公开(公告)号：US09237649B2

公开(公告)日：2016-01-12

申请号：US14285733

申请日：2014-05-23

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Hidetoshi Yugawa

IPC: H05K1/11 ,  H05K3/00 ,  H05K1/03 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2201/09854 ,  H05K2201/2054 ,  H05K2201/2072 ,  H05K2203/1476

Abstract: A wiring board 10 includes a lower wiring conductor 1, an upper insulating layer 2 laminated on the lower wiring conductor 1 and having a via hole 5 where a bottom surface is the lower wiring conductor 1, and a via conductor 3 connected to the lower wiring conductor 1 and filling the via hole 5; and the upper insulating layer 2 includes a first resin layer 2a and a second resin layer 2b sequentially laminated on the lower wiring conductor 1, the via hole 5 has an annular groove 5a over a whole circumference of the inner wall in a boundary between both resin layers 2a and 2b, and the via conductor 3 fills the groove 5.

Abstract translation: 布线基板10具有：下布线导体1，层叠在下布线导体1上的上绝缘层2，底面是下布线导体1的通路孔5;以及与下布线 导体1并填充通孔5; 并且上绝缘层2包括顺序地层叠在下布线导体1上的第一树脂层2a和第二树脂层2b，通孔5在两个树脂之间的边界内的内壁的整个圆周上具有环形槽5a 层2a和2b，通孔导体3填充槽5。

公开(公告)号：US20150382447A1

公开(公告)日：2015-12-31

申请号：US14387682

申请日：2014-07-07

Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Yu-Chun HSIAO ,  Gang YU ,  Dehua LI

IPC: H05K1/02 ,  H05K5/00

CPC classification number: H05K1/0212 ,  H05K1/0278 ,  H05K1/028 ,  H05K2201/068 ,  H05K2201/10128

Abstract: A module assembly is provided. The module assembly includes a back bezel, a heating member, and a thermal expansion member. The heating member is fixed on a first surface of the back bezel. The thermal expansion member is fixed on the heating member. The thermal expansion member has a first thermal expansion coefficient. The heating member is used to provide heat for the thermal expansion member. The thermal expansion member undergoes a first deformation based on the heat, so that the back bezel undergoes a second deformation. A display panel has a desired curved surface displaying effect on actual demands.

Abstract translation: 提供模块组件。 模块组件包括后挡板，加热构件和热膨胀构件。 加热构件固定在后挡板的第一表面上。 热膨胀构件固定在加热构件上。 热膨胀构件具有第一热膨胀系数。 加热构件用于为热膨胀构件提供热量。 热膨胀构件基于热量进行第一变形，使得后挡板经历第二变形。 显示面板具有对实际需求的期望的曲面显示效果。

公开(公告)号：US20150351231A1

公开(公告)日：2015-12-03

申请号：US14722066

申请日：2015-05-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Kwan LEE ,  Myung Sam KANG ,  Seung Yeop KOOK ,  Kwang Hee KWON ,  Seung Eun LEE ,  Ki Jung SUNG

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0271 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16111 ,  H01L2224/16237 ,  H01L2224/48237 ,  H05K1/0209 ,  H05K3/0097 ,  H05K2201/068 ,  H05K2201/09472 ,  H05K2201/10553 ,  H05K2203/0369 ,  H05K2203/1536 ,  Y10T29/49131 ,  Y10T29/49149 ,  H01L2924/014

Abstract: Disclosed herein is a circuit board in which a metal plate is provided on a surface coupled to a device, and a connection pad is exposed through an opening part of the metal plate to be electrically connected to the device. The circuit board may have the device mounted thereon and a connection terminal of the device and a connection pad of the circuit board may be connected to each other by a wire, or the like.

Abstract translation: 这里公开了一种电路板，其中金属板设置在耦合到器件的表面上，并且连接焊盘通过金属板的开口部分暴露以与该器件电连接。 电路板可以具有安装在其上的装置，并且该装置的连接端子和电路板的连接焊盘可以通过导线等相互连接。

公开(公告)号：US09155191B2

公开(公告)日：2015-10-06

申请号：US13967186

申请日：2013-08-14

Applicant: QUALCOMM Incorporated

Inventor： Chin-Kwan Kim

IPC: B32B9/00 ,  H05K1/02 ,  H05K3/46 ,  H01L23/31 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/562 ,  H01L2224/131 ,  H01L2224/16165 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/068 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y10T428/31678 ,  H01L2924/014

Abstract: Some novel features pertain to a substrate that includes a first core layer, a second core layer laterally located to the first core layer in the substrate, a first inorganic core layer (e.g., glass, silicon, ceramic) laterally positioned between the first core layer and the second core layer, the first inorganic core layer configured to be vertically aligned with a die configured to be coupled to the substrate, and a dielectric layer covering the first core layer, the second core layer and the first inorganic core layer. In some implementations, the first inorganic core layer has a first coefficient of thermal expansion (CTE), the die has a second coefficient of thermal expansion, and the first core layer has a third coefficient of thermal expansion (CTE). The first CTE of the first inorganic core layer closely matches the second CTE of the die in order to reduce the likelihood of warpage.

