公开(公告)号：US20080275527A1

公开(公告)日：2008-11-06

申请号：US11924696

申请日：2007-10-26

Applicant: Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

Inventor： Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

IPC: A61N1/00

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/37223 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302 ,  Y10T29/49158

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.

Abstract translation: 聚合物材料可用作用于神经刺激的电极阵列体。 它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 通过将适量的热应用于完整的阵列，可以引起曲线。 对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。 此外，沿着边缘添加材料是有利的。 在柔性电路阵列中提供折叠或扭曲是更有利的。 可以在折叠内部和外部添加附加材料以促进与组织的良好密封。

公开(公告)号：US20080250435A1

公开(公告)日：2008-10-09

申请号：US12073713

申请日：2008-03-07

Applicant: Pyo Kim ,  Young-Sun Yoo ,  Dong-Woo Rhee ,  Sang-Kyu Lee

Inventor： Pyo Kim ,  Young-Sun Yoo ,  Dong-Woo Rhee ,  Sang-Kyu Lee

IPC: G11B17/03

CPC classification number: G11B33/12 ,  G11B33/123 ,  H05K1/0215 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/3442 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/10151 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2203/167

Abstract: An optical disk apparatus is disclosed which includes a first printed circuit board, on which a first circuit pattern is formed; a rotor, on which an optical disk may be placed, and which is electrically connected with the first circuit pattern; a second printed circuit board, which is stacked adjacent to the rotor on a surface of the first printed circuit board, and on which a second circuit pattern is formed; a sensor unit, which is mounted on the second printed circuit board in electrical connection with the second circuit pattern, and which is configured to sense a rotation of the optical disk; and a support plate, which supports the first printed circuit board and the rotor. In this optical disk apparatus, a separate printed circuit board can be utilized to support the sensor unit, whereby manufacturing costs can be reduced and working efficiency can be improved.

Abstract translation: 公开了一种光盘装置，其包括形成有第一电路图案的第一印刷电路板; 转子，其上可以放置光盘，并且与第一电路图案电连接; 第二印刷电路板，其在所述第一印刷电路板的表面上与所述转子相邻地堆叠，并且其上形成有第二电路图案; 传感器单元，其安装在与第二电路图案电连接的第二印刷电路板上，并且被配置为感测光盘的旋转; 以及支撑第一印刷电路板和转子的支撑板。 在该光盘装置中，可以使用单独的印刷电路板来支撑传感器单元，由此可以降低制造成本并且可以提高工作效率。

公开(公告)号：US20080153352A1

公开(公告)日：2008-06-26

申请号：US12041185

申请日：2008-03-03

Applicant: Dan Harkabi ,  Gidon Elazar ,  Nehemiah Weingarten

Inventor： Dan Harkabi ,  Gidon Elazar ,  Nehemiah Weingarten

IPC: H01R13/648

CPC classification number: H01R27/00 ,  H01R12/721 ,  H01R13/6315 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/117 ,  H05K2201/09145 ,  H05K2203/1572 ,  H05K2203/168

Abstract: An electrical connector, for example a connector that will operate with the Universal Serial Bus, is disclosed. In some embodiments, the connector includes none, one, or several tongue board, tongue tip, electrical contact, housing shell, insulating strip on the inner lining of housing shell, protective edge. A connector integral to a printed circuit board is also disclosed. Other embodiments are disclosed.

Abstract translation: 公开了一种电连接器，例如将使用通用串行总线进行操作的连接器。 在一些实施例中，连接器包括没有，一个或多个舌板，舌尖，电接触，壳体壳，壳体壳体内衬上的绝缘条，保护边缘。 还公开了与印刷电路板集成的连接器。 公开了其他实施例。

公开(公告)号：US07297875B2

公开(公告)日：2007-11-20

申请号：US10833711

申请日：2004-04-27

Applicant: Philip J. Lauriello

Inventor： Philip J. Lauriello

IPC: H05K1/03

CPC classification number: H05K3/4092 ,  H05K3/328 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/1034 ,  Y10T29/49126

Abstract: A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers are then fusion bonded to each other such that the plurality of substrate layers form signal processing modules with leads that extend from an interior of the modules into the gap areas. The individual modules may then be separated by milling the substrate layers to de-panel the modules.

