公开(公告)号：US09927833B2

公开(公告)日：2018-03-27

申请号：US14907117

申请日：2013-07-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： John Norton

IPC: G06F1/16 ,  H05K1/18 ,  H05K3/30 ,  H05K3/10 ,  H05K3/40

CPC classification number: G06F1/16 ,  H05K1/18 ,  H05K3/103 ,  H05K3/30 ,  H05K3/4046 ,  H05K2201/09063 ,  H05K2201/10287 ,  H05K2201/10719 ,  H05K2201/10962

Abstract: A printed circuit board (PCB) can include a central processing unit (CPU) installed on a first surface of the PCB. The PCB can also include a cable routed on a second surface of the PCB parallel to the first surface. The PCB can further include a hole extending through a thickness of the PCB to connect the first surface and the second surface. The cable can extend through the hole to be coupled to the CPU.

公开(公告)号：US20180068777A1

公开(公告)日：2018-03-08

申请号：US15811317

申请日：2017-11-13

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Chiao-Cheng Chang ,  Yi-Nong Lin

IPC: H01F27/28 ,  H05K3/46 ,  H05K1/16 ,  H05K1/00 ,  H01F41/04 ,  H05K3/00

CPC classification number: H01F27/2804 ,  H01F41/041 ,  H01F2027/2809 ,  H05K1/00 ,  H05K1/165 ,  H05K3/00 ,  H05K3/4635 ,  H05K2201/09063

Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.

公开(公告)号：US09911591B2

公开(公告)日：2018-03-06

申请号：US15142497

申请日：2016-04-29

Applicant: Applied Materials, Inc.

Inventor： David Thompson ,  Mark Saly ,  Bhaskar Jyoti Bhuyan

IPC: H01L21/336 ,  H01L21/02 ,  C23C16/455 ,  C23C16/04 ,  C23C16/50 ,  H01L21/311 ,  H01L21/67 ,  C07F7/00 ,  H01L21/3105 ,  H01L21/32

CPC classification number: H05K1/0296 ,  C07F7/00 ,  C23C16/04 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/50 ,  G03G15/50 ,  G03G15/80 ,  G03G21/1652 ,  H01L21/0217 ,  H01L21/02211 ,  H01L21/0228 ,  H01L21/02307 ,  H01L21/3105 ,  H01L21/31133 ,  H01L21/32 ,  H01L21/67207 ,  H05K1/0269 ,  H05K1/117 ,  H05K3/4015 ,  H05K3/403 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/10287 ,  H05K2201/10363

Abstract: Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface. Methods include soaking a substrate surface comprising hydroxyl-terminations with a silylamine to form silyl ether-terminations and depositing a film onto a surface other than the silyl ether-terminated surface.

公开(公告)号：US20180049317A1

公开(公告)日：2018-02-15

申请号：US15792355

申请日：2017-10-24

Applicant: CANON KABUSHIKI KAISHA

Inventor： Shinsuke Serizawa

IPC: H05K1/02 ,  H05K1/11 ,  G03G21/16 ,  H05K3/40 ,  G03G15/00

CPC classification number: H05K1/0296 ,  G03G15/50 ,  G03G15/80 ,  G03G21/1652 ,  H05K1/0269 ,  H05K1/117 ,  H05K3/4015 ,  H05K3/403 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/10287 ,  H05K2201/10363

Abstract: The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

公开(公告)号：US20180042120A1

公开(公告)日：2018-02-08

申请号：US15788328

申请日：2017-10-19

Applicant: GiMer Medical Co., Ltd.

Inventor： Chi-Heng CHANG ,  Chan-Yi CHENG ,  Chen-Tun WU

IPC: H05K3/28 ,  A61B5/00 ,  A61N1/36 ,  A61N1/362 ,  H05K1/03 ,  H05K3/00 ,  A61N1/375 ,  A61B5/145

CPC classification number: H05K3/285 ,  A61B5/14503 ,  A61B5/14532 ,  A61B5/686 ,  A61B2503/40 ,  A61B2562/12 ,  A61B2562/18 ,  A61N1/3605 ,  A61N1/362 ,  A61N1/375 ,  H05K1/0326 ,  H05K3/0011 ,  H05K3/28 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/09063 ,  H05K2203/1327 ,  H05K2203/1338 ,  H05K2203/1377

Abstract: A waterproof structure for an implanted electronic device is capable of preventing the liquid or moist from entering and damaging the circuit board of the electronic device. The waterproof structure includes a shell, a first material layer, a second material layer, and a third material layer. The first material layer covers at least a part of the implanted electronic device. The second material layer covers the first material layer. The internal space of the shell is configured for accommodating the implanted electronic device. The shell is made of PEEK (polyether ether ketone). The third material layer is disposed between the second material layer and the shell.

