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    Toroidal printed coil
    51.
    发明授权
    Toroidal printed coil 失效
    环形印刷线圈

    公开(公告)号：US06686824B1

    公开(公告)日：2004-02-03

    申请号：US09463630

    申请日：2000-01-28

    Applicant: Kunitoshi Yamamoto

    Inventor： Kunitoshi Yamamoto

    IPC: H01F706

    CPC classification number: H05K1/165 ,  H01F17/0006 ,  H01F17/0033 ,  H02K3/26 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/403 ,  H05K2201/09063 ,  H05K2201/097 ,  Y10T29/49018 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49126 ,  Y10T29/49155

    Abstract: A toroidal printed coil includes a plurality of annular holes (2) and a plurality of center holes (3) surrounded by the annular holes (2) in an insulating substrate (1). A plurality of annular juts (4), each comprising a portion surrounded by the annular hole (2) and the center hole (3), are formed. A printed coil sheet having a plurality of toroidal printed coils, in which a conductor film (6) is spirally formed at front-and-rear surfaces and side surfaces of annular portions (5) of the annular juts (4) with each annular portion taken as an axis, is obtained. With this printed coil sheet, a plurality of toroidal printed coils (P) are obtained by cutting the insulating substrate (1) off from the individual annular juts (4).

    Abstract translation: 环形印刷线圈包括多个环形孔（2）和由绝缘基板（1）中的环形孔（2）围绕的多个中心孔（3）。 形成多个环状突起（4），每个环形突起（4）包括由环形孔（2）和中心孔（3）围绕的部分。 一种具有多个环形印刷线圈的印刷线圈片，其中导体膜（6）在环形突起（4）的环形部分（5）的前后表面和侧表面上螺旋形成，每个环形部分 取为轴。 利用该印刷线圈片，通过将绝缘基板（1）从单独的环形突起（4）切断而获得多个环形印刷线圈（P）。

    Planar inductors and method of manufacturing thereof
    54.
    发明申请
    Planar inductors and method of manufacturing thereof 失效
    平面电感器及其制造方法

    公开(公告)号：US20030011458A1

    公开(公告)日：2003-01-16

    申请号：US09904014

    申请日：2001-07-12

    Applicant: Custom One Design, Inc.

    Inventor： Peter R. Nuytkens ,  Ilya E. Popeko ,  Joseph M. Kulinets

    IPC: H01F005/00

    CPC classification number: H05K1/165 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/365 ,  H01F41/02 ,  H01F41/046 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/15153 ,  H05K3/184 ,  H05K3/381 ,  H05K3/4614 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2203/072 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T29/49124 ,  Y10T29/4913

    Abstract: A printed circuit board has two layers of printed circuit board dielectric material; a core made of ferromagnetic material between the two layers; and conductive leads on the opposite side of each dielectric layer from the core connected by via holes through both dielectric layers to form a conducting coil around the core. The conductive leads can form two separate coils around the core to form a transformer. A planar conducing sheet can be placed on or between one or more of the printed circuit board's dielectric layers to shield other circuitry on the printed circuit board from magnetic fields generated around the core. The core can be formed at least in part by electroless plating. Electroplating can be used to add a thicker layer of less conductive ferromagnetic material. Ferromagnetic inductive cores can be formed on the surface of a dielectric material by: dipping the surface of the dielectric in a solution containing catalytic metal particles having a slight dipole; and placing the dielectric in a metal salt to cause a layer containing metal to be electrolessly plated upon the dielectric. Plasma etching or other technique can be used before the dipping process to roughen the dielectric's surface to help attract the catalytic particles. This method can be used to form an inductor core on or between one or more dielectric layers of a printed circuit board, of a multichip module, of an integrated circuit, or of a micro-electromechanical device.

    Abstract translation: 印刷电路板具有两层印刷电路板电介质材料; 由两层之间的铁磁材料制成的铁芯; 并且每个电介质层的相对侧上的导电引线与通过两个电介质层的通孔连接的芯体形成围绕芯的导电线圈。 导电引线可以在芯周围形成两个分离的线圈以形成变压器。 平面导电片可以放置在印刷电路板的介电层中的一个或多个之上或之上，以屏蔽印刷电路板上的其它电路与芯周围产生的磁场。 芯可以至少部分地通过无电镀形成。 可以使用电镀来增加较薄的较不导电的铁磁材料层。 可以通过以下步骤在电介质材料的表面上形成铁磁感应芯：将电介质的表面浸入含有具有轻微偶极子的催化金属颗粒的溶液中; 并将电介质放置在金属盐中以使含有金属的层无电镀在电介质上。 在浸渍过程之前可以使用等离子体蚀刻或其它技术来粗糙化电介质的表面以帮助吸引催化剂颗粒。 该方法可以用于在印刷电路板，多芯片模块，集成电路或微机电装置的一个或多个电介质层之间或之上形成电感器芯。

    Method for attaching an electronic component to a substrate
    55.
    发明申请
    Method for attaching an electronic component to a substrate 审中-公开
    将电子部件附着于基板的方法

    公开(公告)号：US20030009878A1

    公开(公告)日：2003-01-16

    申请号：US09902589

    申请日：2001-07-12

    Inventor： John Gregory

    IPC: H05K001/00 ,  H05K003/34

    CPC classification number: H01L23/50 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/112 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3484 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/097 ,  H05K2203/0278 ,  H05K2203/043 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00

    Abstract: A method for attaching an electronic component to a substrate having a patterned conductive layer underlying a dielectric layer includes: removing regions of the dielectric layer to form cavities having an exposed surface area of the conductive layer; filling the cavities with solder paste; heating the solder paste to form a convex surface which protrudes above the substrate surface, for receiving an electronic component for attachment; planarising the convex surface such that it and the surface of the substrate surface are substantially coplanar; placing contact pads of the electronic component adjacent the substrate such that the contact pads overlie given filled cavities; and reheating the solder so that it reflows and connects the electronic component to the substrate. The cavities preferably all have the same volume. If the ratio of exposed surface area to cavity volume is low, pillars form during reflow, spacing the component from the substrate.

