Abstract:
A device for making spectroscopy measurements with reduced or eliminated surface reflections is provided, the device including an elongated member including an outermost opaque thin walled enclosure; an optically transparent thin-walled enclosure adjacent an inner surface of said outermost thin walled enclosure; one or more optical fibers centrally and axially disposed and spaced apart a distance B with respect to the optically transparent thin-walled enclosure; wherein the elongated member is adapted to be coupled to a spectrometer and an illumination source to provide a light signal from the illumination source along said optically transparent thin-walled enclosure and collect a scattered light signal from the sample by said one or more optical fibers to provide to the spectrometer.
Abstract:
Certain examples described herein are directed to optical devices and systems that include first and second optical elements. In some examples, the first optical element may be configured to pass light received from an excitation source, and the second optical element may be optically coupled to the first optical element and may be configured to reflect incident light from the first optical element back to the first optical element and configured to pass the light reflected from the first optical element. Methods using the devices and systems are also described.
Abstract:
A minute particle analyzing device includes: a light source; a first condenser lens for condensing light from the light source to a first end of a multimode optical fiber; a second condenser lens for condensing the light emerging from a second end of the multimode optical fiber to a minute particle; and a detector for detecting light generated from the minute particle by the application of the light from the light source.
Abstract:
Various embodiments provide an optical system including an optical spectrometer, a first negative power mirror configured and arranged to receive radiation from a far-field object, a second positive power mirror configured and arranged to receive radiation reflected by the first negative power mirror, and a third positive power mirror configured and arranged to receive radiation reflected by the second positive mirror and to direct the radiation towards an entrance slit of the optical spectrometer.
Abstract:
In a state that the body portion 4 is regulated by inner wall planes 27, 29, 28 of the package 3 so as not to move in parallel or perpendicularly with respect to the rear plane 4b, the spectroscopic module is directly supported by the package 3, thereby when the spectrometer is downsized, the spectroscopic module 2 can be supported securely and also there is provided securely a positional accuracy between the light incident opening 22a of the package 3, the spectroscopic portion 6 of the spectroscopic module 2 and the light detecting element 7. Further, the lead 23 is buried into the package 3 to give derivation and support by the lead deriving portion 26, thereby the lead deriving portion 26 in itself of the package 3 is allowed to act as a base when wire bonding is conducted to electrically connect the lead 23 with the light detecting element 7, thus preventing breakage and deviation of the spectroscopic module 2.
Abstract:
Reflectance systems and methods are described that under-fill the collection fiber of a host spectrometer both spatially and angularly. The under-filled collection fiber produces a response of fiber-based spectrometers that is relatively insensitive to sample shape and position.
Abstract:
First, a box 5 molded from a resin is prepared such as to have a rectangular parallelepiped outer form with a pair of grooves on the bottom face and a semispherical recess 9. Subsequently, a photocurable resin agent 27 is applied to a bottom area 12 of the recess 10 in the box 5. Then, while a light transmitting mold 28 having a bottom face formed with a plurality of grating grooves arranged in a row along a predetermined direction is pressed against the applied resin agent 27, the resin agent 27 is cured by irradiation with light, so as to provide the area 12 in the recess 10 with the grating 29 formed with a plurality of grating grooves. Next, Al, Au, or the like is vapor-deposited so as to cover the grating 29, thereby forming a reflecting film 15. Then, a photodetector 4 is accommodated in a package 2. This can easily manufacture a highly reliable spectrometer.
Abstract:
A spectrometer 1, in which a spectroscopic unit 3 spectrally resolves and reflects light L1 having entered the inside of a package 2 while a photodetector 4 detects reflected light L2, comprises a package 2 accommodating the photodetector 4 therein. The package 2 has a semispherical recess 10, while the recess 10 has a bottom face formed with an area 12 having a plurality of grating grooves 14 arranged in a row along a predetermined direction and an area 13 surrounding the area 12. The areas 12 and 13 are continuous with each other and formed on the same curved surface. This can inhibit the grating grooves 14 from shifting their positions even when distortions are generated in the package 2.
Abstract:
We disclose apparatus that includes: (a) an enclosure including an aperture; (b) a prism mounted in the enclosure so that a surface of the prism is exposed through the aperture; (c) an optical assembly contained within the enclosure, the optical assembly including a radiation source and a radiation detector, the source being configured to direct radiation towards the prism and the detector being configured to detect radiation from the source reflected from the exposed surface of the prism; and (d) an electronic processor contained within the enclosure, the electronic processor being in communication with the detector. The apparatus can be configured so that, during operation, the electronic processor determines information about a sample placed in contact with the exposed surface of the prism based on radiation reflected from the exposed prism surface while it is in contact with the sample.
Abstract:
The invention is an optical method and apparatus for measuring the temperature of semiconductor substrates in real-time, during thin film growth and wafer processing. Utilizing the nearly linear dependence of the interband optical absorption edge on temperature, the present method and apparatus result in highly accurate measurement of the absorption edge in diffuse reflectance and transmission geometry, in real time, with sufficient accuracy and sensitivity to enable closed loop temperature control of wafers during film growth and processing. The apparatus operates across a wide range of temperatures covering all of the required range for common semiconductor substrates.