公开(公告)号：US20120228010A1

公开(公告)日：2012-09-13

申请号：US13510770

申请日：2010-10-29

Applicant: Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

Inventor： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

IPC: H05K1/03 ,  B32B15/08 ,  B32B5/28

CPC classification number: H05K1/0373 ,  B32B5/28 ,  B32B15/14 ,  C08G59/38 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257 ,  Y10T442/20 ,  Y10T442/3455

Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

Abstract translation: 公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿 平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子， 具有2〜15μm的平均粒径（D50），含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子 ）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自基团的无机成分（B）的配合比（体积比） 勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

公开(公告)号：US20120100374A1

公开(公告)日：2012-04-26

申请号：US13335846

申请日：2011-12-22

Applicant: Alfred A. ZINN

Inventor： Alfred A. ZINN

IPC: B32B5/16 ,  B23K1/20 ,  B23K26/22 ,  B22F9/16 ,  B05D5/12 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract translation: 组合物可以具有直径为20纳米或更小并且具有小于约220℃的熔融温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

公开(公告)号：US08071882B2

公开(公告)日：2011-12-06

申请号：US11911914

申请日：2006-04-19

Applicant: Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

Inventor： Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

IPC: H05K1/03

CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/13091 ,  H05K1/0233 ,  H05K1/028 ,  H05K1/056 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/086 ,  H05K2201/09318 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it. A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 μm to 300 μm; and a hybrid circuit board employing it.

Abstract translation: 为了提供一种薄的金属基底电路板，其不仅可以安装在平坦部分上，而且可以紧密地附接到壳体的侧面或底面，或者台阶或弯曲部分，并且散热性能优异，电绝缘性能 灵活性; 一个生产过程; 和混合集成电路，LED模块和采用它的明亮，超长寿命的LED光源。 具有交替层叠绝缘层和导电电路或金属箔的金属基电路板，其特征在于，各导电电路或金属箔的厚度为5μm〜450μm，绝缘层由树脂组合物的固化物 包括无机填料和热固性树脂，并且每个绝缘层的厚度为9μm至300μm; 和采用它的混合电路板。

公开(公告)号：US07525194B2

公开(公告)日：2009-04-28

申请号：US11191566

申请日：2005-07-27

Applicant: David K. Fork ,  Thomas Hantschel ,  Michael L. Chabinyc

Inventor： David K. Fork ,  Thomas Hantschel ,  Michael L. Chabinyc

IPC: H01L23/48

CPC classification number: H05K3/32 ,  B82Y30/00 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/083 ,  H01L2924/00

Abstract: A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.

Abstract translation: 描述形成自组装互连结构的方法。 在该方法中，接触垫表面和溶液中的颗粒被聚集在一起。 颗粒被选择成使得颗粒粘附到接触垫表面。 接触的形成通过将相对的接触压入颗粒中而完成，使得经由相对的接触垫和基板表面接触垫之间的颗粒形成电连接。 所描述的自组装互连结构在显示器件制造中是特别有用的。

公开(公告)号：US07504331B2

公开(公告)日：2009-03-17

申请号：US11191436

申请日：2005-07-27

Applicant: David K. Fork ,  Thomas Hantschel ,  Michael L. Chabinyc

Inventor： David K. Fork ,  Thomas Hantschel ,  Michael L. Chabinyc

IPC: H01L21/44

CPC classification number: H05K3/32 ,  B82Y30/00 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05556 ,  H01L2224/11015 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13005 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2924/14 ,  H05K3/102 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/083 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2924/00

Abstract: A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.

Abstract translation: 描述形成自组装互连结构的方法。 在该方法中，接触垫表面和溶液中的颗粒被聚集在一起。 颗粒被选择成使得颗粒粘附到接触垫表面。 接触的形成通过将相对的接触压入颗粒中而完成，使得经由相对的接触垫和基板表面接触垫之间的颗粒形成电连接。 所描述的自组装互连结构在显示器件制造中特别有用。

公开(公告)号：US20090032295A1

公开(公告)日：2009-02-05

申请号：US11911914

申请日：2006-04-19

Applicant: Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

Inventor： Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

IPC: H05K1/00 ,  H05K1/16

CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/13091 ,  H05K1/0233 ,  H05K1/028 ,  H05K1/056 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/086 ,  H05K2201/09318 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it.A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 μm to 300 μm; and a hybrid circuit board employing it. The metal base circuit board wherein a coverlay is provided, and a layer having a magnetic loss or a layer having a dielectric loss is laminated on the surface of the coverlay. A LED light source unit having at least one light-emitting diode (LED) mounted on the conductive circuit.

