公开(公告)号：US20100018757A1

公开(公告)日：2010-01-28

申请号：US12220224

申请日：2008-07-23

Applicant: Juan I. Banzo

Inventor： Juan I. Banzo

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/0047 ,  H05K1/119 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/1476 ,  Y10T29/49124

Abstract: A printed circuit board assembly comprises a printed circuit board and a pass through terminal. The printed circuit board has a wavy slot extending through the printed circuit board that is clad with a conductive material. The wavy slot has part circular ends and a plurality of cusps along each side of the wavy slot that are formed by a plurality of successive drill cuts through a substrate of the printed circuit board. The pass through connector has a rectangular mounting portion that is disposed in the wavy slot with an interference fit so as to deform the part circular ends of the wavy slot at four locations and the cusps along each side of the wavy slot.

Abstract translation: 印刷电路板组件包括印刷电路板和通过端子。 印刷电路板具有延伸穿过印刷电路板的波纹槽，其被导电材料包覆。 波浪槽具有沿着波浪槽的每一侧的部分圆形端部和多个尖端，该多个尖端通过多个连续的钻孔切口穿过印刷电路板的基板而形成。 通过连接器具有矩形安装部分，其布置在波状槽中，具有过盈配合，以使波浪槽的部分圆形端部在四个位置变形，并且沿着波浪槽的每一侧的尖端变形。

公开(公告)号：US20090191912A1

公开(公告)日：2009-07-30

申请号：US12022192

申请日：2008-01-30

Applicant: Tobias WIESEL

Inventor： Tobias WIESEL

IPC: H04M11/00

CPC classification number: H04N5/2253 ,  H04N5/2257 ,  H05K3/301 ,  H05K2201/10121 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10598

Abstract: The present invention involves a radio communication terminal comprising a camera module and an information receiving device, wherein said camera module comprise at least one mounting opening, said radio communication terminal further comprise at least one pin, which is connected to said information receiving device, and at least one resilient member, and said pin is adapted to be inserted into said mounting opening of said camera module and to interact with said resilient member to lock the camera module to the information receiving device.

Abstract translation: 本发明涉及一种包括相机模块和信息接收装置的无线电通信终端，其中所述相机模块包括至少一个安装开口，所述无线电通信终端还包括连接到所述信息接收装置的至少一个引脚，以及 至少一个弹性构件，并且所述销适于插入所述照相机模块的所述安装开口中，并且与所述弹性构件相互作用以将照相机模块锁定到信息接收装置。

公开(公告)号：US07522384B2

公开(公告)日：2009-04-21

申请号：US10753911

申请日：2004-01-07

Applicant: Yiu Sing Ho ,  Hiroshi Fukaya ,  Kam Fung Yip ,  Satoshi Yamaguchi ,  Jeffery L. Wang ,  Can Hua Chen

Inventor： Yiu Sing Ho ,  Hiroshi Fukaya ,  Kam Fung Yip ,  Satoshi Yamaguchi ,  Jeffery L. Wang ,  Can Hua Chen

IPC: G11B5/55

CPC classification number: G11B5/4853 ,  G11B5/4846 ,  G11B5/486 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/3447 ,  H05K2201/10303 ,  Y10T29/49025

Abstract: A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.

公开(公告)号：US20090086437A1

公开(公告)日：2009-04-02

申请号：US12190624

申请日：2008-08-13

Applicant: Nobutake Tsuyuno ,  Hideto Yoshinari ,  Hiroshi Hozoji ,  Masahiko Asano ,  Masahide Harada ,  Shinya Kawakita

Inventor： Nobutake Tsuyuno ,  Hideto Yoshinari ,  Hiroshi Hozoji ,  Masahiko Asano ,  Masahide Harada ,  Shinya Kawakita

IPC: H05K5/04 ,  H05K7/20 ,  H05K13/00

CPC classification number: H05K7/20454 ,  H05K1/0203 ,  H05K1/141 ,  H05K7/20854 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/1056 ,  Y10T29/49147

Abstract: In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.

