公开(公告)号：US09888619B2

公开(公告)日：2018-02-06

申请号：US14414514

申请日：2013-06-05

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Yusuke Haruna ,  Sirou Yamauchi ,  Hiroshi Tajima ,  Kenji Kamino

IPC: H05K9/00 ,  H05K1/02 ,  B32B7/12 ,  B32B15/04 ,  B32B15/20

CPC classification number: H05K9/0088 ,  B32B7/12 ,  B32B15/04 ,  B32B15/20 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/00 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0296 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0707 ,  H05K2201/0715 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.

公开(公告)号：US09875834B2

公开(公告)日：2018-01-23

申请号：US15184626

申请日：2016-06-16

Applicant: Sensata Technologies, Inc.

Inventor： Janselme M. Eral ,  Richard R. Guerrero

IPC: H01F7/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01F7/0205 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/111 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09063 ,  Y02P70/611

Abstract: A flexible printed circuit may include a flexible body portion and a flexible head end portion, where conductors and/or elongated cut outs may be formed in a pattern. The flexible body may include a proximal end and a distal end, wherein the proximal end is configured to be connected to a stationary object and the distal end is configured to be connected to a moving object that moves in relation to the stationary object. The head end of the flexible printed circuit may be located at the distal end of the flexible body. The head end may include a plurality of elongated cut-outs, and/or a plurality of electrical connection pads suspended from the flexible body by the plurality of elongated cutouts.

公开(公告)号：US09872383B1

公开(公告)日：2018-01-16

申请号：US14266636

申请日：2014-04-30

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/00 ,  H05K1/03 ,  H01R4/00 ,  D05B17/00 ,  H01R4/02 ,  H01R43/02 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.

公开(公告)号：US09850401B2

公开(公告)日：2017-12-26

申请号：US14561070

申请日：2014-12-04

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chung-Ting Lai ,  Chih-Wei Lin

IPC: C09D179/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/32 ,  H05K1/03 ,  H05K3/38 ,  C08G73/10 ,  B32B38/00 ,  H05K3/02

CPC classification number: C09D179/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/322 ,  B32B2038/0016 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2311/00 ,  B32B2379/08 ,  B32B2457/08 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1071 ,  H05K1/036 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/2495 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/31544 ,  C08L27/18 ,  C08L83/04 ,  C08K3/36

Abstract: A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.

公开(公告)号：US20170367191A1

公开(公告)日：2017-12-21

申请号：US15691313

申请日：2017-08-30

Applicant: Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co ., Ltd. ,  GARUDA TECHNOLOGY CO., LTD

Inventor： WEI-SHUO SU

IPC: H05K3/24 ,  H05K3/10 ,  H05K3/42

CPC classification number: H05K3/244 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2203/0723 ,  H05K2203/1394

Abstract: A printed circuit board includes a base layer, a first conductive pattern, and a first surface treatment patterned layer formed on a portion of a surface of the first conductive pattern. The first conductive pattern includes a first copper foil layer on one side of the base layer and a first conductive layer on a portion of a surface of the first copper foil layer. The first conductive pattern which is covered by the first surface treatment patterned layer has sidewalls obliquely tilted with respect to the base layer. The first conductive pattern covered with the first surface treatment patterned layer has a cross section that is trapezoidal shaped, and a width which gradually decreases from the base layer to the first conductive layer.

公开(公告)号：US09839136B2

公开(公告)日：2017-12-05

申请号：US15250595

申请日：2016-08-29

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Paul S. C. Wu ,  Chun-Ting Lai ,  Yen-Po Huang ,  Sheng-Yu Huang

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/28

CPC classification number: H05K3/007 ,  H05K3/022 ,  H05K3/281 ,  H05K2201/0154 ,  H05K2203/0264

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.

