01

    申请号：US857865

    申请日：1997-05-16

    Applicant: Naofumi Iwamoto

    Inventor： Naofumi Iwamoto

    IPC: H01L21/60 ,  H01L23/32 ,  H01L23/495 ,  H01L23/498 ,  H05K3/30 ,  H05K3/34 ,  B23K31/02 ,  B23K35/12

    CPC classification number: H05K3/3421 ,  H01L23/32 ,  H01L23/49572 ,  H01L23/49811 ,  H01L24/83 ,  H01L2924/14 ,  H05K2201/10424 ,  H05K2201/10681 ,  H05K2201/10916 ,  H05K2203/0278 ,  H05K2203/159 ,  H05K3/301 ,  Y02P70/613

    Abstract: A reflow mounting method and a semiconductor device for efficient manufacture of TCPs superior in reliability by preventing the deformation of leads and ensuring a dependable contact between the bonding pads on a circuit board and the leads, wherein metal pieces arranged as weights on the leads are temporarily positioned adequately to specified bonding pads, thus restraining the leads from shifting from appropriate positions, which may occur if the leads deform, and wherein the metal pieces become wettable by bonding agent when heated, thus making sure that the leads are firmly fixed between the metal pieces and the bonding pads.

    Abstract translation: 一种回流安装方法和半导体装置，用于通过防止引线的变形并且确保电路板上的接合焊盘和引线之间的可靠接触而有效地制造可靠性优异的TCP，其中作为引线上的重量设置的金属片是暂时的 适当地定位到指定的接合焊盘，从而限制引线从适当的位置移动，如果引线变形可能会发生这种情况，并且其中金属片在加热时可被粘合剂润湿，从而确保引线牢固地固定在金属 片和接合垫。

    Self-aligning light directing surface mountable miniature incandescent lamp
    45.
    发明授权
    Self-aligning light directing surface mountable miniature incandescent lamp 失效
    自调光导光表面安装微型白炽灯

    公开(公告)号：US5382874A

    公开(公告)日：1995-01-17

    申请号：US970767

    申请日：1992-11-03

    Applicant: Ralph E. Johnson

    Inventor： Ralph E. Johnson

    IPC: H01K1/46 ,  H01J5/54 ,  H01K1/32 ,  H01K5/02 ,  H01K7/04 ,  H05K3/30 ,  H05K3/34 ,  H01K1/42

    CPC classification number: H05K3/3442 ,  H01J5/54 ,  H01K1/325 ,  H01K1/46 ,  H01K5/02 ,  H01K7/04 ,  H05K2201/10113 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10916 ,  H05K3/303 ,  Y02P70/613

    Abstract: A surface mountable miniature incandescent lamp assembly has an elongated substantially cylindrical glass envelope wherein a filament is contained in contact with metal members having glass-to-metal seals with the glass envelope. A substantial portion of the outer surface of the glass envelope is coated with a light reflective metal coating, with a non-coated elongated window transparent to light being left on the surface. The metal members extend axially to the outside from the envelope and, when mounted to a circuit board provide electric contact for the lamp. At least one of the end members includes a unique surface feature, such as a flat portion of an otherwise cylindrical surface, which is directionally coupled relative to the window of the glass envelope and which acts as a key or indexing surface for mounting the lamp assembly to the receiving surface (circuit board) with the window disposed in the desired direction.

    Abstract translation: 可表面安装的小型白炽灯组件具有细长的基本上圆柱形的玻璃外壳，其中灯丝包含与玻璃与金属密封件的金属部件接触。 玻璃外壳的外表面的主要部分涂覆有光反射金属涂层，其中未涂覆的细长窗口对于留在表面上的光而言是透明的。 金属构件从外壳轴向延伸到外部，并且当安装到电路板时为灯提供电接触。 至少一个端部构件包括独特的表面特征，例如其它圆柱形表面的平坦部分，其相对于玻璃外壳的窗口定向耦合，并且用作安装灯组件的键或分度表面 到达接收表面（电路板），窗口设置在所需方向。

    Method of making surface mountable electronic device
    47.
    发明授权
    Method of making surface mountable electronic device 失效
    制造可表面安装的电子设备的方法

    公开(公告)号：US4934048A

    公开(公告)日：1990-06-19

    申请号：US280172

    申请日：1988-12-05

    Applicant: Donald C. McElheny ,  Dale A. Ponivas ,  David A. Syracuse ,  Stephen H. Chandler ,  Robert H. Nareau

    Inventor： Donald C. McElheny ,  Dale A. Ponivas ,  David A. Syracuse ,  Stephen H. Chandler ,  Robert H. Nareau

    IPC: H01F27/29 ,  H05K3/30

    CPC classification number: H01F27/292 ,  H05K3/30 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49172

    Abstract: A surface mountable electronic device and method of making same wherein a discrete electronic device is encapsulated in a body of electrical insulating material having opposite ends and a mounting surface extending between the ends, and an electrode is provided on each end. Each electrode includes a portion on the end of the body in electrical contact with the corresponding lead of the discrete electronic device and a contact portion extending along the mounting surface for making electrical connection to a circuit portion defined on a surface to which the device is mountable. The discrete electronic device is manufactured, prior to encapsulation, by known techniques. Preferably the body is a rectangular solid with each of the four sides having electrode contact portions thereon to serve as one of four possible mounting surfaces each with substantial mechanical stability. When the discrete electronic device is an inductor, interruption of the magnetic field is minimized by spacing the ends of the inductor core from the ends of the encapsulating body, separating the electrode contact portions, having the area of the electrode end portion less than the area of the end of the encapsulating body, and having the cross-sectional area of the most narrow section of the electrode end portion no less than the cross sectional area of the magnetic wire of the inductor winding. For a shielded inductor, phenolic core inductor or non-inductive device, solid metal end electrodes can be employed.