Abstract translation: 在包括至少包括线圈和电容器的两种或更多种引线插入型部件的电子控制装置中，将部件安装在具有布线，端子结构和机械固定部分的支撑件上; 上述部件的引线分别插入形成在支撑体的布线部分中的孔并与其电连接; 部件和支撑件用粘合材料固定在一起，用于固定; 部件的上表面附着在介于其间的具有低弹性模量的导热材料的金属凹槽; 支撑体的机械固定部分固定在金属凹槽上; 并且支撑件的端子结构电连接到安装至少一个控制元件的电路板。

公开(公告)号：US20090038826A1

公开(公告)日：2009-02-12

申请号：US12162740

申请日：2007-02-07

Applicant: Ki-Geon Lee

Inventor： Ki-Geon Lee

IPC: H05K7/20 ,  H05K1/11 ,  H05K1/16

CPC classification number: H05K1/0206 ,  H05K1/116 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09609 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10651

Abstract: A circuit board and a heat radiating system of the circuit board. In the circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate, the plurality of the conductive layer regions includes a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region. Accordingly, the efficient heat radiation of the circuit board can prevent the component malfunction, the lifespan reduction, the power consumption increase, and the illuminance drop.

Abstract translation: 电路板的电路板和散热系统。 在电路基板中，在绝缘基板的两面分别形成涂布有导体的多个导电层区域，在绝缘基板的两侧的绝缘区域的两侧形成的导电层区域， 多个导电层区域包括穿过绝缘基板并在内壁上涂覆有导体的多个通孔，通孔中的导体导电多个导电层区域的涂覆导体，一个 基于绝缘区域将引线引脚连接到两侧的分离的导电层区域中的一个，另一个引脚与另一个导电层区域连接。 因此，电路板的高效散热可以防止元件故障，寿命降低，功率消耗增加和照度下降。

公开(公告)号：US20080169119A1

公开(公告)日：2008-07-17

申请号：US11623484

申请日：2007-01-16

Applicant: Joseph P. Palmeri ,  Vincent P. Mulligan

Inventor： Joseph P. Palmeri ,  Vincent P. Mulligan

IPC: H05K1/02 ,  H01R43/00 ,  H01R43/02 ,  H01R13/02

CPC classification number: H05K3/225 ,  H05K1/113 ,  H05K3/0047 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2203/0191 ,  H05K2203/0242 ,  Y10T29/49174 ,  Y10T29/49179

Abstract: Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stern and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.

Abstract translation: 提供了用于修复位于印刷电路板的第一表面上并连接到通过电路板的通孔的损坏的接触垫的方法和装置。 根据该方法，在印刷电路板的第一表面中形成基本上位于通过通孔的轴的中心的位置上形成埋头孔，并且将更换结构插入到埋头孔中。 替换结构具有杆部，头部和连接船头和头部的肩部，肩部的角度基本上与埋头孔的肩部的角度相匹配。 替换结构的杆部分永久地附接到通孔的侧壁，以便将替换结构的头部部分电连接到通孔。

公开(公告)号：US20080142258A1

公开(公告)日：2008-06-19

申请号：US12010335

申请日：2008-01-24

Applicant: David V, Caletka ,  Frank D. Egitto

Inventor： David V, Caletka ,  Frank D. Egitto

IPC: H05K1/11

CPC classification number: H05K1/0219 ,  H01R12/523 ,  H01R13/2414 ,  H05K1/113 ,  H05K3/4046 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0959 ,  H05K2201/09809 ,  H05K2201/10303 ,  H05K2201/10378 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned within the openings and also extending from surface to surface (and beyond, in some embodiments), and a plurality of shielding members positioned substantially around the conductive members to provide shielding therefore during the passage of high frequency signals through the conductive members.