Abstract translation: 一些新颖特征涉及一种衬底，其包括第一芯层，横向位于衬底中的第一芯层的第二芯层，侧向位于第一芯层之间的第一无机芯层（例如，玻璃，硅，陶瓷） 和第二芯层，被配置为与被配置为耦合到基板的管芯垂直对准的第一无机芯层，以及覆盖第一芯层，第二芯层和第一无机芯层的电介质层。 在一些实施方案中，第一无机核心层具有第一热膨胀系数（CTE），所述管芯具有第二热膨胀系数，并且所述第一核心层具有第三热膨胀系数（CTE）。 第一无机芯层的第一CTE与模具的第二CTE紧密匹配，以减少翘曲的可能性。

公开(公告)号：US20150282323A1

公开(公告)日：2015-10-01

申请号：US14663921

申请日：2015-03-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi Shimizu ,  Wataru Kaneda ,  Akio Rokugawa

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/0222 ,  H05K1/0225 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/116 ,  H05K3/26 ,  H05K3/381 ,  H05K3/4673 ,  H05K3/4676 ,  H05K2201/0191 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/068 ,  H05K2201/09227 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2203/0514

Abstract: A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

Abstract translation: 布线基板包括形成在芯层的一个表面上的第一布线层，形成在芯层的一个表面上以覆盖第一布线层的第一绝缘层，嵌入第一绝缘层中的通孔布线， 第二布线层，形成在第一绝缘层的第一表面上，以及比形成在第一绝缘层的第一表面上的第一绝缘层更薄的第二绝缘层，以覆盖第二布线层。 第一布线层包括焊盘和设置在焊盘周围的平面层。 通孔布线的一个端面从第一绝缘层的第一表面露出并直接接合到第二布线层。 通孔布线的另一个端面直接接合到第一绝缘层中的焊盘。

公开(公告)号：US20150235955A1

公开(公告)日：2015-08-20

申请号：US14704096

申请日：2015-05-05

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Hiroshi Kudo ,  Takamasa Takano

IPC: H01L23/532 ,  H01L21/768 ,  H01L23/522

CPC classification number: H01L23/53238 ,  H01L21/02063 ,  H01L21/02071 ,  H01L21/02126 ,  H01L21/02274 ,  H01L21/31058 ,  H01L21/31116 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/7685 ,  H01L21/76877 ,  H01L21/76885 ,  H01L23/49822 ,  H01L23/5226 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K3/4679 ,  H05K3/4688 ,  H05K2201/068 ,  H01L2924/00

Abstract: A multi-layer line structure including a substrate, a lower layer Cu line located on the substrate, an upper layer Cu line located on an insulating layer including an inorganic film located on the lower layer Cu line and an organic resin film located on the inorganic film, and a via connection part located in a via connection hole running in an up-down direction through the insulating layer in an area where the lower layer Cu line and the upper layer Cu line overlap each other is provided. The via connection part includes a barrier conductive layer located on a part of the lower layer Cu line exposed to a bottom part of the via connection hole and on an inner wall of the via connection hole.

Abstract translation: 一种多层线结构，包括基板，位于基板上的下层Cu线，位于包含位于下层Cu线上的无机膜的绝缘层上的上层Cu线以及位于无机层上的有机树脂膜 设置有位于通过连接孔的通孔连接部，该通孔连接孔在下层Cu线和上层Cu线重叠的区域中通过绝缘层沿上下方向延伸。 通孔连接部包括位于下层Cu线的暴露于通孔连接孔的底部的部分上的阻挡导电层和通孔连接孔的内壁。

公开(公告)号：US09084354B2

公开(公告)日：2015-07-14

申请号：US13597152

申请日：2012-08-28

Applicant: Robert Fleming ,  Lex Kosowsky ,  Shurui Shang ,  Bhret Graydon ,  Xiaofeng Chen ,  Glen Irvin

Inventor： Robert Fleming ,  Lex Kosowsky ,  Shurui Shang ,  Bhret Graydon ,  Xiaofeng Chen ,  Glen Irvin

IPC: H05K3/10 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0259 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/068 ,  H05K2201/0738 ,  H05K2201/09136 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T156/10

Abstract: A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.

