公开(公告)号：US20140345932A1

公开(公告)日：2014-11-27

申请号：US14457433

申请日：2014-08-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingli Huang ,  Tao Feng ,  Songlin Li

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/14

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/144 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/10242

Abstract: Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit board includes at least two layers of core plates that are adhered, where a circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.

Abstract translation: 本公开的实施例涉及电子领域，特别是涉及多层印刷电路板及其制造方法。 电路板能够避免信号传输性能受镀层孔影响的问题。 多层印刷电路板包括至少两层粘合的芯板，其中电路机械部件设置在芯板上，在芯板上还设有通孔，并且金属柱嵌入在通孔中 其中金属柱的一端连接到设置在芯板上的天线馈线电路机械部件上的对应位置，另一端连接到设置在相邻层上的天线馈电电路机械部件上的对应位置 核心板。 该方法用于制造多层印刷电路板。

公开(公告)号：US20140190745A1

公开(公告)日：2014-07-10

申请号：US14342880

申请日：2012-09-01

Applicant: Klaus Götzen

Inventor： Klaus Götzen

IPC: H01R4/10

CPC classification number: H01R4/10 ,  E05B81/06 ,  E05B81/54 ,  E05B85/02 ,  H01R12/55 ,  H05K1/0256 ,  H05K3/202 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/4015 ,  H05K2201/1009 ,  H05K2201/10242 ,  H05K2201/2072

Abstract: The invention relates to a conductor track unit, in particular for a motor vehicle. The conductor track unit is provided with conductor tracks which are embedded in an electrically insulating material. The conductor tracks are, in particular completely, surrounded by the electrically insulating material and are therefore not accessible from the outside. Electrical connections are electrically connected to the conductor tracks. The electrical connections are accessible from the outside, and therefore can be electrically connected to electrical contacts of electrical or electronic components such as a switch, detector, electronic radio component, integrated circuit, electronic chip, electronic control device or motor, for example by soldering. The conductor tracks and electrical connections are different components which are therefore initially independent of one another and can be produced independently dependently of one another. A particularly robust yet delicate conductor track unit can be provided in this way.

Abstract translation: 本发明涉及导体轨道单元，特别是用于机动车辆。 导体轨道单元设置有嵌入电绝缘材料的导体轨迹。 导体轨道特别完全被电绝缘材料包围，因此不能从外部接近。 电连接电连接到导体轨道。 电连接可以从外部访问，因此可以电连接到诸如开关，检测器，电子无线电部件，集成电路，电子芯片，电子控制装置或电机之类的电气或电子部件的电触点，例如通过焊接 。 导体轨道和电连接是不同的部件，因此它们最初彼此独立并且可以彼此独立地相互制造。 这样可以提供一个特别坚固而精细的导轨跟踪单元。

公开(公告)号：US08125080B2

公开(公告)日：2012-02-28

申请号：US12264823

申请日：2008-11-04

Applicant: Keun-hyuk Lee

Inventor： Keun-hyuk Lee

IPC: H01L25/16

CPC classification number: H01L24/40 ,  H01L23/3121 ,  H01L24/37 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/32225 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4015 ,  H05K2201/10242 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided are semiconductor power module packages, which are structurally simplified by bonding electrodes onto substrates, and methods of fabricating the same. An exemplary package includes a substrate and semiconductor chips disposed on a top surface of the substrate. Electrodes are bonded to the top surface of the substrate and electrically coupled to the semiconductor chips. Parts of the semiconductor chips are electrically coupled to parts of the electrodes by interconnection lines. An encapsulation unit covers the semiconductor chips, the electrodes, and the interconnection lines and exposes at least top surfaces of the electrodes.

Abstract translation: 提供了通过将电极结合到基板上而被结构简化的半导体功率模块封装及其制造方法。 示例性封装包括设置在基板的顶表面上的基板和半导体芯片。 电极结合到衬底的顶表面并电耦合到半导体芯片。 半导体芯片的一部分通过互连线电耦合到电极的一部分。 封装单元覆盖半导体芯片，电极和互连线，并且至少暴露电极的顶表面。

公开(公告)号：US07985077B2

公开(公告)日：2011-07-26

申请号：US12686261

申请日：2010-01-12

Applicant: Thomas H. Di Stefano

Inventor： Thomas H. Di Stefano

IPC: H01R12/00

CPC classification number: H01R12/58 ,  H01R4/027 ,  H01R12/523 ,  H01R13/111 ,  H01R13/6315 ,  H05K3/3436 ,  H05K2201/10242 ,  H05K2201/10424 ,  Y02P70/613

Abstract: A socket assembly for connecting an array of bulbous terminals such as balls wherein the female element is a miniature tube that has resilient prongs that grip the corresponding terminals with varying force during insertion and deletion. The tube is of resilient conductive material that has been sliced or helically partitioned into opposing prongs forming slots of a width that increases with axial distance from the end of the tube so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube.