Abstract translation: 高速插入器，其包括具有交替取向的介电层和导电层的基板，其形成基板，从基板的一个相对表面延伸到第二相对表面的开口，定位在开口内并且还从表面延伸到表面的导电构件 并且在一些实施例中超越）以及基本上围绕导电构件定位的多个屏蔽构件，从而在高频信号通过导电构件期间提供屏蔽。

公开(公告)号：US07387516B2

公开(公告)日：2008-06-17

申请号：US11629852

申请日：2005-05-24

Applicant: Tatsuya Hayakawa ,  Tatsuya Oka

Inventor： Tatsuya Hayakawa ,  Tatsuya Oka

IPC: H01R12/00

CPC classification number: H05K7/026 ,  H01R9/2425 ,  H01R9/2466 ,  H05K1/144 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10659

Abstract: Three printed boards are stored in a case, and a relay connector for connecting the three printed boards is mounted on the second printed board at the middle position. The relay connector is provided with a first terminal storing part, which is long in a vertical direction, and a short second terminal storing part. The relay connector connects a terminal pin of the first printed board at an upper position with a terminal pin of the third printed board at a lower position, via a long first relay terminal stored in the first terminal storing part, while connecting a terminal pin of the first printed board and/or the terminal pin of the third printed board with a conductor of the second printed board, via a short second relay terminal stored in the second terminal storing part.

Abstract translation: 三个印刷电路板被存放在壳体中，并且用于连接三个印刷电路板的中继连接器安装在中间位置的第二印刷电路板上。 中继连接器设置有在垂直方向上长的第一端子存储部和短的第二端子存储部。 继电器连接器通过存储在第一端子存储部分中的长的第一中继端子将位于第一印刷电路板的上部位置的端子销与第三印刷电路板的端子引脚连接在下部位置，同时连接 通过存储在第二终端存储部分中的短的第二中继终端，具有第二印刷电路板的导体的第三印刷电路板的第一印刷电路板和/或端子销。

公开(公告)号：US20080106873A1

公开(公告)日：2008-05-08

申请号：US11936013

申请日：2007-11-06

Applicant: Hisayoshi Okuya

Inventor： Hisayoshi Okuya

IPC: H05K1/18 ,  H05K7/14

CPC classification number: H05K3/306 ,  B60T7/042 ,  G01D5/145 ,  G01D11/245 ,  G05G1/38 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10424

Abstract: According to an aspect of the present invention, a mounting structure includes a housing, an electronic component mounted at the housing, a pin-shaped terminal arranged upright at the housing, a circuit board having a mounting through-hole into which the in-shaped terminal is inserted, and a mounting support member positioned between the housing and the circuit board and fixed to the housing with the circuit board. In the mounting structure, the mounting support member includes a through-hole for positioning the pin-shaped terminal and an inclined guiding surface formed continuously with the through-hole for guiding a distal end of the pin-shaped terminal into the through-hole.

Abstract translation: 根据本发明的一个方面，一种安装结构包括壳体，安装在壳体上的电子部件，在壳体上竖立设置的销状端子，具有安装通孔的电路板， 端子插入，并且安装支撑构件定位在壳体和电路板之间并且与电路板固定到壳体。 在安装结构中，安装支撑构件包括用于定位销状端子的通孔和与通孔连续形成的倾斜导向面，用于将销状端子的远端引导到通孔中。

公开(公告)号：US20080032523A1

公开(公告)日：2008-02-07

申请号：US11563281

申请日：2006-11-27

Applicant: Ching-Chi Kuo

Inventor： Ching-Chi Kuo

IPC: H05K1/00

CPC classification number: H05K3/403 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/42 ,  H05K2201/09145 ,  H05K2201/09181 ,  H05K2201/10303 ,  H05K2203/167

Abstract: A circuit module to be mounted on a system circuit board having first contact portions is provided. The circuit module includes a printed wire board and at least an electronic component mounted on the printed wire board. The printed wire board includes a substrate and a trace pattern formed on at least a surface of the substrate. At least an edge side of the substrate has second contact portions corresponding to the first contact portions of the system circuit board and in contact with the trace pattern.

Abstract translation: 提供一种要安装在具有第一接触部分的系统电路板上的电路模块。 电路模块包括印刷线路板和安装在印刷线路板上的至少一个电子部件。 印刷线路板包括形成在基板的至少一个表面上的基板和迹线图案。 衬底的至少边缘侧具有对应于系统电路板的第一接触部分并与迹线图案接触的第二接触部分。