公开(公告)号：US20190157007A1

公开(公告)日：2019-05-23

申请号：US16255903

申请日：2019-01-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akio MASUNARI

IPC: H01G4/30 ,  H01G4/232 ,  H05K1/11 ,  H01G4/005 ,  H05K3/34 ,  H01G4/12 ,  H05K1/18 ,  H01G4/248

CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H05K1/11 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.

公开(公告)号：US20190148071A1

公开(公告)日：2019-05-16

申请号：US16248078

申请日：2019-01-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Gu Won Ji ,  Heung Kil Park ,  Se Hun Park

IPC: H01G4/248 ,  H05K1/11 ,  H05K1/18 ,  H01G4/30

CPC classification number: H01G4/248 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10015

Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.

公开(公告)号：US20190124771A1

公开(公告)日：2019-04-25

申请号：US15987360

申请日：2018-05-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil PARK ,  Gu Won JI ,  Se Hun PARK

IPC: H05K1/18 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01G4/224

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/224 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/2045

Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1≤G/CT≤0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.

公开(公告)号：US20190122823A1

公开(公告)日：2019-04-25

申请号：US15995637

申请日：2018-06-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Beom Joon CHO ,  Ki Young KIM ,  Jae Young NA ,  Jin Mo AHN

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/005 ,  H01G4/12 ,  H05K3/34 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/38 ,  H05K1/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10946

Abstract: A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.

公开(公告)号：US20190119544A1

公开(公告)日：2019-04-25

申请号：US16160478

申请日：2018-10-15

Applicant: Honeywell International Inc.

Inventor： Ling Shen ,  Kai Zhang ,  Liqiang Zhang ,  Ya Qun Liu ,  Huifeng Duan ,  Haigang Kang

IPC: C09K5/10 ,  F28F13/00 ,  H05K1/02 ,  H01L23/373 ,  H01L23/00

CPC classification number: C09K5/10 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29291 ,  H01L2224/32245 ,  H05K1/0203 ,  H05K2201/0162 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022

Abstract: The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.

公开(公告)号：US20180337649A1

公开(公告)日：2018-11-22

申请号：US15601692

申请日：2017-05-22

Applicant: Transtector Systems, Inc.

Inventor： Edward J. Dickman ,  Kelly A. Dane ,  Randall T. Palmer

IPC: H03H1/00 ,  H05K5/00 ,  H05K1/14 ,  H05K5/03 ,  H05K9/00 ,  H05K1/02

CPC classification number: H05K1/147 ,  H05K1/0245 ,  H05K9/0015 ,  H05K9/006 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10174

Abstract: A filtering unit includes a housing having outer walls that define a volume and an inner wall that separates the volume into a first chamber and a second chamber. The filtering unit also includes a rigid/flexible circuit board. The circuit board includes a first rigid portion designed to be positioned in the first chamber. The circuit board further includes a second rigid portion designed to be positioned in the second chamber. The circuit board further includes a flexible portion connecting the first rigid portion to the second rigid portion and designed to extend around the inner wall from the first chamber to the second chamber. The filtering unit further includes a bumper designed to be positioned between one of the outer walls and the inner wall to provide waveguide functionality by reducing an amount of electric field that can pass from the first chamber to the second chamber.

公开(公告)号：US20180323708A1

公开(公告)日：2018-11-08

申请号：US15772487

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： William J. LAMBERT ,  Mathew MANUSHAROW

IPC: H02M3/155

CPC classification number: H02M3/155 ,  H01L25/10 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2201/10719

Abstract: A printed circuit board (PCB) includes one or more voltage rails and an integrated voltage regulator (IVR) electrically coupled to supply current to a voltage rail. The PCB also includes a PCB current source electrically coupled to supply a supplementary current to the voltage rail.

公开(公告)号：US20180310394A1

公开(公告)日：2018-10-25

申请号：US15771687

申请日：2016-10-28

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Takehito Kobayashi

IPC: H05K1/02 ,  H05K1/18 ,  H02G3/16 ,  H02G3/03

CPC classification number: H05K1/0203 ,  H02G3/03 ,  H02G3/16 ,  H05K1/181 ,  H05K7/20 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10272

Abstract: A circuit structure that includes: an insulating heat transfer member that transfers heat from a bus bar to a heat dissipating member, is insulating, and is provided between the bus bar and the heat dissipating member; and a restricting member that restricts movement of the insulating heat transfer member that is caused by an increase in the temperature of the insulating heat transfer member, and is provided between the bus bar and the heat dissipating member. The restricting member is provided with heat transfer openings for bringing the insulating heat transfer member into contact with the bus bar, and, the insulating heat transfer member 80 has a smaller area than an opening area of the heat transfer openings, in a state of being in contact with the bus bar.

公开(公告)号：US20180308626A1

公开(公告)日：2018-10-25

申请号：US16016701

申请日：2018-06-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO ,  Satoshi ISHINO ,  Mitsuyoshi NISHIDE ,  Shinichiro BANBA

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/24 ,  H01F27/32 ,  H01F41/02 ,  H01F41/04

CPC classification number: H01F27/292 ,  H01F17/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2823 ,  H01F27/29 ,  H01F27/32 ,  H01F41/0206 ,  H01F41/04 ,  H01F41/10 ,  H02M3/00 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10053

Abstract: A surface mount coil component includes an element body defining a compact including magnetic material particles; a coil that is buried, excluding an end portion of the coil, in the element body; and an input-output terminal electrically connected to the end portion of the coil. A thermoplastic resin layer is provided on a surface on a mounting surface side of the element body. An interlayer connection conductor is provided in the thermoplastic resin layer. The input-output terminal is provided on a surface of the thermoplastic resin layer and is electrically connected to the end portion of the coil via the interlayer connection conductor.

公开(公告)号：US20180277533A1

公开(公告)日：2018-09-27

申请号：US15991195

申请日：2018-05-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Tetsuhiro TANAKA ,  Yutaka OKAZAKI

IPC: H01L27/07 ,  H01G4/008 ,  H01G4/10 ,  H01G4/40 ,  H01L27/12 ,  H01L29/66 ,  H01L29/786 ,  H01L29/94 ,  H05K1/18

CPC classification number: H01L27/0733 ,  H01G4/008 ,  H01G4/105 ,  H01G4/40 ,  H01L21/8258 ,  H01L27/0629 ,  H01L27/0688 ,  H01L27/1156 ,  H01L27/1225 ,  H01L27/1255 ,  H01L29/66477 ,  H01L29/78648 ,  H01L29/7869 ,  H01L29/78696 ,  H01L29/94 ,  H05K1/18 ,  H05K2201/10015 ,  H05K2201/10083 ,  H05K2201/10166

Abstract: A miniaturized transistor is provided. A transistor with low parasitic capacitance is provided. A transistor having high frequency characteristics is provided. A transistor having a large amount of on-state current is provided. A semiconductor device including the transistor is provided. A semiconductor device with high integration is provided. A novel capacitor is provided. The capacitor includes a first conductor, a second conductor, and an insulator. The first conductor includes a region overlapping with the second conductor with the insulator provided therebetween. The first conductor includes tungsten and silicon. The insulator includes a silicon oxide film that is formed by oxidizing the first conductor.