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    Solder-Less Electrical Assembly
    51.
    发明申请
    Solder-Less Electrical Assembly 审中-公开
    无焊接电气组件

    公开(公告)号：US20130329407A1

    公开(公告)日：2013-12-12

    申请号：US13646489

    申请日：2012-10-05

    Applicant: Carmen Rapisarda

    Inventor： Carmen Rapisarda

    IPC: H05K5/00 ,  F21L4/02

    CPC classification number: F21V23/06 ,  F21Y2115/10 ,  H01M2/1044 ,  H01M2/20 ,  H01M2220/30 ,  H01R4/2404 ,  H01R4/26 ,  H01R12/592 ,  H01R12/79 ,  H01R13/41 ,  H01R13/506 ,  H01R13/665 ,  H01R25/003 ,  H05K1/184 ,  H05K3/325 ,  H05K5/0026 ,  H05K5/0091 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2201/10393 ,  H05K2203/0173

    Abstract: A PCB assembly can be attached to hold one or more such assemblies. A resilient PCB housing holds a PCB by an interference fit while conductive wires are inserted into its wire cavity so that exposed portions of conductive wires make electrical contact with electrical traces of the PCB which is biased b wire insulation. Two conductors can be held by the PCB housing which are forced into electrical contact with the PCB when it is inserted into the resilient PCB housing which then biases such contacts. A switch can also be held b a switch interference fit with the resilient PCB housing such that its leads are biased against the PCB by the resilient PCB housing.

    Abstract translation: 可以连接PCB组件以保持一个或多个这样的组件。 弹性PCB外壳通过过盈配合来保持PCB，同时将导线插入其导线腔中，使得导线的暴露部分与PCB的电迹线电气接触，该电迹线偏置b线绝缘。 两个导线可以被PCB外壳固定，当PCB插入到弹性PCB外壳中时，PCB外壳将被强制与PCB电接触，然后偏置这些触点。 开关也可以被保持为与弹性PCB壳体配合的开关，使得其引线通过弹性PCB壳体偏压抵靠PCB。

    Illumination devices and methods for making the same
    53.
    发明授权
    Illumination devices and methods for making the same 有权
    照明装置及其制作方法

    公开(公告)号：US08525402B2

    公开(公告)日：2013-09-03

    申请号：US11756971

    申请日：2007-06-01

    Applicant: Ellen O. Aeling ,  John R. David ,  Michael A. Meis ,  Ronald S. Steelman

    Inventor： Ellen O. Aeling ,  John R. David ,  Michael A. Meis ,  Ronald S. Steelman

    IPC: H01R33/00 ,  F21S4/00 ,  F21V21/002

    CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21K9/60 ,  F21K9/68 ,  F21K9/90 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/60 ,  H05K1/0287 ,  H05K1/11 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/063 ,  Y10T156/10

    Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

    Abstract translation: 本公开一般涉及照明装置及其制造方法。 该器件特别地包括第一导体层，第一绝缘体层，设置在第一导体层上并且具有通过第一绝缘体层限定在其中的至少一个第一孔;第二导体层，设置在第一绝缘体层上并具有 通过所述第二导体层限定的至少一个第二孔，并且定位成与所述至少一个第一孔对准，以及光操纵层，其设置在所述第二导体层上并且具有通过所述光操纵层限定在其中的至少一对孔，包括 第三孔和第四孔，其中所述第三孔被定位成与所述至少一个第二孔和第一孔对准。

    PRINTED CIRCUIT BOARD
    55.
    发明申请
    PRINTED CIRCUIT BOARD 有权
    印刷电路板

    公开(公告)号：US20120111623A1

    公开(公告)日：2012-05-10

    申请号：US13351108

    申请日：2012-01-16

    Applicant: Nan-Jang CHEN ,  Hong-Chin LIN

    Inventor： Nan-Jang CHEN ,  Hong-Chin LIN

    IPC: H05K1/16 ,  H05K1/11

    CPC classification number: H05K1/0216 ,  H01L2924/0002 ,  H05K3/222 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

    Abstract: A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.