    Abstract translation: 一种可表面安装的电子设备及其制造方法，其中分立的电子器件封装在具有相对端的电绝缘材料体和在端部之间延伸的安装表面，并且在每个端部上设置电极。 每个电极包括在主体的端部与分立的电子设备的相应引线电接触的部分和沿着安装表面延伸的接触部分，用于与限定在该装置可安装的表面上的电路部分进行电连接 。 离散电子器件在封装之前通过已知技术制造。 优选地，主体是矩形固体，其中四边中的每一个在其上具有电极接触部分，以用作四个可能的安装表面之一，每个具有相当大的机械稳定性。 当分立电子设备是电感器时，通过将电感器芯的端部与封装体的端部间隔开来，使电场端部的面积小于面积的电极接触部分 并且电极端部的最窄部分的横截面积不小于电感器绕组的磁线的横截面面积。 对于屏蔽电感器，可以使用酚醛芯感应器或非感应器件，固体金属端电极。

    Electric capacitor in the form of a chip component and method for manufacturing same
    48.
    发明授权
    Electric capacitor in the form of a chip component and method for manufacturing same 失效
    芯片组件形式的电容器及其制造方法

    公开(公告)号：US4617609A

    公开(公告)日：1986-10-14

    申请号：US707591

    申请日：1985-03-04

    Applicant: Ferdinand Utner ,  Herbert Bolz

    Inventor： Ferdinand Utner ,  Herbert Bolz

    IPC: H01G4/252 ,  H01G2/06 ,  H01G4/00 ,  H01G9/004 ,  H05K3/34 ,  H01G1/14 ,  H01G4/10 ,  H01G7/00

    CPC classification number: H01G2/06 ,  H01G2/065 ,  H05K3/3442 ,  H01F2027/295 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/435

    Abstract: An electric capacitor which can be soldered to a printed circuit board in the manner of a chip component, without damaging the capacitor, has capacitor plates with electrodes therebetween arranged in a stack, the electrodes alternatingly terminating at opposite end faces of the capacitor, at which a metal plating is applied, with a portion of respective bands of flexible metal being disposed adjacent each metal plating forming current leads, with the portion of the band adjacent the metal plating being encapsulated with the capacitor, and a remaining portion of each band projecting outside of the encapsulation and being bent at least partially around exterior sides of the encapsulation and forming soldering surfaces. A method for manufacturing such a capacitor includes the steps of cutting spaced recesses in a metal plate for producing a number of continuous parallel bands extending between two margins of the plate, cutting and bending those bands and inserting a stacked capacitor with the metal platings between the cut ends of the band, encapsulating the capacitor and the portions of the bands adjacent thereto, and severing the opposite ends of the bands from the plate margins and bending the severed portions around a part of the exterior of the encapsulation.

    Abstract translation: 可以以芯片部件的方式焊接到印刷电路板而不损坏电容器的电容器具有电容器板，其间具有电极的电极板布置在堆叠中，电极交替地终止于电容器的相对端面，在该电容器 施加金属电镀，其中柔性金属的各个带的一部分设置在每个金属镀层形成电流引线附近，带的与金属镀层相邻的部分被电容器封装，并且每个带的剩余部分向外突出 并且至少部分地围绕封装的外侧弯曲并形成焊接表面。 制造这种电容器的方法包括以下步骤：在金属板中切割间隔开的凹槽，以产生在板的两个边缘之间延伸的多个连续的平行带，切割和弯曲这些带，并且将金属板插入在 切割带的端部，封装电容器和与其相邻的带的部分，并且将带的相对端从板边缘切断并且围绕封装的外部的一部分弯曲切断的部分。

    Hermetically sealed ceramic cased surface mount capacitor
    49.
    发明授权
    Hermetically sealed ceramic cased surface mount capacitor 失效
    密封陶瓷套管表面贴装电容器

    公开(公告)号：US4614995A

    公开(公告)日：1986-09-30

    申请号：US667046

    申请日：1984-11-01

    Applicant: Bernard Lavene

    Inventor： Bernard Lavene

    IPC: H01G2/02 ,  H01G2/06 ,  H01G4/228 ,  H01G4/248 ,  H05K3/34 ,  H01G1/13

    CPC classification number: H01G4/248 ,  H01G2/06 ,  H01G2/065 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A planar terminated capacitor and a method for fabricating planar terminated capacitors is disclosed wherein a capacitor element is inserted in a nonconductive ceramic case. The case extends outwardly beyond the ends of the capacitor element forming cavities at each end of the case. Metal end caps are positioned at the ends of the case substantially enclosing the cavities. The end caps are electrically coupled to the ends of the capacitor element.

    Abstract translation: 公开了一种平面端接电容器和制造平面端接电容器的方法，其中将电容器元件插入到非导电陶瓷壳体中。 壳体向外延伸超过在壳体的每个端部处形成腔的电容器元件的端部。 金属端帽位于壳体的基本上包围空腔的端部。 端盖电耦合到电容器元件的端部。

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