公开(公告)号：US07059042B2

公开(公告)日：2006-06-13

申请号：US10998277

申请日：2004-11-24

Applicant: Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Yoshihisa Yamashita

Inventor： Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Yoshihisa Yamashita

IPC: H05K3/30 ,  H05K7/02 ,  H01L2/44

CPC classification number: H05K7/205 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/4084 ,  H05K7/20463 ,  H05K2201/0209 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2203/1189 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.

Abstract translation: 一种片状导热性树脂组合物，其含有70〜95重量％ ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。

公开(公告)号：US20060104034A1

公开(公告)日：2006-05-18

申请号：US11086302

申请日：2005-03-23

Applicant: Kuo-ying Tsai ,  Shih-Chang Ku

Inventor： Kuo-ying Tsai ,  Shih-Chang Ku

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10734 ,  H01L2224/0401

Abstract: A heat-dissipating device has multiple conduction paths, and is especially adapted to a package with MPMs (Multiple Packaging Modules). The package is mounted on one side of a PCB. The heat-dissipating device has a first heat-dissipating unit, a second heat-dissipating unit, and a thermal bridge unit. The first heat-dissipating unit is contacted with a first heat source of the package element. The second heat-dissipating unit penetrates through the PCB and contacts with a second heat source of the package element. The thermal bridge unit penetrates through the PCB and connects the first heat-dissipating unit and the second heat-dissipating unit.

Abstract translation: 散热装置具有多个传导路径，特别适用于具有MPM（多封装模块）的封装。 封装安装在PCB的一侧。 散热装置具有第一散热单元，第二散热单元和热桥单元。 第一散热单元与封装元件的第一热源接触。 第二散热单元穿过PCB并与封装元件的第二热源接触。 热桥单元穿过PCB并连接第一散热单元和第二散热单元。

公开(公告)号：US06917523B2

公开(公告)日：2005-07-12

申请号：US10850136

申请日：2004-05-19

Applicant: Mark D. Summers ,  Javier Leija

Inventor： Mark D. Summers ,  Javier Leija

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K7/20436 ,  H05K1/0204 ,  H05K2201/09054 ,  H05K2203/1572 ,  Y10T29/4935

Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

Abstract translation: 底部散热装置可附接到印刷电路板（PCB）的底表面。 底部散热装置的顶表面可以与安装在PCB的底表面上的一个或多个电子部件的背面热耦合。 顶部散热装置可附接到PCB的顶表面。 顶部散热装置可以通过导热联接构件与底部散热装置热耦合，以提供用于从底部散热装置到顶部散热装置的热传递的导电路径。 与导热联接构件的边缘相邻的开口可以允许空气在顶部和底部散热装置之间流动。 PCB可以是夹层卡的一部分，例如外围组件互连（PCI）夹层卡（PMC）。

公开(公告)号：US20040233640A1

公开(公告)日：2004-11-25

申请号：US10880461

申请日：2004-07-01

Inventor： Toru Itabashi ,  Akinobu Makino

IPC: H05K007/20

CPC classification number: H05K7/20854 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/181 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/429 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/09054 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/10409 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.

公开(公告)号：US20040212953A1

公开(公告)日：2004-10-28

申请号：US10850136

申请日：2004-05-19

Inventor： Mark D. Summers ,  Javier Leija

IPC: H02B001/00

CPC classification number: H05K7/20436 ,  H05K1/0204 ,  H05K2201/09054 ,  H05K2203/1572 ,  Y10T29/4935

Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

公开(公告)号：US20040040327A1

公开(公告)日：2004-03-04

申请号：US10399749

申请日：2003-04-22

Inventor： Masakazu Iida ,  Shinji Ehira

IPC: F28F007/00 ,  F25D023/12 ,  H05K007/20

CPC classification number: H05K1/141 ,  F28F2275/14 ,  H01L23/367 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/3421 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/1034 ,  H05K2201/2018 ,  H01L2924/00

Abstract: An efficient heat diffusing structure comprising a power module having a mounting substrate that has a high thermal conduction efficiency. The mounting substrate is comprised of a mounting surface on which an electric power circuit for controlling electric power is mounted, and a heat dissipating surface that has a corrugated section formed thereon that serves to dissipate heat. This heat diffusing structure allows the size of the device to be reduced, and also allows costs to be reduced.

Abstract translation: 一种高效的散热结构，包括具有高导热效率的安装基板的功率模块。 安装基板包括安装表面，安装有用于控制电力的电力电路，以及散热表面，其在其上形成有用于散热的波纹部分。 这种热扩散结构允许减小装置的尺寸，并且还可以降低成本。

公开(公告)号：US20030184969A1

公开(公告)日：2003-10-02

申请号：US10393258

申请日：2003-03-21

Inventor： Toru Itabashi ,  Akinobu Makino

IPC: H05K007/20

CPC classification number: H05K7/20854 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/181 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/429 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/09054 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/10409 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.