Abstract translation: 一种插座组件，用于连接诸如球的球形端子阵列，其中所述阴元件是具有弹性插脚的微型管，所述微型管在插入和删除期间以变化的力夹持相应的端子。 该管是弹性导电材料，其被切片或螺旋地分隔成相对的尖头，形成宽度的槽，该宽度随着距离管的端部的轴向距离而增加，从而允许连接器的叉头围绕球状球状体 端子并机械地将端子保持在连接器内。 连接器的管状元件可以通过在管的一端或两端形成尖端而制成，该切口的宽度随着距管的端部的距离而增加。

公开(公告)号：US07980862B2

公开(公告)日：2011-07-19

申请号：US12909718

申请日：2010-10-21

Applicant: Thomas H. Di Stefano

Inventor： Thomas H. Di Stefano

IPC: H01R9/09

CPC classification number: H01R12/58 ,  H01R4/027 ,  H01R12/523 ,  H01R13/111 ,  H01R13/6315 ,  H05K3/3436 ,  H05K2201/10242 ,  H05K2201/10424 ,  Y02P70/613

Abstract: A socket assembly formed of hollow tubes for connecting an array of terminals off opposing electronic structures with both axial and lateral resilience, wherein the resilience is achieved through angular cuts in the tubes.

Abstract translation: 由中空管形成的插座组件，用于将端子阵列连接到具有轴向和侧向弹性的相对的电子结构上，其中通过管中的角切口来实现弹性。

公开(公告)号：US20100263923A1

公开(公告)日：2010-10-21

申请号：US12755555

申请日：2010-04-07

Applicant: Kotaro KODANI ,  Junichi Nakamura

Inventor： Kotaro KODANI ,  Junichi Nakamura

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/10 ,  H05K3/30

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2221/68359 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15174 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K1/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/10242 ,  H05K2201/10674 ,  H05K2203/0376 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of making a wiring substrate includes forming a first metal layer on a surface of a support member, the first metal layer having at least one columnar through hole that exposes the surface of the support member, forming a columnar metal layer that fills the columnar through hole, forming an insulating layer on the columnar metal layer and on the first metal layer, forming an interconnection layer on a first surface of the insulating layer such that the interconnection layer is electrically connected to the columnar metal layer through the insulating layer, and forming a protruding part including at least part of the columnar metal layer by removing at least the support member and the first metal layer, the protruding part protruding from a second surface of the insulating layer opposite the first surface and serving as at least part of a connection terminal of the wiring substrate.

Abstract translation: 制造布线基板的方法包括在支撑构件的表面上形成第一金属层，所述第一金属层具有至少一个柱状通孔，所述柱状通孔暴露所述支撑构件的表面，形成填充柱状的柱状金属层 在所述柱状金属层和所述第一金属层上形成绝缘层，在所述绝缘层的第一表面上形成互连层，使得所述互连层通过所述绝缘层与所述柱状金属层电连接，以及 通过至少移除所述支撑构件和所述第一金属层来形成包括所述柱状金属层的至少一部分的突出部分，所述突出部分从所述绝缘层的与所述第一表面相对的第二表面突出并且用作所述第一金属层的至少一部分 接线基板的连接端子。

公开(公告)号：US07674113B2

公开(公告)日：2010-03-09

申请号：US12246267

申请日：2008-10-06

Applicant: Thomas H. Di Stefano

Inventor： Thomas H. Di Stefano

IPC: H01R12/00

CPC classification number: H01R12/58 ,  H01R4/027 ,  H01R12/523 ,  H01R13/111 ,  H01R13/6315 ,  H05K3/3436 ,  H05K2201/10242 ,  H05K2201/10424 ,  Y02P70/613

Abstract: A socket assembly for connecting an array of bulbous terminals such as balls wherein the female element is a miniature tube that has resilient prongs that grip the corresponding terminals with varying force during insertion and deletion. The tube is of resilient conductive material that has been sliced or helically partitioned into opposing prongs forming slots of a width that increases with axial distance from the end of the tube so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube.