公开(公告)号：US20170347464A1

公开(公告)日：2017-11-30

申请号：US15536809

申请日：2015-12-21

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Kayo HASHIZUME ,  Yoshio OKA ,  Takashi KASUGA ,  Jinjoo PARK ,  Kousuke MIURA ,  Hiroshi UEDA

IPC: H05K3/38 ,  H05K1/09 ,  H05K1/05 ,  H05K1/03 ,  H05K1/02 ,  H05K3/24 ,  B32B15/08

CPC classification number: H05K1/092 ,  B32B15/08 ,  B32B15/088 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/05 ,  H05K1/09 ,  H05K3/1283 ,  H05K3/182 ,  H05K3/24 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2203/025 ,  H05K2203/095

Abstract: An object is to provide a substrate for a printed wiring board that has good circuit formability while maintaining adhesion strength between a conductive layer (2) and a base film (1). The substrate includes a base film having an insulating property (1) and a conductive layer (2) formed on at least one surface of the base film (1). The maximum height Sz, which is defined in ISO25178, of the surface of the base film (1) is 0.05 μm or more and less than 0.9 μm.

公开(公告)号：US20170332479A1

公开(公告)日：2017-11-16

申请号：US15499623

申请日：2017-04-27

Applicant: Titanium Falcon Inc.

Inventor： Fu LUO-LARSON

IPC: H05K1/02 ,  H05K3/02 ,  H05K1/18 ,  H05K1/03 ,  H05K1/14 ,  H05K1/09 ,  H05K3/34

CPC classification number: H05K1/028 ,  H05K1/036 ,  H05K1/09 ,  H05K1/144 ,  H05K1/148 ,  H05K1/181 ,  H05K1/189 ,  H05K3/025 ,  H05K3/3415 ,  H05K3/4691 ,  H05K2201/0154

Abstract: Disclosed is a printed circuit board (PCB) design for a multi-flex PCB system aimed at wearable devices that is capable of meeting requirements such as ultra-thin thickness profile of the board (thereby allowing 360 degree of bendability) and less manufacturing cost, as desired by consumer electronics, such as wearable motion controlled mobile gaming devices. The PCB design suggests two thickness levels for the multi-flex PCB system. The thicker parts are four-layer sections with 20 mils thickness and thinner parts are two-layer sections with 7-8 mils thickness. The ground and supply planes are only solid on the four-layer sections. Since the two-layer segments including signal paths are completely bendable, the entire rectangular board can bend as a cycle. This two thickness-level structure can be easily modified to three thickness-level structure with the third three-layer sections with 12-13 mils thickness. The three thickness-level structure is to accommodate more complicated electronics circuit design.

公开(公告)号：US20170318660A1

公开(公告)日：2017-11-02

申请号：US15381799

申请日：2016-12-16

Applicant: Deere & Company

Inventor： Thomas J. Roan ,  Andrew J. Wieland ,  Brij N. Singh

IPC: H05K1/02 ,  G01R19/00 ,  H01R4/02 ,  H05K1/18 ,  H01R4/04 ,  H05K1/11 ,  G01R15/20 ,  H05K1/03 ,  H01R4/30 ,  H01R4/18

CPC classification number: H05K1/0204 ,  G01R15/207 ,  G01R19/0092 ,  G01R31/3606 ,  H01R4/023 ,  H01R4/04 ,  H01R4/183 ,  H01R4/304 ,  H01R4/34 ,  H01R12/53 ,  H01R13/6683 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/0154 ,  H05K2201/10151 ,  H05K2201/10318

Abstract: An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. Magnetic field concentrators are spaced apart to concentrate a magnetic field in a zone. The magnetic field is associated with electric current carried by the electrical connector assembly. A flexible circuit carrier has openings to receive the magnetic field concentrators. The flexible circuit carrier comprises a flexible dielectric layer and a conductive traces. A magnetic field sensor is mounted on the flexible circuit carrier in the zone.

公开(公告)号：US09807877B1

公开(公告)日：2017-10-31

申请号：US15285593

申请日：2016-10-05

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd.

Inventor： Li-Kun Liu ,  Yan-Lu Li

IPC: H05K3/20 ,  H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/427 ,  H05K3/4611 ,  H05K3/4655 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/09218 ,  H05K2203/063 ,  Y10T29/49128

Abstract: A flexible printed circuit board with multiple layers includes an inner wiring substrate and at least one outer wiring plate. Each outer wiring plate is connected to one surface of the inner wiring substrate, and defines at least one through hole which passes through the outer wiring plate to expose the inner wiring substrate. Each outer wiring plate further includes an adhesive plate connected to the inner wiring substrate. The adhesive plate includes a stepped portion extending towards a center of the through hole.