Abstract translation: 为了提供一种薄的金属基底电路板，其不仅可以安装在平坦部分上，而且可以紧密地附接到壳体的侧面或底部表面，或者可以是阶梯状或弯曲部分，并且散热性能优异，电绝缘性能 灵活性; 一个生产过程; 和混合集成电路，LED模块和采用它的明亮，超长寿命的LED光源。 具有交替层叠绝缘层和导电电路或金属箔的金属基电路板，其特征在于，每个导电电路或金属箔的厚度为5μm至450μm，每个绝缘层由树脂组合物的固化产物 包括无机填料和热固性树脂，并且每个绝缘层的厚度为9μm至300μm; 和采用它的混合电路板。 提供覆盖层的金属基底电路板，具有磁损耗的层或具有介电损耗的层层叠在覆盖层的表面上。 一种LED光源单元，其具有安装在导电电路上的至少一个发光二极管（LED）。

公开(公告)号：US20080179383A1

公开(公告)日：2008-07-31

申请号：US11699046

申请日：2007-01-29

Applicant: Hitoshi Sakurai ,  Yoichi Kukimoto

Inventor： Hitoshi Sakurai ,  Yoichi Kukimoto

IPC: B23K31/02 ,  B23K35/363

CPC classification number: H05K3/3484 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H05K2201/0266 ,  Y10T428/1486

Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 μm are present 16% or more, and a sum of the particles having a particle size of below 10 μm and particles having a particle size of 10 μm or more and below 20 μm is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

Abstract translation: 一种焊料组合物，其用于通过在基板上的电极周围形成堤坝来形成焊料凸块的焊料预涂布方法，在由坝围绕的开口部内填充电极上的焊膏组合物，并加热填充的焊膏组合物，使得 焊料粘附到电极的表面。 该焊膏组合物含有焊料粉末，该焊料粉末的粒径分布为粒径小于10μm的粒子的含量为16％以上，粒径为10μm以下的粒子的总和为 10μm以上且小于20μm的粒径为90％以上。 由此，能够抑制突起缺陷的发生，通过使用该堤坝的焊料预涂法，能够以高产率形成均匀高度的焊料凸块。

公开(公告)号：US07339281B2

公开(公告)日：2008-03-04

申请号：US11139210

申请日：2005-05-26

Applicant: Ryosuke Usui ,  Hiroyuki Watanabe ,  Takeshi Nakamura

Inventor： Ryosuke Usui ,  Hiroyuki Watanabe ,  Takeshi Nakamura

IPC: H01L23/29

CPC classification number: H05K3/4655 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68377 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0035 ,  H05K3/284 ,  H05K3/421 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09509 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A circuit device which enables easy formation of a connection part that connects wiring layers to each other, and a manufacturing method thereof are provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first resin film is formed so as to cover a first wiring layer. Thereafter, a first through-hole is formed, which penetrates the first resin film and exposes the first wiring layer from a bottom thereof. Next, a second resin film is formed so as to fill up the first through-hole. Moreover, a second through-hole is formed in the second resin film buried in the first through-hole, and a connection part is formed.

Abstract translation: 提供一种能够容易地形成将布线层彼此连接的连接部的电路装置及其制造方法。 在本发明的混合集成电路器件的制造方法中，形成第一树脂膜以覆盖第一布线层。 此后，形成穿过第一树脂膜并从其底部露出第一布线层的第一通孔。 接下来，形成第二树脂膜以填充第一通孔。 此外，在埋设在第一通孔中的第二树脂膜中形成第二通孔，形成连接部。

公开(公告)号：US20070232727A1

公开(公告)日：2007-10-04

申请号：US11732253

申请日：2007-04-03

Applicant: Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

Inventor： Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

IPC: C08L63/00 ,  B32B27/38

CPC classification number: H05K3/4661 ,  B82Y30/00 ,  C08G59/621 ,  C08J5/005 ,  C08J2363/00 ,  C08L63/00 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/31511 ,  C08L2666/54

Abstract: Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.

Abstract translation: 提供在未固化状态下显示低粘度和固化状态下的低热膨胀系数的环氧组合物。 还提供了制备环氧组合物的方法。 低介电常数组合物非常适用于多层印刷电路板。 期望的性能通过在环氧组合物中使用纳米级填料的双峰分布来实现。

公开(公告)号：US07233069B2

公开(公告)日：2007-06-19

申请号：US10947177

申请日：2004-09-23

Applicant: Norihito Tsukahara ,  Kazuhiro Nishikawa ,  Daisuke Sakurai

Inventor： Norihito Tsukahara ,  Kazuhiro Nishikawa ,  Daisuke Sakurai

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H05K3/247 ,  H01L2924/0002 ,  H05K1/095 ,  H05K2201/0266 ,  H05K2201/035 ,  H01L2924/00

Abstract: An interconnection substrate includes: an interconnection layer region where at least a first conductor layer and a second conductor layer are vertically stacked in that order on a substrate, with the first conductor layer and second conductor layer containing conductive particles and a binder, wherein the first conductor layer and second conductor layer stacked in the interconnection layer region have conductive particles different in average particle size from each other. As a result, only an intended region can have low resistance.

Abstract translation: 互连基板包括：互连层区域，其中至少第一导体层和第二导体层在基板上依次垂直堆叠，第一导体层和第二导体层包含导电颗粒和粘合剂，其中第一 堆叠在互连层区域中的导体层和第二导体层具有彼此平均粒径不同的导电粒子。 结果，只有预期的区域可以具有低电阻。