公开(公告)号：US09875834B2

公开(公告)日：2018-01-23

申请号：US15184626

申请日：2016-06-16

Applicant: Sensata Technologies, Inc.

Inventor： Janselme M. Eral ,  Richard R. Guerrero

IPC: H01F7/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01F7/0205 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/111 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09063 ,  Y02P70/611

Abstract: A flexible printed circuit may include a flexible body portion and a flexible head end portion, where conductors and/or elongated cut outs may be formed in a pattern. The flexible body may include a proximal end and a distal end, wherein the proximal end is configured to be connected to a stationary object and the distal end is configured to be connected to a moving object that moves in relation to the stationary object. The head end of the flexible printed circuit may be located at the distal end of the flexible body. The head end may include a plurality of elongated cut-outs, and/or a plurality of electrical connection pads suspended from the flexible body by the plurality of elongated cutouts.

公开(公告)号：US09874335B2

公开(公告)日：2018-01-23

申请号：US14091755

申请日：2013-11-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Kwon Hong ,  Hyun Gyu Park ,  In Hee Cho ,  Hyuk Soo Lee

IPC: F21V19/00 ,  H05K1/02 ,  H05K3/00 ,  G02F1/1335

CPC classification number: F21V19/003 ,  G02F2001/133612 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/0061 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2203/302

Abstract: Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring.

公开(公告)号：US09872626B2

公开(公告)日：2018-01-23

申请号：US14934783

申请日：2015-11-06

Applicant: Welch Allyn, Inc.

Inventor： Paul Delucia ,  Alan S. Knieriem ,  David M. Babson ,  David M. Fallat

IPC: A61B5/022 ,  A61B5/021 ,  H05K1/02 ,  A61B5/0205 ,  A61B5/00 ,  H02J1/00 ,  H02J7/00 ,  G02F1/1333 ,  H05K1/18 ,  A61B5/0235 ,  A61B50/13

CPC classification number: A61B5/02233 ,  A61B5/002 ,  A61B5/02055 ,  A61B5/02141 ,  A61B5/0235 ,  A61B5/7405 ,  A61B5/742 ,  A61B50/13 ,  A61B2560/0204 ,  A61B2562/12 ,  A61B2562/166 ,  G02F1/133308 ,  G02F2001/13332 ,  G02F2001/133325 ,  H02J1/00 ,  H02J7/0054 ,  H05K1/0216 ,  H05K1/0296 ,  H05K1/183 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/1003

Abstract: A printed circuit board assembly includes a printed circuit board and a ferrite. The printed circuit board has a substantially planar top surface and a substantially planar bottom surface. The ferrite has an annular cross section that defines a channel. The ferrite is positioned on the printed circuit board such that a portion of the plurality of traces passes through the channel.

公开(公告)号：US09859193B2

公开(公告)日：2018-01-02

申请号：US15600793

申请日：2017-05-22

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu ,  Wei-Jen Lai

IPC: H01L23/495 ,  H01L23/60

CPC classification number: H01L23/49503 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/053 ,  H01L23/481 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/60 ,  H01L24/17 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/186 ,  H01L2924/19105 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.

公开(公告)号：US20170367172A1

公开(公告)日：2017-12-21

申请号：US15535293

申请日：2015-12-14

Applicant: Seow Yuen YEE ,  Gary YAMA ,  Bongsang KIM ,  Ashwin SAMARAO ,  Robert Bosch GmbH

Inventor： Seow Yuen Yee ,  Gary Yama ,  Bongsang Kim ,  Ashwin Samarao

IPC: H05K1/02 ,  A61B5/11 ,  A61B5/00 ,  A61B5/01 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K1/03 ,  H05K1/11 ,  H05K3/12

CPC classification number: H05K1/028 ,  A61B5/0022 ,  A61B5/01 ,  A61B5/11 ,  A61B5/4519 ,  A61B5/4528 ,  A61B5/4542 ,  A61B5/6833 ,  A61B2560/0242 ,  A61B2560/0412 ,  A61B2562/0204 ,  A61B2562/0247 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/029 ,  A61B2562/066 ,  A61B2562/12 ,  A61B2562/164 ,  H01L2924/0002 ,  H05K1/0278 ,  H05K1/0281 ,  H05K1/0393 ,  H05K1/118 ,  H05K1/148 ,  H05K1/189 ,  H05K3/005 ,  H05K3/0052 ,  H05K3/0058 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/281 ,  H05K3/285 ,  H05K3/30 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/10037 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/1453 ,  H05K2203/1545 ,  H01L2924/0001

Abstract: A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.