Abstract translation: 具有高散热能力的电子控制装置包括固定到外壳的印刷电路板，并且通过穿过印刷电路板的螺钉插入在壳体和盖板之间。 由铜箔制成的导热性薄膜层平行地形成在印刷电路板的安装面和相对的安装面上以及印刷基板的内部，从而彼此热分离。 突起设置在盖上，并突出超过盖的底部朝向安装电子部件的位置。 将柔性半固体导热材料放置在突起的端面和印刷电路板的相对的安装面之间，对应于安装电子部件的位置与端面和相对的安装面相接触 。

公开(公告)号：US06560121B1

公开(公告)日：2003-05-06

申请号：US09554595

申请日：2000-05-26

Applicant: Jean-Yves Daden ,  Muriel Gohn-Devineau ,  Gérard Cachier ,  Pascal Etourneau ,  Vincent Jahier ,  Alain Grancher ,  Ludovic Michel

Inventor： Jean-Yves Daden ,  Muriel Gohn-Devineau ,  Gérard Cachier ,  Pascal Etourneau ,  Vincent Jahier ,  Alain Grancher ,  Ludovic Michel

IPC: H05K702

CPC classification number: H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6644 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/12041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K3/0061 ,  H05K3/3442 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K2201/09745 ,  H05K2201/10666 ,  H05K2201/10727 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The surface mounting of a backset microwave package on a printed circuit. After the package has been accurately positioned against the printed circuit the connections are produced by soldering the conducting elements in direct contact. A chip is enclosed in a sort of cage constituting a screen which replaces a conventional cover, the cage is formed by layouts borne respectively by the package and the printed circuit and is linked together by metal links. The surface mounting is particularly applicable to packages operating in millimetric microwaves.

Abstract translation: 背板微波封装在印刷电路上的表面安装。 在封装已经精确地定位在印刷电路上之后，通过直接接触导电元件来焊接连接。 芯片被封装在构成屏幕的笼子中，其替代传统的盖子，保持架由分别由包装和印刷电路承载的布局形成，并通过金属连接件连接在一起。 表面安装特别适用于以毫米微波工作的封装。

公开(公告)号：US06519152B1

公开(公告)日：2003-02-11

申请号：US09720835

申请日：2001-03-06

Applicant: Johansson Birger

Inventor： Johansson Birger

IPC: H05K720

CPC classification number: H05K7/205 ,  B65H51/22 ,  B65H54/70 ,  B65H2301/5305 ,  B65H2701/31 ,  H05K1/0204 ,  H05K7/20509 ,  H05K2201/09054 ,  H05K2201/10166

Abstract: A yarn processing system, e.g. a yarn feeder comprising a housing in which at least one semiconductor component is arranged on a printed circuit board. The semiconductor component lies on a heat conducting body which is in the form of at least one prolongation of the housing that extends through the printed circuit board up to the semiconductor component.

Abstract translation: 纱线处理系统，例如 一种喂纱器，其包括壳体，其中至少一个半导体部件布置在印刷电路板上。 半导体部件位于导热体上，该导热体呈壳体的至少一个延伸的形式延伸穿过印刷电路板直到半导体部件。

公开(公告)号：US20020112632A1

公开(公告)日：2002-08-22

申请号：US09789905

申请日：2001-02-21

Applicant: CREO LTD

Inventor： Aurel Faibish

IPC: B23Q007/00

CPC classification number: H01L21/6875 ,  H01L21/68778 ,  H05K1/0393 ,  H05K3/007 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2201/09054 ,  H05K2203/0152 ,  H05K2203/0156

Abstract: A method of supporting an object having an even contact surface during manufacturing operations, by urging it to a rigid substrate, the contact surface facing a supporting surface of said substrate, for use in an environment containing particles that are likely to be entrapped between the object and the substrate. The method includes provision of a supporting surface in the form of a plurality of bulges disposed on the substrate with depressions therebetween. The bulges have crests with rounded profile enabling the entrapped particles to fall into the depressions, thereby reducing the probability of causing mechanical damage to the object and/or of a faulty manufacturing operation on the object.

Abstract translation: 一种在制造操作期间支撑具有均匀接触表面的物体的方法，通过将其施加到刚性基底上，所述接触表面面向所述基底的支撑表面，用于包含可能被夹在物体之间的颗粒的环境中 和基板。 该方法包括设置在多个凸起形式的支撑表面，所述多个凸起设置在基板上，其间具有凹陷。 凸起具有圆形轮廓的波峰，使得捕获的颗粒落入凹陷中，从而减少对物体造成机械损伤和/或对物体造成错误的制造操作的可能性。