Abstract translation: 信号处理模块可以由多个复合衬底层制造，每个衬底层包括多个单独的处理模块的元件。 当衬底层以堆叠布置融合时，这些层的表面被选择性地金属化以形成信号处理元件。 在接合之前，将衬底层研磨以形成位于处理模块之间的区域的间隙。 在接合之前，引线定位成使得它们从所述金属化表面上的信号耦合点延伸到间隙区域中。 然后将衬底层彼此熔合，使得多个衬底层形成具有从模块内部延伸到间隙区域中的引线的信号处理模块。 然后可以通过研磨衬底层来分离各个模块以使模块脱模。

公开(公告)号：US20070230142A1

公开(公告)日：2007-10-04

申请号：US11618386

申请日：2006-12-29

Applicant: John B. Engel ,  Clevan B. Nelson

Inventor： John B. Engel ,  Clevan B. Nelson

IPC: H05K7/02

CPC classification number: H05K3/3405 ,  H05K3/306 ,  H05K3/3447 ,  H05K7/1417 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10287 ,  H05K2201/10863

Abstract: There is disclosed a base member for holding, without screws, a printed circuit board having conductive traces and electronic components and which can fit into an electric outlet box. The base member has walls which define a cavity where at least one wall of the cavity has a rib, the top of which functions as a stop for the printed circuit board. A cap having snap features adapted to engage the walls of the cavity restricts removal of the printed circuit board when snapped into position on top of the printed circuit board. The cap conceals the electronics on the printed circuit board and has at least one rib on its bottom surface to apply pressure to the printed circuit board assembly to help hold it in place. An aperture in the cap provides access to a pin header which is electrically connected to the printed circuit board. A screw terminal block is provided to connect the terminals on the pin header to a sensor. The printed circuit board has one edge an open side hour glass shape aperture which provides strain relief for wires from the printed circuit board. Opposite ends of the aperture hold two wires captive and the space between the two wires holds captive a third wire.

Abstract translation: 公开了一种用于不用螺丝固定具有导电迹线和电子部件的印刷电路板并且可以装配到电源插座盒中的基座部件。 基座部件具有限定空腔的壁，其中空腔的至少一个壁具有肋，其顶部用作印刷电路板的止动件。 具有适于接合空腔壁的卡扣特征的盖限制当卡在印刷电路板顶部的位置时移除印刷电路板。 盖子掩盖印刷电路板上的电子元件，并且在其底表面上具有至少一个肋条，以向印刷电路板组件施加压力以帮助将其固定到位。 盖中的孔提供对电连接到印刷电路板的引脚的访问。 提供螺丝端子块以将引脚上的端子连接到传感器。 印刷电路板具有一个边缘，具有开口侧玻璃形状的孔，其对印刷电路板的电线提供应变消除。 光圈的相对端保持两根电线，并且两条电线之间的空间固定在第三条电线上。

公开(公告)号：US07247032B2

公开(公告)日：2007-07-24

申请号：US10688872

申请日：2003-10-17

Applicant: Nicholas G. L. Merz

Inventor： Nicholas G. L. Merz

IPC: H01R12/00

CPC classification number: H01R27/00 ,  H01R12/721 ,  H01R13/659 ,  H01R13/6658 ,  H01R27/02 ,  H05K1/117 ,  H05K2201/09145 ,  H05K2201/10325

Abstract: An electronic device having one or more integral connectors is disclosed. The connector includes an electromagnetically-shielded cavity defined by an outer shell integrally formed in the housing and having a cross-sectional profile of a plug to which the connector may mate. The connector also includes a tongue integrally formed in and extending from a component (such as a printed circuit board) of the electronic device and protruding into the cavity. The tongue may have one or more electrical contacts on one or both sides. The connector may also include one or more snap features for retaining a mated plug at a predetermined force. The connectors may conform to one or more connector standards, such as the Universal Serial Bus (USB) standard and/or the IEEE 1394 (FireWire®) standard. Devices incorporating such integral connectors may be smaller and manufactured less expensively than devices having conventional, non-integral, connectors.

Abstract translation: 公开了一种具有一个或多个整体连接器的电子设备。 该连接器包括由外壳整体形成并具有连接器可配合的插头的横截面轮廓限定的电磁屏蔽空腔。 连接器还包括一体地形成在电子设备的部件（例如印刷电路板）中并从电子设备的部件（例如印刷电路板）延伸并突出到空腔中的舌片。 舌头可以在一侧或两侧具有一个或多个电触点。 连接器还可以包括用于以预定的力保持配合的塞子的一个或多个卡扣特征。 连接器可以符合一个或多个连接器标准，例如通用串行总线（USB）标准和/或IEEE 1394（FireWire）标准）。 结合这种整体连接器的装置可以比具有传统的非整体连接器的装置更小并且制造成本更低。

公开(公告)号：US20070137886A1

公开(公告)日：2007-06-21

申请号：US11306266

申请日：2005-12-21

Applicant: Chen-Hsiang Yen

Inventor： Chen-Hsiang Yen

IPC: H05K1/00

CPC classification number: H05K3/0052 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2203/0228 ,  H05K2203/167

Abstract: The present invention relates to a method for partial replacement of a circuit board, comprising: providing a first carrier board and a replaced board which has a second circuit board and a plurality of linkage arm which keeps the second circuit board at the replaced board; cutting a lifted board from the first carrier board to make a void part at the first carrier board; and combining the replaced board with the first carrier board at the void part. Base on the present invention said above, if the first carrier board related to the present invention has more first circuit boards, the method of the present invention still works and each first circuit board can be replaced with a second circuit board of the replaced board to make the first carrier board complete.

