公开(公告)号：US20190122817A1

公开(公告)日：2019-04-25

申请号：US16226722

申请日：2018-12-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke NISHINO ,  Kuniaki YOSUI

IPC: H01F41/02 ,  H01F7/06 ,  H01F41/04 ,  G03B5/02 ,  H01F7/20

CPC classification number: H01F41/02 ,  G03B5/02 ,  H01F7/066 ,  H01F7/20 ,  H01F41/04 ,  H01F41/041 ,  H01F2007/068

Abstract: An electromagnet includes a stacked body formed by stacking and thermocompression-bonding a plurality of insulating base materials having thermoplasticity and including wound linear conductors which define a spiral coil. In a region of each of the insulating base materials surrounded by each of the wound linear conductors, each of low mobility members is formed of a material having mobility lower than that of the insulating base materials at a temperature upon thermocompression-bonding of the insulating base materials.

公开(公告)号：US20190082542A1

公开(公告)日：2019-03-14

申请号：US16158334

申请日：2018-10-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Naoki GOUCHI ,  Shingo ITO

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/16

Abstract: A multilayer substrate includes a lamination body including a first resin substrate, a second resin substrate, and a bonding layer that are hot-pressed. A first conductor pattern including a surface defined by a plated film is disposed on a first surface of the first resin substrate. A second conductor pattern including a surface defined by a plated film is disposed on a second surface of the first resin substrate. A third conductor pattern including a surface defined by a plated film is disposed on a third surface of the second resin substrate. A fourth conductor pattern including a surface defined by a plated film is disposed on a fourth surface of the second resin substrate. The first conductor pattern is located closer to one outermost layer than the second conductor pattern is. The second conductor pattern is thinner than the first conductor pattern.

公开(公告)号：US20180368252A1

公开(公告)日：2018-12-20

申请号：US16109918

申请日：2018-08-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinya OGURI ,  Wataru TAMURA ,  Kanto IIDA ,  Kuniaki YOSUI ,  Isamu MORITA

IPC: H05K1/02 ,  H01P3/08 ,  H05K1/11

Abstract: An electronic device includes a transmission line and a circuit board. The transmission line includes a signal conductor, a base material, a first external connection conductor, a second external connection conductor, and a ground conductor, and defines a stripline. The circuit board includes a first mounting land conductor, a second mounting land conductor, and a radiation reduction conductor. The first mounting land conductor and the second mounting land conductor are provided in a concave portion on the surface of the circuit board, and are respectively connected to the first external connection conductor and the second external connection conductor. The radiation reduction conductor is provided on the lateral surface of the concave portion in which the transmission line is disposed, and is in contact with or adjacent to the first lateral surface and the second lateral surface of the base material.

公开(公告)号：US20180343747A1

公开(公告)日：2018-11-29

申请号：US16055207

申请日：2018-08-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H05K3/34 ,  H05K1/18 ,  H05K3/28 ,  H05K3/36 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K3/34 ,  H05K1/02 ,  H05K1/141 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0129

Abstract: An insulating board includes a first portion that is relatively thick and a second portion that is relatively thin. The first and second portions have different thicknesses so that a step is provided therebetween. The insulating board includes a first land conductor on a first mounting surface of the first portion at a side at which the step is provided, a second land conductor on a second mounting surface of the second portion at the side at which the step is provided, and an insulating protection film on the first mounting surface so that a portion of the first land conductor is exposed and another portion of the first land conductor is covered. An electronic component is soldered to the first land conductor. Another electronic component is joined to the second land conductor by an anisotropic conductive film that covers the second land conductor.

公开(公告)号：US20180316080A1

公开(公告)日：2018-11-01

申请号：US16028462

申请日：2018-07-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro BABA ,  Kuniaki YOSUI

IPC: H01P3/08 ,  H01P3/06 ,  H05K1/02 ,  H05K1/14

CPC classification number: H01P3/082 ,  H01P3/06 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/147 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/10189

Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section. The signal line is wider in the second section than in the first section.