Abstract translation: 一种插座组件，用于连接诸如球的球形端子阵列，其中所述阴元件是具有弹性插脚的微型管，所述微型管在插入和删除期间以变化的力夹持相应的端子。 该管是弹性导电材料，其被切片或螺旋地分隔成相对的尖头，形成宽度的槽，该宽度随着距离管的端部的轴向距离而增加，从而允许连接器的叉头围绕球状球状体 端子并机械地将端子保持在连接器内。 连接器的管状元件可以通过在管的一端或两端形成尖端而制成，该切口的宽度随着距管的端部的距离而增加。

公开(公告)号：US20090162976A1

公开(公告)日：2009-06-25

申请号：US12003254

申请日：2007-12-21

Applicant: Kuan-Hsing Li ,  Kuo-Hsien Liao

Inventor： Kuan-Hsing Li ,  Kuo-Hsien Liao

IPC: H01L21/60

CPC classification number: H05K3/3442 ,  H01L21/4853 ,  H01L23/04 ,  H01L23/49811 ,  H01L23/552 ,  H01L2924/16152 ,  H01L2924/167 ,  H01L2924/3025 ,  H05K2201/10242 ,  H05K2201/10477 ,  H05K2201/10924 ,  Y02P70/613

Abstract: A method of manufacturing a miniaturization chip module includes steps of providing a chip module having a substrate, wherein the substrate has a plurality of bonding pads spaced on a rear surface of substrate; providing a lead frame including a plurality of spaced metallic studs, wherein the metallic studs are attached onto the bonding pads; and forming metallic blocks as I/O pins by removing a part of each metallic stud and a part of the lead frame which is not in contact with the substrate.

Abstract translation: 一种制造小型化芯片模块的方法包括提供具有基板的芯片模块的步骤，其中所述基板具有在基板的后表面上间隔开的多个焊盘; 提供包括多个间隔开的金属螺柱的引线框架，其中所述金属螺柱附接到所述接合焊盘上; 并且通过去除每个金属柱的一部分和不与基板接触的引线框架的一部分，将金属块形成为I / O引脚。

公开(公告)号：US20090135571A1

公开(公告)日：2009-05-28

申请号：US12037289

申请日：2008-02-26

Applicant: Chih-Hung Chiang ,  Kai-Hung Huang

Inventor： Chih-Hung Chiang ,  Kai-Hung Huang

IPC: H05K1/11 ,  H01R12/00

CPC classification number: H01R12/57 ,  H01R12/7082 ,  H01R12/718 ,  H05K1/141 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/1084 ,  H05K2201/2036 ,  H05K2203/1178 ,  Y02P70/613

Abstract: The present invention relates to a surface-mount connector for electrically interconnecting a first circuit board and a second circuit board. The surface-mount connector includes a first end part and a second end part. The first end part is bonded onto the first circuit board. The second end part has a sidewall and a receptacle defined within the sidewall for receiving a solder bump therein. The solder bump is partially protruded from the sidewall and bonded onto the second circuit board such that the first circuit board and the second circuit board are electrically connected to each other.

Abstract translation: 本发明涉及一种用于电连接第一电路板和第二电路板的表面安装连接器。 表面安装连接器包括第一端部和第二端部。 第一端部被接合到第一电路板上。 第二端部具有侧壁和限定在侧壁内的容器，用于在其中容纳焊料凸块。 焊料凸起部分地从侧壁突出并且接合到第二电路板上，使得第一电路板和第二电路板彼此电连接。

公开(公告)号：US20090127691A1

公开(公告)日：2009-05-21

申请号：US12264823

申请日：2008-11-04

Applicant: Keun-hyuk Lee

Inventor： Keun-hyuk Lee

IPC: H01L23/538 ,  H01L21/768

CPC classification number: H01L24/40 ,  H01L23/3121 ,  H01L24/37 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/32225 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4015 ,  H05K2201/10242 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided are semiconductor power module packages, which are structurally simplified by bonding electrodes onto substrates, and methods of fabricating the same. An exemplary package includes a substrate and semiconductor chips disposed on a top surface of the substrate. Electrodes are bonded to the top surface of the substrate and electrically coupled to the semiconductor chips. Parts of the semiconductor chips are electrically coupled to parts of the electrodes by interconnection lines. An encapsulation unit covers the semiconductor chips, the electrodes, and the interconnection lines and exposes at least top surfaces of the electrodes.

Abstract translation: 提供了通过将电极结合到基板上而被结构简化的半导体功率模块封装及其制造方法。 示例性封装包括设置在基板的顶表面上的基板和半导体芯片。 电极结合到衬底的顶表面并电耦合到半导体芯片。 半导体芯片的一部分通过互连线电耦合到电极的一部分。 封装单元覆盖半导体芯片，电极和互连线，并且至少暴露电极的顶表面。