公开(公告)号：US08941013B2

公开(公告)日：2015-01-27

申请号：US13598503

申请日：2012-08-29

Applicant: Shawn X. Arnold

Inventor： Shawn X. Arnold

IPC: H01R13/62 ,  H05K1/16

CPC classification number: H01R12/714 ,  H01R12/732 ,  H05K1/117 ,  H05K1/142 ,  H05K3/365 ,  H05K2201/0311 ,  H05K2201/09163 ,  H05K2201/1034 ,  H05K2201/1059 ,  Y10T156/10 ,  Y10T156/1052

Abstract: A spring finger interconnection system can include a plug and a receptacle. In one embodiment, the plug can include spring finger contacts configured to carry electrical signals. The receptacle can include a cavity to receive the plug and the cavity can be constructed with printed circuit board fabrication techniques. In one embodiment, the cavity can be formed, at least in part, in a pre-impregnation layer and a first and a second layer can be disposed above and below the pre-impregnation layer to further form the cavity. In one embodiment, contacts can be arranged on the first layer to contact the spring fingers when the plug is inserted into the cavity. In another embodiment, contacts can be arranged on both the first and the second layers. In yet another embodiment, the cavity can be shaped to aid in contact-to-spring finger alignment when the plug is inserted in the cavity.

Abstract translation: 弹簧手指互连系统可以包括插头和插座。 在一个实施例中，插头可以包括配置成承载电信号的弹簧爪触点。 容器可以包括用于接收插头的空腔，并且空腔可以由印刷电路板制造技术构成。 在一个实施例中，空腔可以至少部分地形成在预浸渍层中，并且可以在预浸渍层的上方和下方设置第一和第二层以进一步形成空腔。 在一个实施例中，当插头插入空腔时，触头可布置在第一层上以接触弹簧指。 在另一个实施例中，触点可以布置在第一和第二层上。 在另一个实施例中，当插头插入空腔时，空腔可被成形为有助于接触弹簧对准。

公开(公告)号：US20150000964A1

公开(公告)日：2015-01-01

申请号：US14102684

申请日：2013-12-11

Applicant: HON HAI PRECISION INDUSTRY CO., LTD. ,  HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.

Inventor： HAI-DONG TANG

IPC: H05K1/02

CPC classification number: H05K3/3405 ,  H05K2201/09163

Abstract: A printed circuit board (PCB) includes an edge-component welded to the edge, which includes a plurality of pins. The PCB includes a base board and at least one slot set at edges of the base board. The pins are plugged into the base board through the at least one slot, the at least one slot is set right below the pins, and the position of the at least one slot is designed without copper pouring. In production, copper foil in the at least one slot is cut off, preventing the pins from touching the copper foil on the base board.

Abstract translation: 印刷电路板（PCB）包括焊接到边缘的边缘部件，其包括多个引脚。 PCB包括基板和设置在基板的边缘处的至少一个槽。 销通过至少一个槽插入基板中，至少一个槽被设置在销的正下方，并且至少一个槽的位置被设计成没有铜浇注。 在生产中，切断至少一个槽中的铜箔，防止销接触基板上的铜箔。

公开(公告)号：US08602593B2

公开(公告)日：2013-12-10

申请号：US12579946

申请日：2009-10-15

Applicant: Joshua Josiah Markle ,  Robert Edward Higley

Inventor： Joshua Josiah Markle ,  Robert Edward Higley

IPC: F21V21/00

CPC classification number: F21K9/00 ,  F21V19/0055 ,  F21V29/76 ,  F21V29/763 ,  F21V29/85 ,  H01L25/0753 ,  H01L2224/48227 ,  H01L2924/19107 ,  H05K1/021 ,  H05K3/0058 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09163 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10409

Abstract: Lamp assemblies and methods of making the same are provided. Such a lamp assembly can include a heat sink and a light-emitting diode package that can be mounted to the heat sink. The light-emitting diode package can include a substrate with a top surface and bottom surface, a lens, and electrical contacts on the surface of the substrate. The lamp assembly can also include a printed circuit board with a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface. The printed circuit board can have electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package. The substrate of the light-emitting diode package can engage the opening of the printed circuit board to mechanically couple the light-emitting diode package to the printed circuit board. When assembled, a bottom surface of the substrate can be flush and aligned with a rear surface of the printed circuit board.