Abstract translation: 描述了一种用于设计符合规格的印刷电路板的方法。 第一电压可切换电介质材料与第一铜箔一起放置。 第二可电压切换电介质材料与第二铜箔一起放置。 第一铜箔的弓形部分与铝构件的第一侧相配合，粘合剂物质位于第一铜箔和铝构件的第一侧之间。 第二铜箔的弧形部分与铝构件的第二侧配合，粘合剂物质位于第二铜箔和铝构件的第二侧之间。

公开(公告)号：US20150181698A1

公开(公告)日：2015-06-25

申请号：US14579108

申请日：2014-12-22

Applicant: NIKON CORPORATION

Inventor： Ryoichi SUGANUMA ,  Hirofumi ARIMA ,  Satoru SUZUKI ,  Takuya SATO

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/05 ,  H05K1/03 ,  H01L27/146 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/1531 ,  H01L2924/16195 ,  H04N5/2253 ,  H05K1/0206 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/05 ,  H05K1/056 ,  H05K1/111 ,  H05K1/181 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/10015 ,  H05K2201/10121 ,  H01L2924/00014

Abstract: A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.

Abstract translation: 基板包括：第一绝缘层; 具有与第一绝缘层的弹性模量不同的弹性模量的第二绝缘层; 以及由第一绝缘层和第二绝缘层夹持的芯层，并且比第一绝缘层和第二绝缘层更刚性。

公开(公告)号：US09048229B2

公开(公告)日：2015-06-02

申请号：US14277226

申请日：2014-05-14

Applicant: IBIDEN CO., LTD.

Inventor： Naoto Ishida ,  Takema Adachi

IPC: H01L23/495 ,  H05K1/02 ,  H01L23/498 ,  H05K3/46

CPC classification number: H01L23/49544 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/0298 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/068

Abstract: A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup layer laminated on first surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the first buildup layer, and a second buildup layer laminated on second surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the second buildup layer. The outermost interlayer resin insulation layer of the first buildup layer has thermal expansion coefficient which is set lower than thermal expansion coefficient of the outermost interlayer resin insulation layer of the second buildup layer.

Abstract translation: 印刷电路板包括芯基板，容纳在基板中的电子部件，层叠在基板的第一表面上的第一累积层，并且包括最外层间树脂绝缘层和最外层导体层，最外层导体层形成在最外层的层间树脂绝缘层上 第一累积层和层叠在基板的第二表面上的第二堆积层，并且包括形成在第二堆积层的最外层间树脂绝缘层上的最外层间树脂绝缘层和最外导电层。 第一堆积层的最外层间树脂绝缘层的热膨胀系数设定为低于第二堆积层的最外层间树脂绝缘层的热膨胀系数。

公开(公告)号：US20150118391A1

公开(公告)日：2015-04-30

申请号：US14522758

申请日：2014-10-24

Applicant: Rogers Corporation

Inventor： Brett W. Kilhenny

IPC: H05K1/02 ,  F21V29/00 ,  H05K3/30 ,  H05K3/06 ,  H05K3/38 ,  H05K3/44 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0206 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49827 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0271 ,  H05K1/053 ,  H05K1/18 ,  H05K3/064 ,  H05K3/30 ,  H05K3/382 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2203/0502 ,  H05K2203/0723 ,  Y10T29/49169 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A thermal management circuit material comprises a thermally conductive metallic core substrate, metal oxide dielectric layers on both sides of the metallic core substrate, electrically conductive metal layers on the metal oxide metal oxide dielectric layers, and at least one through-hole via filled with an electrically conductive metal-containing core element connecting at least a portion of each of the electrically conductive metal layers, wherein the containing walls of the through-hole via are covered by a metal oxide dielectric layer connecting at least a portion of the metal oxide dielectric layers on opposite sides of the metallic core substrate. Also disclosed are methods of making such circuit materials, comprising forming metal oxide dielectric layers by oxidative conversion of a surface portion of the metallic core substrate. Articles having a heat-generating electronic device such as an HBLED mounted in the circuit material are also disclosed.

Abstract translation: 热管理电路材料包括导热金属芯基板，金属芯基板的两侧上的金属氧化物电介质层，金属氧化物金属氧化物电介质层上的导电金属层，以及至少一个填充有 连接每个导电金属层的至少一部分的导电含金属芯元件，其中通孔通孔的容纳壁被金属氧化物介电层覆盖，金属氧化物电介质层连接至少一部分金属氧化物介电层 在金属芯基板的相对两侧。 还公开了制造这种电路材料的方法，包括通过金属芯基板的表面部分的氧化转化形成金属氧化物介电层。 还公开了具有安装在电路材料中的诸如HBLED之类的发热电子器件的制品。