    Abstract translation: 将电子部件附着到具有在电介质层下方的图案化导电层的基板的方法包括：去除电介质层的区域以形成具有导电层的暴露表面积的空腔; 用焊膏填充空腔; 加热焊膏以形成在基板表面上方突出的凸表面，用于接收用于附接的电子部件; 使凸面平坦化，使其与基板表面的表面基本上共面; 将电子部件的接触垫放置在衬底附近，使得接触垫覆盖给定的填充空腔; 并重新加热焊料，使其回流并将电子部件连接到基板。 腔优选全部具有相同的体积。 如果暴露的表面积与空腔体积的比率低，则在回流期间形成柱，从而将组分与衬底间隔开。

    Multilayer printed board with a double plane spiral interconnection structure
    56.
    发明申请
    Multilayer printed board with a double plane spiral interconnection structure 失效
    多层印刷板具有双面螺旋互连结构

    公开(公告)号：US20020109573A1

    公开(公告)日：2002-08-15

    申请号：US10093482

    申请日：2002-03-11

    Applicant: NEC CORPORATION

    Inventor： Mizuki Iwanami

    IPC: H01F027/28

    CPC classification number: H01F17/0013 ,  H05K1/0298 ,  H05K1/165 ,  H05K3/4688 ,  H05K2201/086 ,  H05K2201/09336 ,  H05K2201/097

    Abstract: An inductor device having plural spiral-shaped interconnection structures connected to each other and extending in plural power source layers, the power source layers being in different levels of a multilayer printed board. The printed board having first and second current loops. The loops share part of a common current path.

    Abstract translation: 一种电感器件，具有多个螺旋形互连结构，彼此连接并在多个电源层中延伸，所述电源层处于多层印刷电路板的不同级别。 该印刷电路板具有第一和第二电流回路。 循环共享公共当前路径的一部分。

    Low inductance connector with enhanced capacitively coupled contacts for power applications
    58.
    发明授权
    Low inductance connector with enhanced capacitively coupled contacts for power applications 失效
    低电感连接器，具有用于电源应用的增强的电容耦合触点

    公开(公告)号：US06358094B1

    公开(公告)日：2002-03-19

    申请号：US09538698

    申请日：2000-03-30

    Applicant: Yakov Belopolsky ,  Jenn Tsao

    Inventor： Yakov Belopolsky ,  Jenn Tsao

    IPC: H01R2400

    CPC classification number: H05K1/148 ,  H01R12/7082 ,  H01R12/7088 ,  H01R13/658 ,  H05K2201/0792 ,  H05K2201/097 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2203/1572

    Abstract: A low inductance power connector for reducing inductance in an electrical conductor is provided. An interface connector connects circuit boards together while reducing inductance and increasing current carrying capacity. The connector for connecting circuit boards comprises a first contact having a body, a first mating portion and a second mating portion, and a second contact having a body, a third mating portion and a fourth mating portion. The first and second mating portions are substantially parallel and disposed on opposite sides of the body of the first contact, and the third and fourth mating portions are substantially parallel and disposed on opposite sides of the body of the second contact.

    Abstract translation: 提供了用于降低电导体中的电感的低电感电源连接器。 接口连接器将电路板连接在一起，同时减少电感和增加载流能力。 用于连接电路板的连接器包括具有主体，第一配合部分和第二配合部分的第一触点和具有主体，第三配合部分和第四配合部分的第二触点。 第一和第二配合部分基本上平行并且设置在第一接触件的主体的相对侧上，并且第三和第四配合部分基本上平行并且设置在第二接触件的主体的相对侧上。

    Method of reducing crosstalk in connector for communication system
    60.
    发明授权
    Method of reducing crosstalk in connector for communication system 失效
    减少通信系统连接器串扰的方法

    公开(公告)号：US6132266A

    公开(公告)日：2000-10-17

    申请号：US477238

    申请日：1995-06-07

    Applicant: Daniel E. Klas ,  William J. Rose

    Inventor： Daniel E. Klas ,  William J. Rose

    IPC: H01R13/6469 ,  H01R13/6477 ,  H01R24/00 ,  H05K1/02 ,  H05K1/11 ,  H01R9/22

    CPC classification number: H05K1/0228 ,  H01R13/6469 ,  H01R13/6477 ,  H05K1/117 ,  H05K2201/09245 ,  H05K2201/097 ,  H05K2201/10189 ,  Y10S439/941

    Abstract: A connector for communications systems has four input terminals and four output terminals, each arranged in an ordered array. A circuit electrically couples each input terminal to the respective output terminal and cancels crosstalk induced across the adjacent connector terminals. The circuit includes four conductive paths between the respective pairs of terminals. The first and third paths are in relatively close proximity and are substantially spaced from the second and fourth paths. The second and fourth paths are in relatively close proximity.

    Abstract translation: 用于通信系统的连接器具有四个输入端子和四个输出端子，每个输出端子以有序阵列布置。 电路将每个输入端子电耦合到相应的输出端子，并且消除在相邻的连接器端子之间引起的串扰。 该电路包括在各对端子之间的四个导电路径。 第一和第三路径相对靠近并且与第二和第四路径基本间隔开。 第二和第四路径相对靠近。

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