    Abstract translation: 公开了印刷电路板。 印刷电路板包括具有顶表面和底表面的基底。 地平面位于底面。 信号迹线沿着第一方向在顶表面上。 至少两个隔离的电源平面分别位于与信号迹线的相对侧相邻的顶表面上。 沿着第二方向的导电连接在信号迹线上耦合到两个电源层，而不与电信号迹线电连接，其中信号迹线不经过接地层的任何分裂。

    Surface mount device jumper and surface mount device jumper assembly
    56.
    发明授权
    Surface mount device jumper and surface mount device jumper assembly 失效
    表面贴装器件跳线和表面贴装器件跳线组件

    公开(公告)号：US08087953B2

    公开(公告)日：2012-01-03

    申请号：US12078496

    申请日：2008-04-01

    Applicant: Yoshinari Matsuda ,  Rogelio Ruiz

    Inventor： Yoshinari Matsuda ,  Rogelio Ruiz

    IPC: H01R31/08 ,  H05K7/06

    CPC classification number: H05K3/222 ,  H05K3/3442 ,  H05K2201/10363

    Abstract: A surface mount device jumper includes a base member and an electrode member. The base member is fabricated from a resin laminate. The electrode member is fabricated from an electrically-conductive material and is formed in a generally C-shaped configuration to define an opening therethrough. The opening is sized to receive the base member such that the electrode member partially wraps around and clamps to the base member to retain the base member in the opening.

    Abstract translation: 表面安装器件跳线包括基底部件和电极部件。 基体由树脂层压制成。 电极构件由导电材料制成，并且形成为大致C形构造以限定穿过其中的开口。 开口的尺寸被设计成接收基部构件，使得电极构件部分地卷绕并夹持到基部构件以将基部构件保持在开口中。

    Electronic component and circuit board
    57.
    发明授权
    Electronic component and circuit board 有权
    电子元器件和电路板

    公开(公告)号：US08077477B2

    公开(公告)日：2011-12-13

    申请号：US12333524

    申请日：2008-12-12

    Applicant: Takatoshi Ueyama ,  Toshiyuki Kajimura

    Inventor： Takatoshi Ueyama ,  Toshiyuki Kajimura

    IPC: H05K7/00

    CPC classification number: H05K1/0243 ,  H05K1/0219 ,  H05K1/023 ,  H05K3/222 ,  H05K2201/09236 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10363 ,  H05K2201/10689 ,  H05K2201/10969

    Abstract: An electronic component, including: a first terminal group including a plurality of functional terminals provided along a first side of the electronic component; a second terminal group including a plurality of functional terminals provided along a second side of the electronic component opposing the first side; and an element that is connected to at least one of the functional terminals of the first terminal group and to at least one of the functional terminals of the second terminal group. The first terminal group includes a first dummy terminal in at least one space between the functional terminals of the first terminal group; the second terminal group includes a second dummy terminal in at least one space between the functional terminals of the second terminal group; and the first and second dummy terminals are not connected to any element inside the electronic component.

    Abstract translation: 一种电子部件，包括：第一端子组，包括沿着所述电子部件的第一侧设置的多个功能端子; 第二端子组，包括沿着与第一侧相对的电子部件的第二侧设置的多个功能端子; 以及与第一端子组的至少一个功能端子和第二端子组的至少一个功能端子连接的元件。 第一端子组包括在第一端子组的功能端子之间的至少一个空间中的第一虚拟端子; 第二终端组包括在第二终端组的功能终端之间的至少一个空间中的第二虚拟终端; 并且第一和第二虚拟端子不连接到电子部件内部的任何元件。

    FLEXIBLE PRINTED WIRING BOARD
    59.
    发明申请
    FLEXIBLE PRINTED WIRING BOARD 有权
    柔性印刷接线板

    公开(公告)号：US20100116525A1

    公开(公告)日：2010-05-13

    申请号：US12526917

    申请日：2008-02-15

    Applicant: Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

    Inventor： Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

    IPC: H05K1/02

    CPC classification number: H05K3/4685 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0394 ,  H05K2201/10363 ,  H05K2203/1581

    Abstract: A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings which the through holes open.

    Abstract translation: 柔性印刷电路板包括基板，导体布线，覆盖膜，跳线布线和通孔。 导体布线设置在基板的第一表面上。 覆盖膜覆盖导体布线的至少一部分。 跳线将导体布线彼此电连接。 通孔形成在基板中并分别向导体配线的表面开口。 跳线布线由导电膏的硬化材料构成，并且形成为使得基板的第二表面与通孔打开的导体布线的各个表面连续。

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