Abstract translation: 提供灯组件及其制造方法。 这种灯组件可以包括可以安装到散热器的散热器和发光二极管封装。 发光二极管封装可以包括具有顶表面和底表面的基板，透镜以及在基板表面上的电触点。 灯组件还可以包括具有面表面的印刷电路板，与表面相对的后表面和从表面延伸到后表面的开口。 印刷电路板可以在其上具有电接触以与发光二极管封装的电触点电连接。 发光二极管封装的基板可以接合印刷电路板的开口以将发光二极管封装机械耦合到印刷电路板。 当组装时，衬底的底表面可以与印刷电路板的后表面齐平并对齐。

公开(公告)号：US08436254B2

公开(公告)日：2013-05-07

申请号：US13301812

申请日：2011-11-22

Applicant: Cheng-Po Yu ,  Han-Pei Huang

Inventor： Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K1/00

CPC classification number: H05K1/11 ,  H05K1/0284 ,  H05K1/142 ,  H05K3/185 ,  H05K3/4007 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2203/1327 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

Abstract translation: 一种制造电路板结构的方法，包括提供电路板主体，通过封装所述电路板主体的至少一部分来形成具有非板型，立体结构和至少一个刮痕表面的模制的不规则塑料体 并且在所述模制的不规则塑料体上形成第一三维电路图案，从而限定三维电路装置。

公开(公告)号：US20120275124A1

公开(公告)日：2012-11-01

申请号：US13383237

申请日：2010-07-09

Applicant: Rainer Pludra ,  Dietmar Drofenik ,  Johannes Stahr ,  Siegfried Götzinger ,  Liubomir Mareljic

Inventor： Rainer Pludra ,  Dietmar Drofenik ,  Johannes Stahr ,  Siegfried Götzinger ,  Liubomir Mareljic

IPC: H05K3/10 ,  H05K7/06

CPC classification number: H05K1/142 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K3/225 ,  H05K3/368 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09163 ,  H05K2201/09845 ,  H05K2203/1461 ,  Y10T29/49155

Abstract: In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions (20, 21, 22) to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions (20, 21, 22) to be connected to one another, at least one additional layer or ply of the printed circuit board is arranged or applied over the printed circuit board regions (20, 21, 22) to be connected to one another, it is provided that the additional layer is embodied as a conductive layer (26), which is contact-connected via plated-through holes (23) to conductive layers or devices or components integrated in the printed circuit board regions (20, 21, 22) to be connected to one another, as a result of which a simple and reliable connection or coupling of printed circuit board regions (20, 21, 22) to be connected to one another can be made available.Furthermore, a printed circuit board consisting of a plurality of printed circuit board regions (20, 21, 22) is made available.

Abstract translation: 在制造由至少两个印刷电路区域组成的印刷电路板的方法中，其中印刷电路板区域各自包括至少一个导电层和/或至少一个器件或一个导电部件，其中印刷电路板区域（20 ，21,22）彼此连接，在每种情况下，至少一个彼此直接相邻的侧表面的区域通过联接或连接彼此连接，并且其中在连接或连接印刷后 电路板区域（20,21,22）彼此连接，印刷电路板的至少一个附加层或层被布置或施加在印刷电路板区域（20,21,22）上以被连接到 另一方面，附加层被实施为导电层（26），其通过电镀通孔（23）与导电层或集成在印刷电路板区域中的器件或部件接触连接 ns（20,21,22）彼此连接，结果可以使得要彼此连接的印刷电路板区域（20,21,22）的简单且可靠的连接或耦合可用。 此外，由多个印刷电路板区域（20,21,22）组成的印刷电路板是可用的。

公开(公告)号：US08105453B2

公开(公告)日：2012-01-31

申请号：US12029545

申请日：2008-02-12

Applicant: Akiyoshi Kawamura ,  Takayuki Tsukizawa ,  Tetsuya Ikeda

Inventor： Akiyoshi Kawamura ,  Takayuki Tsukizawa ,  Tetsuya Ikeda

IPC: C03B29/00 ,  B32B13/04 ,  B32B3/14

CPC classification number: H05K3/0052 ,  H01L21/4807 ,  H05K1/0272 ,  H05K1/0306 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/0909 ,  H05K2201/09163 ,  H05K2201/09781 ,  Y10T428/166

Abstract: In a method for producing a multilayer ceramic substrate, a green ceramic laminate includes green conductive patterns arranged on a plurality of ceramic green sheets and portions to be formed into a plurality of multilayer ceramic substrates. Boundary-defining conductive patterns are arranged on the ceramic green sheets and along boundaries of the multilayer ceramic substrates. The boundary-defining conductive patterns have firing shrinkage characteristics that are different from those of the ceramic green sheets. During firing of the green ceramic laminate, cavities adjacent to edges of the boundary-defining conductive patterns are formed. A sintered ceramic laminate is divided at edges passing through the cavities.