公开(公告)号：US20180211934A1

公开(公告)日：2018-07-26

申请号：US15924305

申请日：2018-03-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Keisuke IKENO ,  Kuniaki YOSUI

IPC: H01L23/00 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/81 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/145 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/9211 ,  H05K1/111 ,  H05K3/328 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2924/00

Abstract: A component-mounted resin substrate includes a thermoplastic resin substrate and an electronic component. The resin substrate includes a surface including a mounting land conductor and a reinforcing resin member. A bump of the electronic component is joined to the mounting land conductor by ultrasonic joining. The reinforcing resin member is in contact with a side surface of the mounting land conductor and has a height smaller than a height of the mounting land conductor.

公开(公告)号：US20180182681A1

公开(公告)日：2018-06-28

申请号：US15904469

申请日：2018-02-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Hirofumi SHINAGAWA ,  Yuki ITO

IPC: H01L23/12 ,  H05K1/02 ,  H05K3/32

CPC classification number: H01L23/12 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/1329 ,  H01L2224/16225 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2924/15151 ,  H01L2924/15159 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/0326 ,  H05K3/32 ,  H05K3/328 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/10121 ,  H05K2201/10553 ,  H05K2201/2009 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.

公开(公告)号：US20180159223A1

公开(公告)日：2018-06-07

申请号：US15885853

申请日：2018-02-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Hirokazu YAZAKI

IPC: H01Q7/06 ,  H01Q21/08 ,  H01Q1/52 ,  H01Q1/22

CPC classification number: H01Q7/06 ,  H01Q1/2208 ,  H01Q1/523 ,  H01Q21/08

Abstract: An antenna device includes a power supply coil including wire patterns provided on or in magnetic layers and antenna coils including wire patterns provided on or in the magnetic layers. The power supply coil and the antenna coils include coil winding axes thereof coinciding with a lamination direction of the magnetic layers and generate magnetic field coupling to each other. The power supply coil is located on an inner side portion relative to the antenna coils when seen in the lamination direction. At least portions of the antenna coils are located on outer side portions relative to the power supply coil in the lamination direction. With this, an antenna device and a communication apparatus capable of communicating with a communication party reliably without forming an unnecessary communication path with a party-side coil are provided.

公开(公告)号：US20180145384A1

公开(公告)日：2018-05-24

申请号：US15859815

申请日：2018-01-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Takahiro BABA ,  Kosuke NISHINO

IPC: H01P1/203 ,  H01P3/02 ,  H01P5/02 ,  H05K1/02 ,  H05K1/18 ,  H05K5/00

CPC classification number: H01P1/203 ,  H01P1/2039 ,  H01P3/026 ,  H01P3/08 ,  H01P5/02 ,  H05K1/0216 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/028 ,  H05K1/147 ,  H05K1/18 ,  H05K5/0086 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/0715 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09727

Abstract: A transmission line member includes a dielectric base body. At an intermediate point in a thickness direction of the dielectric base body, first and second signal conductors are disposed. A reference ground conductor is disposed at one side of the first and second signal conductors in the thickness direction, and an auxiliary ground conductor is disposed at the other side. At intermediate points of the first signal conductor, a coil conductor and a capacitor-defining plate conductor are disposed. The capacitor-defining plate conductor faces the reference ground conductor and the auxiliary ground conductor to connect a low pass filter and the first transmission line. A coil conductor is disposed between the second signal conductor and the reference ground conductor, and connected to the second signal conductor and the reference ground conductor to connect a high pass filter and the second transmission line.

公开(公告)号：US20180123228A1

公开(公告)日：2018-05-03

申请号：US15856119

申请日：2017-12-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Naoki GOUCHI ,  Naoto IKEDA ,  Hiroyuki IRIKAWA

IPC: H01Q1/38 ,  H01Q7/06 ,  H01Q1/52 ,  H01Q7/00

CPC classification number: H01Q1/38 ,  H01Q1/52 ,  H01Q7/00 ,  H01Q7/06

Abstract: An antenna device includes a first insulating base portion including a spiral antenna pattern, and a second insulating base portion including at least two conductor wires. An insulating layer configured to insulate the conductor wires from the antenna pattern is provided between a first end and a second end of the antenna pattern in a planar view. The insulating layer includes a cut or an opening allowing at least one of the first end and the second end of the antenna pattern to be exposed toward the conductor wires. Electrode portions of the conductor wires are electrically and mechanically connected to the first end and the second end, respectively, of the antenna pattern by a conductive material in the cut or the opening of the insulating layer. The second insulating base portion is more flexible than the first insulating base portion.