Abstract translation: 本发明涉及一种部分更换电路板的方法，包括：提供第一载板和替换的板，其具有第二电路板和将第二电路板保持在更换的板上的多个连杆臂; 从第一承载板切割提升的板，以在第一承载板处形成空隙部分; 以及将替换的板与第一载板组合在空隙部分。 基于上述本发明，如果与本发明相关的第一载板具有更多的第一电路板，则本发明的方法仍然可以工作，并且每个第一电路板可以被更换的板的第二电路板替换为 使第一个载板完成。

公开(公告)号：US07231701B1

公开(公告)日：2007-06-19

申请号：US11326476

申请日：2006-01-06

Applicant: Ho-Ching Yang

Inventor： Ho-Ching Yang

IPC: B23P6/00

CPC classification number: H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/4973 ,  Y10T29/49732 ,  Y10T29/49734 ,  Y10T29/49735 ,  Y10T29/49737

Abstract: Modular PCB and method of replacing one of a plurality of modules of a first PCB are provided. One embodiment of the method includes checking each module of the first PCB and each of a plurality of modules of a second PCB, cutting a malfunctioned module from the first PCB to leave a rectangular vacant area if the malfunctioned module is found, forming a plurality of indents on each side of the vacant area, cutting a good module from the second PCB if the good module is found, forming a plurality of projections on each side of the good module, placing the good module in the vacant area for coupling the indents and the projections, and applying adhesive (e.g., resin) into the coupled indents and projections for fastening the good module in the vacant area.

Abstract translation: 提供了模块化PCB和替换第一PCB的多个模块中的一个的方法。 该方法的一个实施例包括检查第一PCB的每个模块和第二PCB的多个模块中的每个模块，如果发现故障模块，则从第一PCB切割故障模块以留下矩形空白区域，形成多个 如果发现好的模块，则在第二PCB上切割好模块，在良好模块的每一侧形成多个突起，将好的模块放置在空的区域中以连接凹口和 突起，并将粘合剂（例如，树脂）施加到联接的凹口和突起中，以将良好模块紧固在空闲区域中。

公开(公告)号：US20070128928A1

公开(公告)日：2007-06-07

申请号：US11564966

申请日：2006-11-30

Applicant: Chin-Wei HO

Inventor： Chin-Wei HO

IPC: H01R13/60

CPC classification number: H05K3/0052 ,  H05K3/225 ,  H05K2201/09145 ,  H05K2203/0169 ,  H05K2203/167

Abstract: An alignment structure of individual printed circuit board and method thereof are disclosed. The alignment structure of individual printed circuit board includes a panel body and an assembling part. An aligned part having a geometric feature is disposed on an inner side of the panel body. The assembling part coupled with an individual printed circuit board is similar to the geometric feature of the aligned part so that the individual printed circuit board is combined with the panel body.

Abstract translation: 公开了各个印刷电路板的对准结构及其方法。 单个印刷电路板的对准结构包括面板本体和组装部件。 具有几何特征的对准部分设置在面板主体的内侧。 与单独的印刷电路板耦合的组装部分类似于对准部分的几何特征，使得单独的印刷电路板与面板主体组合。

公开(公告)号：US20070111556A1

公开(公告)日：2007-05-17

申请号：US11598923

申请日：2006-11-13

Applicant: An Shih ,  Cheng-Liang Hsiao

Inventor： An Shih ,  Cheng-Liang Hsiao

IPC: H01R12/00

CPC classification number: H01R13/6275 ,  H01R12/722 ,  H01R12/73 ,  H05K1/117 ,  H05K2201/09145 ,  H05K2201/10189 ,  Y10S439/951

Abstract: An exemplary circuit board (21) includes an indention portion at a side of the circuit board, and a plug slot (251). The indention portion includes a bottom wall (211) and a side wall (212), and the side wall located between the bottom wall and an end of the circuit board at the side of the circuit board. The plug slot is attached at the bottom wall and is adjacent the side wall. Spacing between the side wall and the plug slot at the bottom wall is less than spacing between the side wall and the plug slot at the end of the circuit board.

Abstract translation: 示例性电路板（21）包括在电路板一侧的缩进部分和插头插槽（251）。 该缩进部分包括底壁（211）和侧壁（212），并且侧壁位于电路板侧面的底壁和电路板的端部之间。 插头插槽连接在底壁并且靠近侧壁。 侧壁和底壁之间的插头槽之间的间距小于电路板端部侧壁和插头槽之间的间距。