Abstract translation: 在多层陶瓷基板的制造方法中，生坯陶瓷层叠体包括布置在多个陶瓷生片上的绿色导电图案和形成多个多层陶瓷基板的部分。 边界限定导电图案布置在陶瓷生片上并沿着多层陶瓷基片的边界。 边界限定导电图案具有与陶瓷生片不同的焙烧收缩特性。 在焙烧生坯陶瓷层压板期间，形成与边界限定导电图案的边缘相邻的空腔。 烧结的陶瓷层压体在通过空腔的边缘处分开。

公开(公告)号：US08031474B2

公开(公告)日：2011-10-04

申请号：US11627844

申请日：2007-01-26

Applicant: Minoru Ogawa ,  Kazuto Nishimoto

Inventor： Minoru Ogawa ,  Kazuto Nishimoto

IPC: H05K1/18

CPC classification number: G02B6/138 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1533 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/186 ,  H05K3/365 ,  H05K3/386 ,  H05K3/4015 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0272 ,  H05K2201/0311 ,  H05K2201/048 ,  H05K2201/064 ,  H05K2201/09163 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2203/061 ,  Y02P70/611 ,  H01L2924/00

Abstract: A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The connection layer includes an insulation portion and an electric conduction portion. The insulation portion contains an insulating member and is adhered to each of the adjacent two printed circuit boards. The electric conduction portion passes through the insulation portion and connects electrode terminals of the adjacent two printed circuit boards.

Abstract translation: 印刷电路板组件具有多个印刷电路板，它们被堆叠而彼此机械地和电连接，并且提供了将相邻的两个印刷电路板彼此连接的连接层。 连接层包括绝缘部分和导电部分。 绝缘部分包含绝缘部件并且粘附到相邻的两个印刷电路板中的每一个。 导电部分穿过绝缘部分并连接相邻的两个印刷电路板的电极端子。

公开(公告)号：US07762819B2

公开(公告)日：2010-07-27

申请号：US11918121

申请日：2006-07-06

Applicant: Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

Inventor： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC: H01R12/00

CPC classification number: H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

Abstract: A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

Abstract translation: 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US07591649B2

公开(公告)日：2009-09-22

申请号：US12100294

申请日：2008-04-09

Applicant: Ta-Hsiang Yen ,  Yen-Hung Huang ,  Chih-Ming Lai

Inventor： Ta-Hsiang Yen ,  Yen-Hung Huang ,  Chih-Ming Lai

IPC: H01R12/00

CPC classification number: H05K1/142 ,  H05K2201/09163 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2203/167

Abstract: An illumination device using LEDs (101) has a circuit board and a plurality of LEDs disposed on the circuit board elements. The circuit board can be obtained by assembling a plurality of the circuit board elements (11) together. The circuit board element comprises a board (110) and an electric trace (1151) attached to the board. The board comprises a plurality of connecting units (111, 112, 113, 114) formed at lateral sides thereof. The circuit board element connects with an adjacent circuit board element via the connecting units. The electric trace extends from the board to the connecting units and electrically connects with the electric trace of the adjacent circuit board element.

Abstract translation: 使用LED（101）的照明装置具有布置在电路板元件上的电路板和多个LED。 可以通过将多个电路板元件（11）组装在一起来获得电路板。 电路板元件包括板（110）和连接到板的电迹线（1151）。 板包括形成在其横向侧面的多个连接单元（111,112,113,114）。 电路板元件通过连接单元与相邻的电路板元件连接。 电迹线从板延伸到连接单元，并与相邻电路板元件的电迹线电连接。

公开(公告)号：US20090025960A1

公开(公告)日：2009-01-29

申请号：US12165222

申请日：2008-06-30

Applicant: Hitoshi KASHIO

Inventor： Hitoshi KASHIO

IPC: H05K1/00 ,  H01B3/00

CPC classification number: H05K3/3405 ,  H01R4/2404 ,  H01R9/0515 ,  H05K1/0243 ,  H05K3/4652 ,  H05K2201/09163 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2203/1189

Abstract: An embodiment of the present invention is provided with a first wiring board, a cable component juxtaposed with the first wiring board, and second wiring boards laminated onto the first wiring board, which have a second conductor layer pattern connected to the cable component and a second insulating substrate. The cable component comprises a cable having a conductor wire and a sheath portion insulating the conductor wire and a planetary gear-shaped conductor wire coupler connected to the conductor wire and having conductor wire projections which, by passing through the second insulating substrate, abut against the second conductor layer pattern.

Abstract translation: 本发明的一个实施例具有第一布线板，与第一布线板并置的电缆部件和层叠在第一布线板上的第二布线板，第二布线板具有连接到电缆部件的第二导体层图案， 绝缘基板。 电缆部件包括电缆，该电缆具有导体线和绝缘导线的外皮部分，以及连接到导线的行星齿轮状导体线耦合器，并且具有导体线突起，导体线突起通过第二绝缘基板抵靠 第二导体层图案。